K. CROES, J. V. MANCA, W. DE CEUNINCK, L. DE SCHEPPER, G. MOLENBERGHS, "The time of ""guessing"" your failure time distribution is over!", Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1187-1191.

K. CROES, J. V. MANCA, W. DE CEUNINCK, L. DE SCHEPPER, G. MOLENBERGHS, "The time of ""guessing"" your failure time distribution is over!", Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1187-1191. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [PAP396]

Titre : K. CROES, J. V. MANCA, W. DE CEUNINCK, L. DE SCHEPPER, G. MOLENBERGHS, The time of guessing your failure time distribution is over!, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1187-1191.

Cité dans :[REVUE253] Elsevier Science, Microelectronics Reliability, Volume 38, Issues 6-8, Pages 851-1366, 8 June 1998.
Cité dans : [DATA233] ESREF'98, Proceedings of the 9th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, 5-9 October 1998.
Cité dans : [DIV366]  Recherche sur l'auteur Kristof CROES, octobre 2002.
Cité dans :[PAP432]

Auteur : K. Croes (1)
Auteur : J. V. Manca (1)
Auteur : W. De Ceuninck (1)
Auteur : L. De Schepper (1)
Auteur : G. Molenberghs (2)

Adresse : (1) Limburgs Universitair Centrum, Institute for Materials Research, Materials Physics Division, Universitaire Campus, Wetenschapspark 1, 3590 Diepenbeek, Belgium
Adresse : (2) Limburgs Universitair Centrum, Biostatistics, Universitaire Campus, 3590 Diepenbeek, Belgium

Vers : Bibliographie
Lien : PAP432.HTM#Bibliographie - référence [4].
Lien : private/CROES.pdf - 5 pages, 298 Ko
Pages : 1187 - 1191
Volume : 38
Issues : 6-8
Date : 8 June 1998
Logiciel : FAILURE

Abstract :
Each statistical analysis of reliability data starts with the choice of the underlying distribution of failure
times. This choice is of great importance because all conclusions drawn from this analysis will depend on it.
Lifetime predictions can vary orders of magnitude depending on the distribution used. Most researchers choose
the underlying distribution of failure times rather unfounded: because of "historical" reasons, because everybody
uses it, ...We developed a method which offers reliability engineers an objective tool for making the distinction
between the two most widely used distributions, the lognormal and the Weibull, using a statistical well-founded
technique. Essentially, the method comes down to constructing both the lognormal and the Weibull probability
plot of the data set under consideration. For each plot, the Pearson's correlation coefficient is calculated. It is
shown that the ratio of these two correlation coefficients is a pivotal quantity .Hence, it can serve as a test
statistic.

Bibliographie

Références : 6
[1] : Chen, C.Y. Wu, M.K. Lee and C.N. Chen. The dielectric reliability of intrinsic SiO2 films themally grown on a heavily doped Si substrate characterisation and modelling, IEEE Transactions on Electron Devices, Vol. 34, (1987), pp. 1540-1552
[2] : Bain, Statistical analysis of reliability and life-testing models: theory and methods, Marcel Pekker Inc., New York, 1978
[3] : Lloyd, On the lognormal distribution of electromigration lifetimes, I. Appl. Phys., Vol. 50 (1979), pp. 5062-5064
[4] : Pinto, The effect of barrier layers on the distribution function of interconnect electromigration failures Qual. Reliab. Engin. Int., Vol. 7 (1991), pp. 287-291
[5] : LaCombe. and E.L. Parks, The distribution of electromigration failures, IEEE IRPS Proc. (1986), pp. 1-6
[6] : Failure '97, Software package for reliability data analysis distributed by DESTIN N.V., Wetenschapspark I, B-3590 Diepenbeek, Belgium

  [1] :  [PAP158]  -------
  [2] : [LIVRE288] BAIN, Statistical analysis of reliability and lifetesting models : theory and methods, Marcel Dekker Inc., New York, 1978.
  [3] :  [PAP158]  -------
  [4] :  [PAP158]  -------
  [5] :  [PAP158]  -------
  [6] :  [DIV338]  FAILURE, Software package for reliability data analysis, distributed by DESTIN NV, Wetenschapspark 1, B-3590 Diepenbeek, Belgium.

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