Article : [ART515]

Info : REPONSE 66, le 31/03/2004.

Titre : Finite-element modeling of thermal and thermomechanical behavior for three-dimensional packaging of power electronics modules.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.

Meeting : 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic System-ITherm 2000.

Info : organization : CPMT/IEEE
Location : Las Vegas, NV, USA
Date : 23 May 2000-26 May 2000

Source : Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference v 2 2000.p 303-309
CODEN : PITEFT
Année : 2000
Meeting_Number : 57477
Document_Type : Journal
Treatment_Code : Theoretical; Experimental
Language : English
Stockage :
Switches :
Power :
Software :

Abstract :
The goal of realizing highly efficient and highly reliable energy conversion from source to load in power electronics has driven the exploration of thermal handling of power packaging to the 3rd dimension. Innovative 3-D interconnected power package designs have shown their advantages in higher power density, reduced interconnect resistance, noise and parasitic oscillations, better thermal management, higher level of system integration and lower cost. On the other hand, the complicated design and the fabrication process introduce more reliability concerns. 3-D design of power packaging has not yet been fully understood in its thermomechanical reliability. A detailed study in this respect will help in understanding the key issues of thermal management and thermomechanical reliability. In this work, we present a 3-D finite-element modeling of thermal and thermomechanical performance for a 3-D packaged power module fabricated by a stacked-plate processing technique. Thermal cycles simulating working conditions were applied to the model.Parametric study of interconnection geometry and cooling condition led to better understanding in thermal management, and the results are compared with those of a wire bond module.Thermally induced stresses and fatigue were also analyzed in detail.(Author abstract) 8 Refs.

Accession_Number : 2000(50):2739 COMPENDEX

Mise à jour le lundi 10 avril 2023 à 18 h 47 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.

Copyright 2023 :

Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.