Revue : [REVUE338]

Titre : Elsevier Science, Microelectronics Reliability, Volume 37, Issue 8, Pages 1161-1291 (August 1997.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 37, Issue 8,
Pages : 1161-1291 (August 1997)
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[1] : Fuzzy logic based network reliability evaluation, Pages 1161-1164
J. Nahman
Lien : vide.pdf - | Journal Format-PDF (207 K)

[2] : Bayesian inference for partially accelerated life tests using Gibbs
sampling, Pages 1165-1168
Mohamed T. Madi
Lien : vide.pdf - | Journal Format-PDF (189 K)

[3] : New approximation for parameters of normal distribution using type
II-censored sampling, Pages 1169-1171
A. M. Sultan
Lien : vide.pdf - | Journal Format-PDF (141 K)

[4] : Suggested procedure for preventive maintenance policy, Pages 1173-1177
M. A. El-Damcese
Lien : vide.pdf - | Journal Format-PDF (268 K)

[5] : Reliability models of a class of self-healing rings, Pages 1179-1183
John Lee
Lien : vide.pdf - | Journal Format-PDF (239 K)

[6] : Reliability design of current stress in LSI interconnects using the
estimation of failure rate due to electromigration, Pages 1185-1191
Kazunori Hiraoka and Tadanobu Nikaido
Lien : vide.pdf - | Journal Format-PDF (416 K)

[7] : A fault-tolerant communications switch prototype, Pages 1193-1196
Peter K. K. Loh and Abdul Wahab
Lien : vide.pdf - | Journal Format-PDF (250 K)

[8] : An inventory control model with gamma distribution, Pages 1197-1201
Quey-Jen Yeh, T. -P. Chang and H. -C. Chang
Lien : vide.pdf - | Journal Format-PDF (230 K)

[9] : Reliability approximation of a Markov Queueing system with server
breakdown and repair, Pages 1203-1212
Quan-Lin Li, De-Ju Xu and Cao Jinhua
Lien : vide.pdf - | Journal Format-PDF (391 K)

[10] : Bootstrap prediction intervals for the Birnbaum-Saunders distribution,
Pages : 1213-1216
Ming-Che Lu and Shang Chang Dong
Lien : vide.pdf - | Journal Format-PDF (212 K)

[11] : Bounds for reliability of k-within connected-(r, s)-out-of-(m, n) failure
systems, Pages 1217-1224
F. S. Makri and Z. M. Psillakis
Lien : vide.pdf - | Journal Format-PDF (367 K)

[12] : Reliability analysis of a MX11, MX22/G1, G2/1 queueing system with a
repairable service station, Pages 1225-1231
Yue Dequan and Cao Jinhua
Lien : vide.pdf - | Journal Format-PDF (293 K)

[13] : On a two-dissimilar-unit system with three modes and random check, Pages
1233-1238
Baohe Su
Lien : vide.pdf - | Journal Format-PDF (196 K)

[14] : Estimation of the degradation of InGaN/AlGaN blue light-emitting diodes,
Pages : 1239-1241
Takeshi Yanagisawa
Lien : vide.pdf - | Journal Format-PDF (181 K)

[15] : Marked graphs and Hamiltonian graphs, Pages 1243-1250
K. Thirusangu and K. Rangarajan
Lien : vide.pdf - | Journal Format-PDF (404 K)

[16] : Reliability and availability analysis of two-unit warm standby
microcomputer systems with self-reset function and repair facility, Pages
1251-1253
Zhi-Bin Tan
Lien : vide.pdf - | Journal Format-PDF (158 K)

[17] : Reliability of a two-way circular consecutively connected system with
multistate components, Pages 1255-1258
Jacek Malinowski and Wolfgang Preuss
Lien : vide.pdf - | Journal Format-PDF (203 K)

[18] : Three-phase queueing servicing system with renewable servers, Pages
1259-1266
S. A. Metwally
Lien : vide.pdf - | Journal Format-PDF (313 K)

[19] : Fault location in multi-modular redundant systems, Pages 1267-1269
A. Noore
Lien : vide.pdf - | Journal Format-PDF (166 K)

[20] : Analysis of a two-unit system with connecting and disconnecting effect,
Pages : 1271-1274
C. K. Goel, S. Narmada and Mendus Jacob
Lien : vide.pdf - | Journal Format-PDF (130 K)

