Article : [ART494]

Info : REPONSE 278, le 29/03/2004.

Titre : A new approach for thermal fatigue testing of the underfill/passivation interface.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.

Source : Application of Fracture Mechanics in Electronic Packaging. 1997 ASME International Mechanical Engineering Congress and Exposition
Editor(s): Chen, W.I.; Read, D.T.
New York, NY, USA: ASME, 1997. p.41-7 of vi+193 pp. 13 refs.
Conference: Dallas, TX, USA, 16-21 Nov 1997
Sponsor(s): ASME
ISBN: 0-7918-1827-6
Document_Type : Conference Article
Treatment_Code : New Development; Practical; Theoretical; Experimental
Info : Country of Publication : United States
Language : English
Stockage :
Switches :
Power :
Software :

Abstract :
Delamination of the underfill/passivation interface due to thermal fatigue is a major cause for failure of DCA assemblies. Hence, we have developed a new technique based on a noncontact fiber optic displacement sensor to investigate the crack growth rate per cycle da/dN of an interfacial crack under thermal fatigue conditions. The sample is prepared as a multilayered cantilever beam by capillary flow of the underfill over a polyimide coated metallic beam. During thermal cycling, the crack growth along the interface from the free end changes the displacement of this end of the beam and we measure this displacement at the lowest temperature in each thermal cycle. The change in beam displacement is converted into crack growth, knowing the geometry of the specimen. The crack growth rate depends on the maximum difference in the strain energy release rate of the crack in each cycle. This paper outlines the theoretical basis of the technique and provides initial results obtained for a commercial underfill dispensed over a commercial (PMDA/ODA) polyimide. The technique was validated by comparing the crack growth measured by displacement changes with direct optical microscopy measurements of the crack length.

Accession_Number : 2000:6511883 INSPEC

Mise à jour le lundi 10 avril 2023 à 18 h 47 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.

Copyright 2023 :

Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.