P. Alpern, K.C. Lee, R. Dudek, R. Tilgner, "A simple model for the mode I popcorn effect for IC packages", ESREF'2000.

P. Alpern, K.C. Lee, R. Dudek, R. Tilgner, "A simple model for the mode I popcorn effect for IC packages", ESREF'2000. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [PAP434]

Titre : P. Alpern, K.C. Lee, R. Dudek, R. Tilgner, A simple model for the mode I popcorn effect for IC packages, ESREF'2000.

Cité dans : [DATA126] ESREF'2000, 11th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Dresden, Germany, 2-6 octobre 2000.
Cité dans :[PAP360]

Auteur : P. Alpern (a)
Auteur : K.C. Lee (b)
Auteur : R. Dudek (c)
Auteur : R. Tilgner (a)

Adresses :
(a) : Infineon Technologies AG, Corporate Backends, Quality Management, Quality and Reliability, P.O. Box 80 17 09, D-81617 Munich, Germany.
(b) : Quality Management Department, Infineon Technologies Asia Pacific Pte Ltd, 168 Kallang Way, Singapore 349253.
(c) : IZM, Mechanical Reliability and Micro Materials, P.O. Box 344, D-09003 Chemnitz

Source : ESREF'2000 - 11th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis.
Date : 2-6 octobre 2000
Site : http://www.elsevier.com/locate/microrel
Pages : 1 - 6
Lien : private/ALPERN.pdf - 6 pages, 302 Ko.

Abstract :
A simple model for the Mode I popcorn effect is presented here for packages with rectangular die pad
(P-DSO). A package "stability parameter", relating to its moisture sensitivity, is derived from the popcorn
model. It describes the critical factors for a robust package - molding compound properties and package,
leadframe design for a given preconditioning and soldering process. Furthermore, nomograms generated from
the model enable an easy estimation of moisture sensitivity levels (between 1 and 5) of packages with different
die pad sizes and molding compound underpad thicknesses and for different soldering temperatures ranging
from 220°C to 260°C (Pb-free soldering).

Bibliographie

Références : 10
[1] : R. Schmidt, P. Alpern, K. Plecher, R. Tilgner, "Investigation of the adhesion strength between MC and leadframe at higher temperatures", Proc. IEEE/EPTC, 1998, pp. 349-353.
[2] : I. Fukuzawa, S. Ishiguro, S. Nabu, "Moisture resistance degradation of plastic LSIs by reflow soldering", Proc. IEEE/IRPS, 1985, pp. 192- 197.
[3] : S. Omi, K. Fujita, T. Tsuda, and T. Maeda, "Causes of cracks in SMD and type specific remedies", IEEE Trans. Comp. Hybrids, Manuf. Tech., 14(4), pp. 818 - 823, 1991.
[4] : J.H. Lim, K.W. Lee, S.S. Park, Y.Y. Earmme, "Vapor pressure analysis of IC packages by fracture mechanics", Proc. IEEE/CPMT El. Pack. Tech. Conf, pp. 36 - 42, 1998, and references therein.
[5] : J. Crank, "The mathematics of diffusion", Oxford University Press, New York, 2 nd ed., 1975.
[6] : S. Timoshenko, S. Woinowsky-Krieger, "Theory of plates and shells", 2 nd edition, McGraw Hill, 1959.
[7] : P. A lpern, K.C. Lee, R. Dudek, and R. Tilgner, "The mode I popcorn effect", paper in preparation.
[8] : V.S. Sastri, R.L. Shook, "Diffusion modeling for the analysis of moisture induced damage during solder reflow of plastic surface mount ICs, SMI, pp. 627 - 631, 1995.
[9] : R. Dudek, R. Döring, Fraunhofer Institute IZM, Department Mechanical Reliability and Micro Materials, Berlin/Chemnitz, unpublished results.
[10] : The temperatures considered here are far from the glass transition temperature (»150°C). For two other MCs the change of E was found to be smaller than 6% of the value E(220°C); Dr. R. Schmidt, private communication.

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