Article : [ART492]
Info : REPONSE 522, le 29/03/2004.
Titre : Reliability stress test of commercial product.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.Auteur : Hough, D.L. (IBM Corp, Research Triangle Park, NC, USA)
Meeting : Proceedings of the 36th Annual Technical Meeting of the Institute of Environmental Sciences.
Location : New Orleans, LA, USA
Date : 23 Apr 1990-27 Apr 1990
Source : Proceedings, Annual Technical Meeting - Institute of Environmental Sciences.Publ by Inst of Environmental Sciences, Mount Prospect, IL, USA.p 770-772
CODEN : IESPAF
ISSN : 0073-9227
ISBN: 1-877862-00-2
Année : 1990
Meeting_Number : 16762
Document_Type : Conference Article
Treatment_Code : Experimental
Language : English
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Abstract :
Reliability stress testing has been an ongoing process at IBM, Research Triangle Park, NC, and the entire IBM Corporation, for several years.A paper was presented at the 32nd Annual Technical Meeting in 1986,(``Experiences in Reliability Stress Testing of Commercial Hardware''), relating the results of one of the first thermal cycle reliability stress tests of commercial hardware in IBM.As a result of the success of these early tests, facilities with additional capabilities have been added.This paper presents the results of a current test performed at the IBM, Research Triangle Park, NC, facility utilizing the improved stress test facilities.Presented in this paper are the test description, test results, field data, and the methodology of migration from one stress level to another.(Edited author abstract) 2 Refs.
Accession_Number : 1993(4):52182 COMPENDEX
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