[21] : Developing reliable software., Page 1275
Samuel Keene, Christopher Lane and Joy Kimm
Lien : vide.pdf - | Journal Format-PDF (72 K)

[22] : Electromigration: the time bomb in deep-submicron ICs., Page 1275
Ping-Chung Li and Tak K. Young
Lien : vide.pdf - | Journal Format-PDF (72 K)

[23] : C-V characterization of MOS capacitors in SOI structures., Pages 1275-1276
S. G. Rustagi, Z. O. Mohsen, S. Chandra and A. Chand
Lien : vide.pdf - | Journal Format-PDF (169 K)

[24] : Reinforcing effect of coverlayers on the fatigue life of copper-kapton
flex cables., Page 1276
Alan T. Zehnder and Anthony R. Ingraffea
Lien : vide.pdf - | Journal Format-PDF (97 K)

[25] : Application of direct strain measurement to fatigue studies in surface
solder joints., Page 1276
Yan C. Chan, D. J. Xie, J. K. L. Lai and I. K. Hui
Lien : vide.pdf - | Journal Format-PDF (97 K)

[26] : Prediction of equilibrium shapes and pedestal heights of solder joints for
leadless chip components., Page 1276
Vivek Jairazbhoy
Lien : vide.pdf - | Journal Format-PDF (97 K)

[27] : Dielectric breakdown I: a review of oxide breakdown., Page 1276
J. F. Verweij and J. H. Klootwijk
Lien : vide.pdf - | Journal Format-PDF (97 K)

[28] : Sheet resistance and layout effects in accelerated tests for dielectric
reliability evaluation., Page 1276
F. Pio
Lien : vide.pdf - | Journal Format-PDF (97 K)

[29] : Fatigue life studies on defect-free solder joints fabricated from modified
reflow soldering., Pages 1276-1277
D. J. Xie, Yan C. Chan, J. K. L. Lai and I. K. Hui
Lien : vide.pdf - | Journal Format-PDF (192 K)

[30] : Dielectric breakdown II: related projects at the University of Twente.,
Page 1277
J. H. Klootwijk, J. F. Verweij, J. B. Rem and S. Bijlsma
Lien : vide.pdf - | Journal Format-PDF (95 K)

[31] : Time dependent dielectric breakdown characteristics of MOS capacitors with
Si-implanted SiO2, Page 1277
Toshihiro Matsuda, Takashi Ohzone and Takashi Hori
Lien : vide.pdf - | Journal Format-PDF (95 K)

[32] : Reliability prediction using nondestructive accelerated-degradation data:
case study on power supplies., Page 1277
Ching Tang Loon and Shang Chang Dong
Lien : vide.pdf - | Journal Format-PDF (95 K)

[33] : Optimal test-times for intermittent faults., Page 1277
Kun-Jen Chung
Lien : vide.pdf - | Journal Format-PDF (95 K)

[34] : Domination of k-out-of-n systems., Page 1277
A. Behr, L. Camarinopoulos and C. Pampoukis
Lien : vide.pdf - | Journal Format-PDF (95 K)

[35] : Fault severity models of fault-correction activity., Pages 1277-1278
David L. Lanning and Taghi M. Khoshgoftaar
Lien : vide.pdf - | Journal Format-PDF (191 K)

[36] : Weibull component reliability-prediction in the presence of masked data.,
Page 1278
John S. Usher
Lien : vide.pdf - | Journal Format-PDF (96 K)

[37] : An empirical model of enhancement-induced defect activity in software.,
Page 1278
David L. Lanning and Taghi M. Khoshgoftaar
Lien : vide.pdf - | Journal Format-PDF (96 K)

[38] : Reliability analysis of software with JUSE-RASI., Pages 1278-1279
Tetsurou Seki, Hiroshi Shiomi, Michio Kase and Kiyoshi Katayama
Lien : vide.pdf - | Journal Format-PDF (193 K)

[39] : Dynamic reliability analysis of coherent multistate systems., Page 1279
Xue Jianan and Yang Kai
Lien : vide.pdf - | Journal Format-PDF (97 K)

[40] : Numerical methods for reliability evaluation of Markov closed
fault-tolerant systems., Page 1279
Christoph Lindemann, Manish Malhotra and Kishor S. Trivedi
Lien : vide.pdf - | Journal Format-PDF (97 K)

