T.D. MOORE, J.L. JARVIS, "Thermomechanical deformation of a bimaterial plate as applied to laminate IC assemblies", Microelectronics Reliability, Volume 43, Issues 1, pp. 155-162.

T.D. MOORE, J.L. JARVIS, "Thermomechanical deformation of a bimaterial plate as applied to laminate IC assemblies", Microelectronics Reliability, Volume 43, Issues 1, pp. 155-162. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART366]

Titre : T.D. MOORE, J.L. JARVIS, Thermomechanical deformation of a bimaterial plate as applied to laminate IC assemblies, Microelectronics Reliability, Volume 43, Issues 1, pp. 155-162.

Cité dans :[REVUE386] Elsevier Science, Microelectronics Reliability, Volume 43, Issue 1, Pages 1-177, January 2003.
Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Auteur : Thomas D. Moore (a)
Auteur : John L. Jarvis (b)

Vers : Bibliographie
Adresse : (a) Packaging Development in the Assembly Department, Analog Devices B.V., Limerick, Ireland
Adresse : (b) Department of Mechanical and Aeronautical Engineering, University of Limerick,
Tel. : +353-61-495139
Fax. : +353-61-30311
Source : Microelectronics Reliability
Volume : 43
Issues : 1
Date : 2003
Pages : 155 - 162
DOI :
PII :
Lien : private/Moore1.pdf - 204 Ko, 8 pages.
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Abstract :
This paper examines thermomechanical warpage in a bimaterial plate. It considers
the suitability of axisymmetric and generalized plane strain finite element
analyses, and it compares these to the 3-D analysis of a bimaterial plate in
which properties of one of the materials vary in orthogonal directions within
the plane of the plate. These findings are compared to results from mechanical
measurement of a BGA substrate. The influence of orthotropic versus isotropic
substrate properties is investigated with regard to warpage. The root cause of
previously unexplained saddle-shaped warpage is identified as the asymmetry of
the copper traces, and design rules regarding substrate layout are recommended.

Article Outline
1. Introduction
2. Prior work
3. Objectives of this study
4. Limitations of axisymmetric analysis
5. Limitations of generalised plane strain
6. Substrate orthotropic properties
7. Effect of orthotropy on warpage
8. Results––comparison of cases A and B
9. Orthotropic factors influencing warpage
10. Conclusions and recommendations

Bibliographie

References : 14
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[11] : C. Yeh, C. Ume, K.W. Fulton and J. Stafford , Correlation of analytical and experimental approaches to determine thermally induced PWB warpage. IEEE Trans. [Comp] : Hybrids Manuf. Technol. 16 8 (1993), pp. 986–995. Abstract-Compendex
[12] : I.C. Ume et al., Finite element analysis of PWB warpage due to cured solder mask––sensitivity analysis. IEEE Trans. Comp. Package. Manuf. Technol. 20 (1997), pp. 307–316. Abstract-Compendex | Abstract-INSPEC | Full Text via CrossRef
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