Article : [ART264]
Titre : M.P. RODRIGUEZ, N.Y.A. SHAMMAS, A.T. PLUMPTON, D. NEWCOMBE, D.E. CREES, Static and dynamic finite element modelling of thermal fatigue effects in insulated gate bipolar transistor modules, Microelectronics Reliability, Volume 40, Issues 3, 17 March 2000, pp. 455-463.
Cité dans :[REVUE166] Elsevier Science, Microelectronics Reliability, Volume 40, Issue 3, Pages 365-546, 17 March 2000. Cité dans :[ART227]Auteur : M. P. Rodriguez
Vers : Bibliographie
Lien : ART227.HTM#BIbliographie - référence [22].
Adresse : (a) Staffordshire University, School of Engineering and Advanced Technology, P.O. Box 333, Beaconside, Stafford ST18 ODF, UK
Adresse : (b) MITEL Semiconductors Ltd, Power division, Doddington Road, Lincoln LN6 3LF, UK
Adresse :
Tel. : +44-01785-353474
Fax. : +44-01785-353552
Lien : mailto:n.y.a.shammas@staffs.ac.uk
Source : Microelectronics Reliability
Volume : 40
Issues : 3
Date : 17 March 2000
Pages : 455 - 463
DOI :
PII : S0026-2714(99)00250-4
Lien : private/RODRIGUEZ2.pdf - 1090 Ko, 9 pages.
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Abstract :
The aim of this paper is to demonstrate the use of finite element techniques for
modelling thermal fatigue effects in solder layers of insulated gate bipolar
transistor (IGBT) ¯ modules used in traction applications. The three-dimensional
models presented predict how progressive solder fatigue, affects the static and
dynamic thermal performance of such devices.
Specifically, in this paper, the analysis of an 800 A¯1800 V IGBT module is
performed. In the first part, the static analysis is realised. The parameters
assessed are thermal resistance, maximum junction temperature and heat flux
distribution through the different layers comprising the module construction. In
the second part of the paper, transient analyses are performed in order to study
the dynamic thermal behaviour of the module. The constructed thermal impedance
curves allow for calculation of the device temperature variations with time.
Stress parameters, such as temperature excursion and maximal temperature at chip
and solder interfaces, are determined. Calibration of all simulation models is
achieved by comparison with alternative theoretical calculations and
manufacturers' measured values provided in the data sheet book.
Article Outline
1. Introduction
2. Need for thermal modelling of high power modules
3. Simulation model description
4. Static analysis
4.1. Loading conditions
4.2. Results and discussion
4.3. Calibration of the simulation model of fatigue effects
5. Dynamic analysis
6. Conclusions
Acknowledgements
Bibliographie |
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