7th International Workshop on THERMal INvestigations of ICs and Systems plus a special HALF-DAY ON DYNAMIC MEASUREMENTS
September 24-27, 2001, Paris, France.

CNRS-INPG-UJF

IEEE Computer Society The Institute of Electrical & Electronics Engineers, Inc. Test Technology Technical Council

IEEE Components, Packaging and Manufacturing Technology Society

Sponsored by the IEEE Computer Society, Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the IEEE Solid-State Circuits Society French Chapter.

AIM of the WORKSHOP INFORMATION LOCATION TRANSPORTATION PROCEEDINGS GUIDELINES for AUTHORS EXHIBITION SOCIAL EVENT

WORKSHOP COMMITTEE WORKSHOP at a GLANCE TUTORIALS TECHNICAL PROGRAMME WORKSHOP REGISTRATION FORM HOTEL INFORMATION HOTEL RESERVATION Call for Papers

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system. The main topics to be discussed during the Workshop are the following: Thermal and Temperature Sensors Measurement of Thermal Properties Thermal Simulation Acquisition and Analysis of Thermal Data Electro-thermal Simulation Temperature Mapping Thermal Modelling and Investigation of Packages Novel and Advanced Cooling Techniques Reliability Issues Heat Transfer Enhancement Thermal Characterization Coupled (thermo-mechanical, thermo-optical, etc...) Effects Previous THERMINIC Workshops have been held in Grenoble (1995), Budapest (1996), Cannes (1997 and 1998), Rome (1999) and Budapest (2000). The programme includes invited talks, oral and poster presentations, a panel and a half-day organized by the PROFIT project on dynamic measurements. Oral contributions consist of 15 min. presentations followed by 5 min. discussion. The posters will be introduced by one slide in 3 minutes each. Top of Page General Chair: B. Courtois, TIMA Grenoble, France Vice General Chair: M. Rencz, BUTE, Budapest, Hungary Programme Chairs: C. Lasance, Philips, The Netherlands V. Székely, BUTE, Budapest, Hungary Programme Committee: M. Baelmans, KUL/Belgium A. Bar-Cohen, U. of Minnesota/USA W. Claeys, U. Bordeaux/France I. Barsony, KFKI-ATKI/Hungary D. Blackburn, NIST Gaithersburg/USA K. Azar, Advanced Thermal Solutions/USA G. De Mey, U. Gent/Belgium E. Suhir, Bell Laboratories/USA E. Jones, US Air Force/USA Y. Zorian, LogicVision/USA A. Tay, NU Singapore/Singapore U. Dillner, IPHT/Germany J.M. Dorkel, LAAS/France A. Rubio, UPC/Spain B. Siegal, Thermal Eng. Ass./USA J. Parry, Flomerics/UK M. Kimura, U. Tohoku/Japan J. Rantala, Nokia/Finland Y. Joshi, U. of Maryland/USA N. Sabry, U. Mansoura/Egypt J.B. Saulnier, ENSMA/France H. Pape, Infineon Technologies/Germany A. Napieralski, TU Lodz/Poland D. De Cogan, U. of East Anglia/UK H. Jaouen, STMicroelectronics/France J. Samitier, U. Barcelona/Spain D. Copeland, Fujitsu Laboratories of America/USA P. Tadayon, Intel/USA K. Shenai, U. of Illinois/USA M. Iyer, IME/Singapore F. Christiaens, Alcatel Bell/Belgium J. Janssen, Philips/The Netherlands G. Digele, The Boston Cltg/Germany E. Driessens, IMEC/Belgium B. Guenin, AMKOR/USA P. Raad, Southern Methodist U./USA T. Tarter, Lightwave Microsystems/USA O. Slattery, NMRC/Ireland D. Agonafer, IBM Corp./USA S. Ramminger, Siemens/Germany P. Rodgers, Electronics Thermal Management, Ireland Top of Page More information on the Workshop is available from: Bernard   COURTOIS TIMA 46 Avenue Félix Viallet 38031 Grenoble cedex France Tel.: +33 4 76 57 46 15 Fax: +33 4 76 47 38 14 Marta   RENCZ Budapest University of Technology & Economics (BUTE) Dept of Electron Devices Goldmann György tér 3 H-1114 Budapest XI, Hungary Tel.: +36 1 463 2702 Fax: +36 1 463 2973 Top of Page The Workshop will be held at the Sofitel Paris Forum Rive Gauche Hotel, located on the left bank of the Seine, only a few minutes from Montparnasse, the Latin Quarter, Place Denfert-Rochereau, Porte d'OrlŽans and Porte d'Italie. The Sofitel Paris Forum Rive Gauche Hotel is very easy to get to, by private and public transport, more information on