[41] : Correlation of SiO2 lifetimes from constant and ramped voltage
measurements., Page 1279
Andreas Martin, Paula O'Sullivan and Alan Mathewson
Lien : vide.pdf - | Journal Format-PDF (97 K)

[42] : Reliability evaluation of process models., Page 1280
Andrew Kusiak and Armen Zakarian
Lien : vide.pdf - | Journal Format-PDF (97 K)

[43] : Using system reliability to determine supportability turnaround time at a
repair depot., Page 1280
D. G. Linton, S. Khajenoori, G. Hebert and J. V. Bullington
Lien : vide.pdf - | Journal Format-PDF (97 K)

[44] : Use of failure-intensity models in the software-validation phase for
telecommunications., Page 1280
Henry Derriennic and Gilbert L. Gall
Lien : vide.pdf - | Journal Format-PDF (97 K)

[45] : Inferring coverage probabilities by optimum 3-stage sampling., Page 1280
Cristian Constantinescu
Lien : vide.pdf - | Journal Format-PDF (97 K)

[46] : Continuous state reliability analysis., Pages 1280-1281
Yang Kai and Xue Jianan
Lien : vide.pdf - | Journal Format-PDF (193 K)

[47] : Decision theory in maintenance strategy of standby system with
Gamma-distribution repair-time., Page 1281
Adiel Teixeira de Almeida and George A. Bohoris
Lien : vide.pdf - | Journal Format-PDF (96 K)

[48] : Estimating the cumulative downtime distribution of a highly reliable
component., Page 1281
Daniel R. Jeske
Lien : vide.pdf - | Journal Format-PDF (96 K)

[49] : A cautionary tale about Weibull analysis., Page 1281
M. S. Mackisack and R. H. Stillman
Lien : vide.pdf - | Journal Format-PDF (96 K)

[50] : Optimal configuration of redundant real-time systems in the face of
correlated failure., Page 1281
C. M. Krishna and A. D. Singh
Lien : vide.pdf - | Journal Format-PDF (96 K)

[51] : Fault tree analysis and binary decision diagrams., Pages 1281-1282
Roslyn M. Sinnamon and John D. Andrews
Lien : vide.pdf - | Journal Format-PDF (188 K)

[52] : Commercial-components initiative: ground benign systems--plastic
encapsulated microcircuits., Page 1282
Edward J. Kross and Michael A. Sicuranza
Lien : vide.pdf - | Journal Format-PDF (92 K)

[53] : Silicon micromachining technique for fabricating high temperature
superconducting microbolometers., Page 1282
R. Barth
Lien : vide.pdf - | Journal Format-PDF (92 K)

[54] : Miscellaneous Item, Page 1282
Lien : vide.pdf - Format-PDF (92 K)

[55] : The evolution of interconnection technology at IBM., Pages 1282-1283
J. G. Ryan, R. M. Geffken, N. R. Poulin and J. R. Paraszczak
Lien : vide.pdf - | Journal Format-PDF (191 K)

[56] : VLSI on-chip interconnection performance simulations and measurements.,
Page 1283
D. C. Edelstein, G. A. Sai-Halasz and Y. -J. Mii
Lien : vide.pdf - | Journal Format-PDF (99 K)

[57] : Effect of PCB finish on the reliability and wettability of ball grid array
packages., Page 1283
Edwin Bradley and Kingshuk Banerji
Lien : vide.pdf - | Journal Format-PDF (99 K)

[58] : Corrosion and adhesion of multilayer pad structures for packaging
applications, Page 1283
Gerald S. Frankel, Sampath Purushothaman, Tina A. Petersen, Shaji Farooq,
Srini N. Reddy and Vlasta Brusic
Lien : vide.pdf - | Journal Format-PDF (99 K)

[59] : Improved yield and performance of ball-grid array packages: design and
processing guidelines for uniform and nonuniform arrays, Page 1283
Stephen M. Heinrich, Shilak Shakya, Yanhua Wang, Ping S. Lee and Scott A.
Schroeder
Lien : vide.pdf - | Journal Format-PDF (99 K)

[60] : Modeling and analysis of multichip module power supply planes, Pages
1283-1284
Keunmyung Lee and Alan Barber
Lien : vide.pdf - | Journal Format-PDF (198 K)

