M.H. POECH, R. EISELE, "A modelling approach to assess the creep behaviour of large-area solder joints", Microelectronic Reliability, Vol. 40, 2000, 1653-1658.

M.H. POECH, R. EISELE, "A modelling approach to assess the creep behaviour of large-area solder joints", Microelectronic Reliability, Vol. 40, 2000, 1653-1658. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART186]

Titre : M.H. POECH, R. EISELE, A modelling approach to assess the creep behaviour of large-area solder joints, Microelectronic Reliability, Vol. 40, 2000, 1653-1658.

Cité dans :[REVUE190] Elsevier Science, Microelectronics Reliability, Vol. 40, Issue 8-10, pp. 1243-1770, august-october 2000.
Cité dans :[ART181]

Auteur : M.H. Poech - Fraunhofer Institut für Siliziumtechnologie FhG ISIT, Fraunhoferstraße 1, D-25524 Itzehoe
Auteur : R. Eisele - Danfoss Silicon Power GmbH, Heinrich-Hertz-Straße 2, D-24837 Schleswig

Lien : private/Poech1.pdf - 6 pages, 375 Ko.
Pages : 1653 - 1658.
Volume : 40
Issue : 8-10
Date : august-october 2000
Lien : ART181.HTM#Bibliographie - référence [1].

Abstract :
Packages of power modules are designed to show a slightly convex shape of the base-plate in order to
achieve a reasonable thermal contact between the module and the heat sink when the power module is mounted.
During manufacturing, soldering of materials with differences in thermal expansion coefficients will lead to
bending of the "bi-material" composite, e.g. the silicon chip to substrate (usually DCB = direct copper bond
Al2O3 or AlN) or the DCB-substrate to base-plate joint (Cu or MMC = metal matrix composite). Especially the
large area solder joint between DCB-substrate and Cu base-plate is known to induce a certain curvature into the
base-plate immediately after cooling down from soldering. The curvature will relax to a certain extent during
module finishing, storage, shipping, and use which makes the prediction of the shape of the base-plate difficult.
The present paper proposes a model to assess the creep behaviour of such large area solder joints in order to
predict the state of bending after soldering and the amount of relaxation of bending with time.

Bibliographie

References : 5
[1] : Lau J, Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, New York, 1993
[2] : Jun He, Morris WL, Shaw MC, Sridhar N, Reliability in Large Area Solder Joint Assemblies and Effects of Thermal Expansion Mismatch and Die Size, Advancing Microelectronics (1999) 39-46
[3] : Herr E, Frey T, Schlegel R, Stuck A, Zehringer R, Substrate-to-Base Solder Joint Reliability in High Power IGBT Modules, Microelectronics Reliability 37 (1997) No. 10/11, 1719-1722
[4] : Winter PR, Wallach ER, Microstructural Modelling and Electronic Interconnect Reliability; Soldering and Surface Mount Technology 26 (1997) 61-64
[5] : Solder Alloy Data, ITRI (International Tin Research Institute), Publication No. 656, 1986

  [1] :  [PAP158]  -------
  [2] :  [PAP158]  -------
  [3] :  [ART223]  E. HERR, T. FREY, R. SCHLEGEL, A. STUCK, R. ZEHRINGER, Substrate to base solder joint reliability in high-power IGBT modules, Microelectron. Reliab. Vol. 37, 1997, pp. 1719-1722.
  [4] :  [PAP158]  -------
  [5] :  [PAP158]  -------

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