Yaskawa
 Topics of Interests
  • Discrete Power Semiconductor Devices
    » Gehan Amarataunga, Cambridge University, UK
  • Gate Drive Units
    » Mark Johnson, University of Sheffield, UK
  • Voltage Source Inverters (VSI)
    » Hendrik Toit du Mouton, University of Stellenbosch, South Africa
  • Current Source Inverters (CSI)
  • Cyclo and Matrix Converters
    » Pat Wheeler, University of Nottingham, UK
  • Resonant Converters
  • Recitifiers and DC-DC Converters
    » José A. Cobos, Universidad Politécnica de Madrid, Spain
  • Power Supplies and Customer Applications
  • EMC / Power Quality / PFC
    » Peter Barbosa, ABB Corporate Research, Switzerland
    » Ivan Hofsajer, Rand Afrikaans University, South Africa
  • UPS Systems and Alternative / Regenerative Energy
    » Ronnie Belmans, KU Leuven, Belgium
    » Johan Driesen, KU Leuven, Belgium
  • Inverter Control (incl. PWM), Drives and Motion Control
    » José Rodriguez, University of Santa Maria, Chile
  • Transportation
    » Mark Bakran, SIEMENS, Germany
  • Automotive Applications
    » Andrea Vezzini, GM Advanced Technology Centre, Switzerland
    » Francesco Profumo, Politecnico di Torino, Italy
  • Aerospace Power Applications
  • Medium-Voltage Converters and Applications
    » Steffen Bernet, Technical University of Berlin, Germany
  • Prototyping and Real-Time Systems
  • Diagnostics and Reliability, Fail-Safe and Fault-Tolerant Applications
    » Mario Pacas, University of Siegen, Germany
    » Gerard-Andre Capolino, University of Picardie, France
  • Device Packaging, Assembly Concepts and Integration (organized by CIPS)
    » U. Scheumann, Semikron, Germany
  • Packaging and Thermal Management (organized by CIPS)
    » Lindemann, IXYS, Germany
    » Abraham Ferreira, Technical University of Delft, Netherlands
  • New Materials and Components for Hybrid Integration (organized by CIPS)
    » R. Sittig, Technical University of Braunschweig
    » Mr. O'Mathuna
  • Intelligent Integrated Drivers (organized by CIPS)
    » Martin. Maerz, FhG, Germany
  • Systems on Chip (organized by CIPS)
    » Prof. Stoisiek, University of Erlangen, Germany
  • Integrated Sensors (organized by CIPS)
    » Prof. Stoisiek, University of Erlangen, Germany
  • Mechatronics - Integration of Power Electronics and Actuators (organized by CIPS)
    » Andreas Binder, Technical University of Darmstadt, Germany
    » Mr. Perrault, MIT
  • Design for Reliability - Virtual Qualification (organized by CIPS)
    » Norbert Seliger, Siemens, Germany
    » Mr. McCluskey
  • Design Methods and Tools (organized by CIPS)
    » Prof. Wachutka, Technical University of Munich, Germany
    » Dushan Boroyevich, Virginiatech, Blacksburgh, USA
  • Life Cycle Costs (LCC) - Cost Analysis, Maintenance, Repair, Recycling, etc. (organized by CIPS)
    » Leo Lorenz, Infineon, Germany
 Program
Available: 2004
IEEE PELS.org