Article : [ART511]
Info : REPONSE 18, le 31/03/2004.
Titre : M. CIAPPA, F. CARBOGNANI, P. COVA, W. FICHTNER, Lifetime prediction and design of reliability tests for high-power devices in automotive applications, Proceedings of IEEE International Reliability Physics Symposium, 2003, pp. 523-528.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.Auteur : Ciappa, Mauro (Swiss Fed. Inst. of Technology (ETH) Integrated Systems Laboratory, Zurich, Switzerland)
Meeting : 2003 IEEE International Reliability Physics Symposium Proceedings.
Info : organization : IEEE
Location : Dallas, TX, United States
Date : 30 Mar 2003-04 Apr 2003
Source : Annual Proceedings - Reliability Physics (Symposium) 2003. (IEEE cat n 03CH37400)
Pages : 523 - 528
CODEN : ARLPBI
ISSN : 0099-9512
Année : 2003
Meeting_Number : 61160
Document_Type : Conference Article
Treatment_Code : Application; Theoretical; Experimental
Language : English
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Abstract :
Different procedures are defined and compared to extract the statistical distribution of the thermal cycles experienced by power devices installed in hybrid vehicles operated according to arbitrary mission profiles. This enables both to design efficient accelerated tests tailored on realistic data and to provide the input for lifetime prediction models. Initially, the system lifetime is predicted under the assumption of linear accumulation of the damage produced by low cycling fatigue. In the second part, a novel prediction model based on some fundamental equations is introced which takes into consideration the creep experienced by compliant materials when they are submitted to thermal cycles. 6 Refs.
Accession_Number : 2003(30):8542 COMPENDEX
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