Revue : [REVUE432]

Titre : Elsevier Science, Microelectronics Reliability, Volume 43, Issue 6, Pages 821-984, June 2003.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 43
Issue : 6
Pages : 821 - 984
Date : June 2003

[1] : , Page 821
Wallace T. AndersonRoberto Menozzi
Lien : vide.pdf - | Full Text + Links | PDF (32 K)

[2] : Hot electron induced degradation of undoped AlGaN/GaN HFETs, Pages 823-827
Hyungtak Kim, Alexei Vertiatchikh, Richard M. Thompson, Vinayak Tilak,
Thomas R. Prunty, James R. Shealy and Lester F. Eastman
Lien : vide.pdf - | Full Text + Links | PDF (179 K)

[3] : High reliability in PHEMT MMICs with dual-etch-stop AlAs layers for
high-speed RF switch applications, Pages 829-837
Frank Gao
Lien : vide.pdf - | Full Text + Links | PDF (562 K)

[4] : Investigation of short-term current gain stability of GaInP/GaAs-HBTs
grown by MOVPE, Pages 839-844
F. Brunner, A. Braun, P. Kurpas, J. Schneider, J. Würfl and M. Weyers
Lien : vide.pdf - | Full Text + Links | PDF (186 K)

[5] : Reliability of 100 nm silicon nitride capacitors in an InP HEMT MMIC
process, Pages 845-851
William J. Rowe, Bruce M. Paine, Adele E. Schmitz, Robert H. Walden and
Michael J. Delaney
Lien : vide.pdf - | Full Text + Links | PDF (177 K)

[6] : The effects of ternary alloys on thermal resistances of HBTs, HEMTs, and
laser diodes, Pages 853-858
Bruce M. Paine, Ami P. Shah and Thomas Rust, III
Lien : vide.pdf - | Full Text + Links | PDF (116 K)

[7] : Accelerated life test calculations using the method of maximum likelihood:
an improvement over least squares, Pages 859-864
Charles S. Whitman
Lien : vide.pdf - | Full Text + Links | PDF (120 K)

[8] : Thin dielectric reliability assessment for DRAM technology with deep
trench storage node, Pages 865-878
R. -P. Vollertsen
Lien : vide.pdf - | Full Text + Links | PDF (391 K)

[9] : Wafer level packaging having bump-on-polymer structure, Pages 879-894
John J. H. Reche and Deok-Hoon Kim
Lien : vide.pdf - | Full Text + Links | PDF (655 K)

[10] : Room temperature plasma oxidation mechanism to obtain ultrathin silicon
oxide and titanium oxide layers, Pages 895-903
J. C. Tinoco, M. Estrada and G. Romero
Lien : vide.pdf - | Full Text + Links | PDF (251 K)

[11] : High-voltage pulse stressing of thick-film resistors and noise, Pages
905-911
I. Stanimirovi, M. M. Jevti and Z. Stanimirovi
Lien : vide.pdf - | Full Text + Links | PDF (219 K)

[12] : Direct gold and copper wires bonding on copper, Pages 913-923
Hong Meng Ho, Wai Lam, Serguei Stoukatch, Petar Ratchev, Charles J. Vath,
III and Eric Beyne
Lien : vide.pdf - | Full Text + Links | PDF (697 K)

[13] : Solder joint reliability of TFBGA assemblies with fresh and reworked
solder balls, Pages 925-934
Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu and S. C. Hung
Lien : vide.pdf - | Full Text + Links | PDF (285 K)

[14] : Numerical study on the bonding tool position, tip profile and planarity
angle influences on TAB/ILB interconnection reliability, Pages 935-943
D. S. Liu, Y. C. Chao, C. H. Lin, G. S. Shen and H. S. Liu
Lien : vide.pdf - | Full Text + Links | PDF (452 K)

[15] : Improvement of integrated circuit testing reliability by using the defect
based approach, Pages 945-953
Dominik Kasprowicz and Witold A. Pleskacz
Lien : vide.pdf - | Full Text + Links | PDF (244 K)

[16] : Novel high performance CMOS current conveyor, Pages 955-961
Belén Calvo, Santiago Celma, Pedro A. Martínez and M. Teresa Sanz
Lien : vide.pdf - | Full Text + Links | PDF (193 K)

[17] : Manufacturing capability control for multiple power-distribution switch
processes based on modified Cpk MPPAC, Pages 963-975
W. L. Pearn and Ming-Hung Shu
Lien : vide.pdf - | Full Text + Links | PDF (207 K)

[18] : Degradation of InGaN blue light-emitting diodes under continuous and
low-speed pulse operations, Pages 977-980
Takeshi Yanagisawa and Takeshi Kojima
Lien : vide.pdf - | Full Text + Links | PDF (109 K)

[19] : The radiation sensitivity mapping of ICs using an IR pulsed laser system,
Pages : 981-984
B. Alpat, R. Battiston, M. Bizzarri, D. Caraffini, E. Fiori, A. Papi, M.
Petasecca and A. Pontetti
Lien : vide.pdf - | PDF (223 K)

[20] : Calendar of forthcoming events, Pages I-VIII
PDF (37 K)

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