[61] : Application of ring oscillators to characterize transmission lines in VLSI
circuits, Page 1284
Lohit S. Dutta and Thomas Hillmann-Ruge
Lien : vide.pdf - | Journal Format-PDF (99 K)

[62] : Simulating IC reliability with emphasis on process-flaw related early
failures, Page 1284
Mohamed S. Moosa and Kelvin F. Poole
Lien : vide.pdf - | Journal Format-PDF (99 K)

[63] : Tutorial: Electrolytic models for metallic electromigration failure
mechanisms, Page 1284
Simeon J. Krumbein
Lien : vide.pdf - | Journal Format-PDF (99 K)

[64] : Silicides and local interconnections for high-performance VLSI
applications, Page 1284
R. W. Mann, L. A. Clevenger, P. D. Agnello and F. R. White
Lien : vide.pdf - | Journal Format-PDF (99 K)

[65] : A clustered yield model for SMT boards and MCM's, Pages 1284-1285
Mick M. V. Tegethoff and Tom W. Chen
Lien : vide.pdf - | Journal Format-PDF (195 K)

[66] : Interconnect fabrication processes and the development of low-cost wiring
for CMOS products, Page 1285
T. J. Licata, E. G. Colgan, J. M. E. Harper and S. E. Luce
Lien : vide.pdf - | Journal Format-PDF (97 K)

[67] : A real-time clustering microchip neural engine, Page 1285
Teresa Serrano-Gotarredona and Bernabe Linares-Barranco
Lien : vide.pdf - | Journal Format-PDF (97 K)

[68] : A silicon-on-silicon field programmable multichip model
(FPMCM)--integrating FPGA and MCM technologies, Page 1285
Joel Darnauer, Tsuyoshi Isshiki, Porfirio Garay, John Ramirez, Vijayshri
Maheshweari and Wayne Wei-Ming Dai
Lien : vide.pdf - | Journal Format-PDF (97 K)

[69] : Low-temperature chemical vapour deposition processes and dielectrics for
microelectronic circuit manufacturing at IBM, Pages 1285-1286
D. R. Cote, S. V. Nguyen, W. J. Cote, S. L. Pennington, A. K. Stamper and
D. V. Podlesnik
Lien : vide.pdf - | Journal Format-PDF (194 K)

[70] : Plastic packaging is highly reliable, Page 1286
Nihal Sinnadurai
Lien : vide.pdf - | Journal Format-PDF (97 K)

[71] : Characteristics and potential application of polyimidecore bump to flip
chip, Page 1286
Takashi Nishimori, Hiroshi Yanagihara, Keiji Murayama, Yasunori Kama and
Misa Nakamura
Lien : vide.pdf - | Journal Format-PDF (97 K)

[72] : Connecting parametric ageing to catastrophic failure through
thermodynamics, Pages 1286-1287
A. A. Feinberg and A. Widom
Lien : vide.pdf - | Journal Format-PDF (193 K)

[73] : Miscellaneous Item, Page 1287
Lien : vide.pdf - Format-PDF (96 K)

[74] : Evaluation methods of ion migration by dew condensation cycle test--part
2, Page 1287
Yuichi Oaki, Hirokazu Tanaka, Shigeharu Yamamoto, Osamu Obata and Yoshiki
Saito
Lien : vide.pdf - | Journal Format-PDF (96 K)

[75] : Forced convection air-cooling of a commercial electronic chassis: an
experimental and computational case study, Page 1287
Christopher W. Argento, Yogendra K. Joshi and Michael D. Osterman
Lien : vide.pdf - | Journal Format-PDF (96 K)

[76] : IC technology and ASIC design for the Cray J90 supercomputer, Page 1287
D. J. Poli, M. S. Berry and J. N. Kruchowski
Lien : vide.pdf - | Journal Format-PDF (96 K)

[77] : Developing reusable modeling capabilities for simulating high volume
electronics manufacturing systems, Pages 1287-1288
Phillip A. Farrington, James J. Swain, John L. Evans and John S. Rogers
Lien : vide.pdf - | Journal Format-PDF (194 K)

[78] : Automated X-ray inspection of chip-to-chip interconnections of Si-on-Si
MCM's, Page 1288
Zhen Tong, T. Warren Liao and Caleb S. Stritimatter
Lien : vide.pdf - | Journal Format-PDF (97 K)

