Advanced Failure Analysis Techniques
Physical, chemical and electrical analysis techniques for fault isolation and failure identification
Novel techniques including optical beam, electron beam, ion beam and scanning probe techniques 

Dielectrics and Hot-Carrier Reliability 
Time dependent dielectric breakdown 
Oxide degradation mechanisms and modelling 
Plasma induced damages - characterisation techniques, mechanisms and modelling 
Tunnel oxides in non-volatile memories 
Hot-carrier effects - measurement techniques and modelling 

Practical Issues in Built-in Reliability
Reliability engineering emphasising design and process aspects 
Process control in wafer processing and reliability
Assembly related issues in device reliability 

Packaging and Metallization Related Failure Mechanisms
Electromigration studies and modelling 
Contact degradation and related issues 
MCM, BGA, CSP, Flip-chip and other advanced packaging related failure mechanisms 
Package stress modelling and characterisation 
Fine pitch wire bonding and solder joint reliability 
Copper interconnects 

EOS/ESD and CMOS Latchup 
Effect of ESD on specific devices and new protection structures 
Latent damages and damage interpretation 
ESD modelling and measurement techniques 
CMOS latchup characterisation and modelling 

Reliability and Failure Analysis in Specialist Devices
Power semiconductor devices 
Optoelectronic devices 
Compound semiconductors 
Micro Electro-Mechanical Systems 

The deadline for abstract submission is 1 December 2000. 

SUBMISSION GUIDELINES
Prospective authors are requested to submit a two-page summary (inclusive of a 50-word abstract, figures and references) in Adobe Acrobat PDF file to the Technical Program Chair at ipfa@pacific.net.sg by 1 December 2000.
Alternatively, you may wish to submit 3 copies of the summary to the IPFA Secretariat, P.O. Box 1129, Kent Ridge Post Office, Singapore 911105. 
The summary should state clearly and concisely the specific results of the work, why the results are important and how the results relate to previously reported work. Your work must be original and previously unpublished. Your submission should contain the name, affiliation and address of each author, and the telephone number, fax number and email address of the corresponding author. 
Please note that all submissions must be in English. Authors of papers that have been accepted for presentation will be notified by 15 February 2001. Upon notification of acceptance, authors will be given guidelines for the paper and slide preparation and presentation. The final camera-ready manuscript (to be submitted by 15 April 2001) must conform strictly to the manuscript preparation guidelines before they can be published in the Symposium Proceedings and presented at the symposium. 

IMPORTANT DATES 
1 December 2000 - Submission of Summary and Abstract 
15 February 2001 - Notification of Paper Acceptance 
15 April 2001 - Submission of Camera-ready Manuscript