Revue : [REVUE433]

Titre : Elsevier Science, Microelectronics Reliability, Volume 43, Issue 7, Pages 985-1172, July 2003.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 43
Issue : 7
Pages : 985 - 1172
Date : July 2003

[1] : On-chip electrostatic discharge ESD, Pages 985-986
Horst A. Gieser
Lien : vide.pdf - | Full Text + Links | PDF (34 K)

[2] : New considerations for MOSFET power clamps, Pages 987-991
Steven S. Poon and Timothy J. Maloney
Lien : vide.pdf - | Full Text + Links | PDF (112 K)

[3] : High holding current SCRs (HHI-SCR) for ESD protection and latch-up immune
IC operation, Pages 993-1000
Markus P. J. Mergens, Christian C. Russ, Koen G. Verhaege, John Armer,
Phillip C. Jozwiak and Russ Mohn
Lien : vide.pdf - | Full Text + Links | PDF (575 K)

[4] : Harnessing the base-pushout effect for ESD protection in bipolar and
BiCMOS technologies, Pages 1001-1010
M. Streibl, K. Esmark, A. Sieck, W. Stadler, M. Wendel, J. Szatkowski and
H. Goßner
Lien : vide.pdf - | Full Text + Links | PDF (765 K)

[5] : High frequency characterization and modelling of the parasitic RC
performance of two terminal ESD CMOS protection devices, Pages 1011-1020
V. Vassilev, S. Jenei, G. Groeseneken, R. Venegas, S. Thijs, V. De Heyn,
M. Natarajan, M. Steyaert and H. E. Maes
Lien : vide.pdf - | Full Text + Links | PDF (524 K)

[6] : Simulator-independent compact modeling of vertical npn transistors for ESD
and RF circuit simulation, Pages 1021-1027
Sopan Joshi and Elyse Rosenbaum
Lien : vide.pdf - | Full Text + Links | PDF (175 K)

[7] : Process influence on product CDM ESD performance, Pages 1029-1037
Boris Lisenker
Lien : vide.pdf - | Full Text + Links | PDF (582 K)

[8] : Microanalysis and electromigration reliability performance of high current
transmission line pulse (TLP) stressed copper interconnects, Pages
1039-1045
Sherry Suat Cheng Khoo, Pee Ya Tan and Steven H. Voldman
Lien : vide.pdf - | Full Text + Links | PDF (224 K)

[9] : MEMS reliability, Pages 1047-1048
Ingrid De Wolf
Lien : vide.pdf - | Full Text + Links | PDF (45 K)

[10] : MEMS reliability from a failure mechanisms perspective, Pages 1049-1060
W. Merlijn van Spengen
Lien : vide.pdf - | PDF (478 K)

[11] : The advent of MEMS in space, Pages 1061-1083
X. Lafontan, F. Pressecq, F. Beaudoin, S. Rigo, M. Dardalhon, J. -L. Roux,
P. Schmitt, J. Kuchenbecker, B. Baradat, D. Lellouchi et al.
Lien : vide.pdf - | Full Text + Links | PDF (1302 K)

[12] : Reliability aspects of microsensors and micromechatronic actuators for
automotive applications, Pages 1085-1097
Roland Müller-Fiedler and Volker Knoblauch
Lien : vide.pdf - | Full Text + Links | PDF (566 K)

[13] : Advanced X-ray analysis techniques to investigate aging of micromachined
silicon actuators for space application, Pages 1099-1103
A. Dommann, A. Enzler and N. Onda
Lien : vide.pdf - | Full Text + Links | PDF (212 K)

[14] : A new methodology for the characterization of fracture toughness of filled
epoxy films involved in microelectronics packages, Pages 1105-1115
X. Q. Shi, Z. P. Wang and J. P. Pickering
Lien : vide.pdf - | Full Text + Links | PDF (511 K)

[15] : Board level solder joint reliability modeling and testing of TFBGA
packages for telecommunication applications, Pages 1117-1123
Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton and Zhaowei Zhong
Lien : vide.pdf - | Full Text + Links | PDF (283 K)

[16] : Three-dimensional FEM simulations of thermomechanical stresses in 1.55 m
Laser modules, Pages 1125-1136
Y. Deshayes, L. Bechou, J. Y. Deletage, F. Verdier, Y. Danto, D. Laffitte
and J. L. Goudard
Lien : vide.pdf - | Full Text + Links | PDF (617 K)

[17] : Reliability estimation of BGA and CSP assemblies using degradation law
model and technological parameters deviations, Pages 1137-1144
J. -Y. Delétage, F. J. -M. Verdier, B. Plano, Y. Deshayes, L. Bechou and
Y. Danto
Lien : vide.pdf - | Full Text + Links | PDF (380 K)

[18] : 2D-simulation and analysis of lateral SiC N-emitter SiGe P-base Schottky
metal-collector (NPM) HBT on SOI, Pages 1145-1149
M. Jagadesh Kumar and C. Linga Reddy
Lien : vide.pdf - | Full Text + Links | PDF (239 K)

[19] : Effects of electron and gamma-ray irradiation on CMOS analog image
sensors, Pages 1151-1155
Xiang-Ti Meng, Ai-Guo Kang, Ji-Hong Li, Hai-Yun Zhang, Shi-jie Yu and
Zheng You
Lien : vide.pdf - | Full Text + Links | PDF (186 K)

[20] : Decreasing variation in paste printing using statistical process control,
Pages : 1157-1161
Timo Liukkonen and Aulis Tuominen
Lien : vide.pdf - | Full Text + Links | PDF (211 K)

[21] : ILP method for memory mapping in high-level synthesis, Pages 1163-1167
Haifeng Zhou, Zhenghui Lin and Wei Cao
Lien : vide.pdf - | Full Text + Links | PDF (87 K)

[22] : Erratum to "A simple and fundamental design rule for resisting
delamination in bimaterial structures" [Microelectronics Reliability
2003;43:487–494], Page 1169
Thomas D. Moore and John L. Jarvis
Lien : vide.pdf - | Full Text + Links | PDF (31 K)

[23] : Rohit Kapur, CTL for Test Information of Digital ICs Hardcover. Kluwer
Academic Publisher, Boston, 2003. pp. 173, plus XI, 164 Euro ISBN
1-4020-7293-7, Pages 1171-1172
Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (37 K)

[24] : Calendar of forthcoming events, Pages I-VII
PDF (37 K)

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