Paris. Top of Page The Sofitel Paris Forum Rive Gauche is reachable by Metro (Line 6: Glacière or Saint-Jacques Stations), RER B, bus and taxis in the immediate vicinity. It also has direct links to Roissy-Charles de Gaulle Airport and Orly Airport. Top of Page Blocks of rooms have been reserved in the Hotel SOFITEL Forum Rive Gauche. September is a high season in PARIS so early reservation is recommended (before 17 August 2001). Reservations will be on a first-come first-served basis (but there is no obligation to stay at the Hotel SOFITEL Forum Rive Gauche, more information on hotels in PARIS could be find here). INSURANCE While the Workshop organisation makes every effort in order to ensure the safety and well being of all the workshop participants and associates, the Workshop cannot take responsibility for any accident or damage that may occur during the Workshop. Top of Page Proceedings, Special issue of the Microelectronics Journal, Special section of the IEEE Transactions on Components and Packaging Technologies and Special section of the Transactions of the ASME, Journal of Electronic Packaging. Informal Proceedings will be made available to attendees, based on papers provided by authors. Special Issues of Journals will constitute formal Proceedings. The Special issue of Microelectronics Journal collect papers dealing with thermal simulation, measuring and monitoring of thermal states. The submissions (not limited to those, presented at the Workshop) should be approximately 4,000 words, but longer or shorter contributions may be accepted. Detailed specifications for the submissions may be found in any issue of the Journal (back cover). The Special section of the IEEE Transactions on Components and Packaging Technologies will focus on thermal aspects relating to packaging. The submissions (not limited to those, presented at the Workshop) should be typewritten or printed double-spaced, one side only, using a font size of 11 points or larger, and include an informative 100-250 word abstract. Detailed specifications for the submissions may be found in any issue of the Journal (back cover). The Special section of the Transactions of the ASME, Journal of Electronic Packaging, will focus on thermal and mechanical aspects related to packaging. The submissions (not limited to those, presented at the Workshop) should be typed double-spaced, on one side of the page, using 22x28 mm (8.1/2 x 11 inch) using a 10 points type minimum. Detailed specifications for the submissions may be found in any issue of the Journal. The deadline to submit to either of the Special Issues is 31 October 2001. Authors should indicate the Journal they submit to. They will be notified about their papers by 31 December 2001. Final versions will be due by 31 January 2001, along the instructions that will be provided in due time. Submit 6 copies (specifying the Journal you submit to): Bernard COURTOIS TIMA 46 Avenue Felix Viallet 38031 Grenoble cedex, France Tel.: +33 4 76 57 46 15 Fax: +33 4 76 47 38 14 An exhibition will be held during the time of the Workshop. Stands are available to companies interested to exhibit equipment, materials, software, etc.... Booking of each 6-sqm stand will give one free registration at the Workshop, including the lunches on Tuesday 25 September, Wednesday 26 September and Thursday 27 September and the banquet on 26 September. Booking of each 6-sqm stand will also give one slot of time during the vendors' session. The number of stands is limited. They will be offered on a first signed - first served basis. Contact the General Chair for more information. The Workshop will feature an exhibition along the 3 days of the Workshop. The exhibition will be open to all Workshop participants. At the time of printing this programme a few exhibitors have already booked a stand: MicRed, Epsilon Ingénierie, Flomerics. Top of Page

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