[79] : Design of a low-cost wire bond tape ball grid array package, Page 1288
R. D. Schueller and A. P. Plepys
Lien : vide.pdf - | Journal Format-PDF (97 K)

[80] : An experimental study of popcorning in plastic encapsulated microcircuits,
Page 1288
Ranjit Gannamani and Michael Pecht
Lien : vide.pdf - | Journal Format-PDF (97 K)

[81] : Characterization of a small peripheral array package, Page 1288
Jie Hao, Andre Richter, Joy Laskar, Madhavan Swaminathan and J. Mosley
Lien : vide.pdf - | Journal Format-PDF (97 K)

[82] : Experimental characterization of simultaneous switching noise for
multichip modules, Page 1288
Kenji Ito, Katsuto Kato, Naohiko Hirano and Toshio Sudo
Lien : vide.pdf - | Journal Format-PDF (97 K)

[83] : A cost analysis study for testability purposes on silicon active
substrates, Pages 1288-1289
Joan Oliver and Hans Kerkhoff
Lien : vide.pdf - | Journal Format-PDF (193 K)

[84] : Periodic boundary conditions for the numerical analysis of semiconductor
devices, Page 1289
S. P. Lepkowski
Lien : vide.pdf - | Journal Format-PDF (96 K)

[85] : Depth profile analysis of porous Si film by ERDA using a E - E detector
telescope, Page 1289
D. K. Avasthi, S. K. Hui, E. T. Subramanyiyam and B. R. Mehta
Lien : vide.pdf - | Journal Format-PDF (96 K)

[86] : Single-electron trapping in sub-m sized MOSFETs, Page 1289
M. Schultz and H. H. Mueller
Lien : vide.pdf - | Journal Format-PDF (96 K)

[87] : The low-frequency noise behaviour of silicon-on-insulator technologies,
Page 1289
E. Simoen and C. Claeys
Lien : vide.pdf - | Journal Format-PDF (96 K)

[88] : Electrical measurement of silicon film and oxide thicknesses in partially
depleted SOI technologies, Page 1289
B. M. Tenbroek, W. Redman-White, M. S. L. Lee and M. J. Uren
Lien : vide.pdf - | Journal Format-PDF (96 K)

[89] : Low-temperature impurity breakdown in semiconductors: an approach towards
efficient device simulation, Pages 1289-1290
R. E. Kunz, E. Scholl, R. Nurnberg and H. Gajewski
Lien : vide.pdf - | Journal Format-PDF (187 K)

[90] : Modeling narrow-channel effect in VLSI MESA-isolated SOI MOS devices using
a quasi-two-dimensional approach, Page 1290
K. W. Su and J. B. Kuo
Lien : vide.pdf - | Journal Format-PDF (91 K)

[91] : SOI (Silicon-on-Insulator)--materials and devices, Page 1290
A. Jakubowski, M. Jurczak and L. Lukasiak
Lien : vide.pdf - | Journal Format-PDF (91 K)

[92] : Electromigration and stress-induced voiding in fine Al and Al-alloy
thin-film lines, Page 1290
C. -K. Hu, K. P. Rodbell, T. D. Sullivan, K. Y. Lee and D. P. Bouldin
Lien : vide.pdf - | Journal Format-PDF (91 K)

[93] : New nanometer manipulators for surface research, Page 1290
V. V. Anisimov, E. A. Deulin, S. V. Khramtsov and V. P. Mikhailov
Lien : vide.pdf - | Journal Format-PDF (91 K)

[94] : Small pulsed electron-ion sources for radiation technologies and surface
modification of materials, Page 1290
S. A. Korenev and A. J. Perry
Lien : vide.pdf - | Journal Format-PDF (91 K)

[95] : Ion implantation and secondary ion mass spectrometry of compound
semiconductors, Page 1290
R. G. Wilson
Lien : vide.pdf - | Journal Format-PDF (91 K)

[96] : Silicon oxide conductivity of hydrogen ion implanted polysilicon thin film
transistors, Page 1290
V. Gueorguiev, T. Z. Ivanov, S. Andreev and L. Popova
Lien : vide.pdf - | Journal Format-PDF (91 K)

[97] : Phenomenon of resist debris formation in electronbeam lithography and its
possible application, Pages 1290-1291
P. R. Deshmukh, K. J. Rangra, M. Singh, V. D. Vyas and B. B. Pal
Lien : vide.pdf - | Journal Format-PDF (104 K)

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