Article : [ART506]

Info : INSPEC REPONSE 22

Titre : Understanding the effect of dwell time on fatigue life of packages using thermal shock and intrinsic material behavior.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans : [CONF038] ECTC, Electronic Components and Technology Conference et IEEE Electronic Components and Technology, mars 2004.

Source : 53rd Electronic Components and Technology Conference. Proceedings (Cat. No.03CH37438).
Lieu : Piscataway, NJ, USA: IEEE,
Pages : 898 - 904 of xxiv+1880 pp.
Réferences : 11 refs. Also available on CD-ROM in PDF format
Conference: New Orleans, LA, USA,
Date : 27-30 May 2003
Price: CCCC 0-7803-7991-5/03/$17.00
ISBN: 0-7803-7991-5
Document_Type : Conference Article
Treatment_Code : Experimental
Info : Country of Publication : United States
Language : English
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Abstract :
Although empirically based relationships for fatigue based on temperature change ( Delta T) have long existed for metals (Coffin-Manson, etc.), their translation to package reliability applications have often yielded inexplicable differences. These contradictions can now begin to be explained through physics based deductions about the material properties of the composite package and additional details surrounding the temperature cycle profile, specifically the ramp rate and dwell time. The technique outlined in this paper focuses on assessing thermo-mechanical fatigue for package level assemblies. By coupling the time to data merits of a thermal shock metrology with the precision of in-situ response monitoring and linking the results back to intrinsic material properties, a deeper understanding is being formulated in the reliability modeling of thermo-mechanical failures. Through the integration of this metrology, data acquisition, and material property measurement techniques, faster and more accurate reliability assessments can be drawn.

Accession_Number : 2003:7775984 INSPEC

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