"Predicting solder joint reliability, model validation.

"Predicting solder joint reliability, model validation. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART491]

Info : REPONSE 507, le 29/03/2004.

Titre : Predicting solder joint reliability, model validation.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans : [CONF038] ECTC, Electronic Components and Technology Conference et IEEE Electronic Components and Technology, mars 2004.

Auteur : Iannuzzelli, Ray (Digital Equipment Corp, USA)

Meeting : 1993 Proceedings of the 43rd Electronic Components and Technology Conference.
Location : Orlando, FL, USA
Date : 01 Jun 1993-04 Jun 1993

Source : Proceedings - Electronic Components and Technology Conference 1993. Publ by IEEE, IEEE Service Center, Piscataway, NJ, USA.p 839-851
CODEN : PECCA7
ISSN : 0569-5503
ISBN: 0-7803-0794-1
Année : 1993
Meeting_Number : 18894
Document_Type : Conference Article
Treatment_Code : Experimental; Theoretical
Language : English
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Abstract :
A reliability predictive technique is presented using a commercially available finite element code and previously developed material properties for eutectic tin-lead solder.The predictive model is validated for three types of surface mount solder joints, i.e.50 mil gull, 25 mil gull, and 50 mil butt leaded joints and also a 100 mil intrusive leaded joint using a combination of crack length and "Mechanical Strength Degradation" which is a metric developed at Digital.An accelerated thermal cycle is used to expedite the qualification and validation process.This technique can also be applied to leadless (bump) SMT joints.(Author abstract)

Accession_Number : 1993(48):2975 COMPENDEX

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