A. SYED, M. DOTY, "Are we over designing for solder joint reliability? Field vs. accelerated conditions, realistic vs.specified requirements", 49th Electronic Components and Technology Conference (ECTC), 1-4 June 1999, pp. 111-117.

A. SYED, M. DOTY, "Are we over designing for solder joint reliability? Field vs. accelerated conditions, realistic vs.specified requirements", 49th Electronic Components and Technology Conference (ECTC), 1-4 June 1999, pp. 111-117. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART490]

Info : REPONSE 275, le 29/03/2004.

Titre : A. SYED, M. DOTY, Are we over designing for solder joint reliability? Field vs. accelerated conditions, realistic vs.specified requirements, 49th Electronic Components and Technology Conference (ECTC), 1-4 June 1999, pp. 111-117.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans : [CONF038] ECTC, Electronic Components and Technology Conference et IEEE Electronic Components and Technology, mars 2004.

Auteur : Syed, Ahmer (Amkor Technologies, Chandler, AZ, USA)
Auteur : Doty, Matthew

Meeting : Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC).

Info : organization : IEEE; Electronic Industries Alliance
Location : San Diego, CA, USA
Date : 01 Jun 1999-04 Jun 1999

Source : Proceedings - Electronic Components and Technology Conference 1999.
Pages : 111 - 117
CODEN : PECCA7
ISSN : 0569-5503
Année : 1999
Meeting_Number : 55368
Document_Type : Journal
Treatment_Code : Application; Theoretical
Language : English
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Abstract :
The recent trend towards miniaturization is requiring engineers to look for packages which are near chip size and have finer pitch I/Os with small solder joints. Although the reliability of solder joints may not meet the field life requirements in some the engineer may have to select a package that is not optimum for electrical and thermal performance, may not meet size and density requirements, or does not meet price targets. Faced with such a situation, an engineer is forced to ask whether the reliability requirements are realistic and if the system is being over designed to meet those requirements? This paper seeks to answer these questions. An industry survey of reliability requirements for various applications is presented, showing inconsistencies within industry groups.Various thermal cycle field conditions are discussed and a validated life prediction approach is used to determine the acceleration factors from field to accelerated test conditions. A comparison is made between realistic and specified reliability requirements for various applications to determine if the systems are being over designed. Acceleration factors for different test conditions are also presented to help sort out the published data on solder joint reliability.(Author abstract)

Références : 9 Refs.

Accession_Number : 1999(47):3233 COMPENDEX

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