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7th International Workshop on THERMal INvestigations of ICs and Systems
plus a special |
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September 24-27, 2001, Paris, France. |
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 CNRS-INPG-UJF |
 IEEE Computer Society The Institute of Electrical & Electronics Engineers, Inc. |
 IEEE Components, Packaging and Manufacturing Technology Society |
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General Chair B. Courtois TIMA Grenoble, France
V. Székely
A. Bar-Cohen
W. Claeys
I. Barsony
D. Blackburn
K. Azar
G. De Mey
E. Suhir
E. Jones
Y. Zorian
A. Tay
U. Dillner
J.M. Dorkel,
A. Rubio
B. Siegal
J. Parry
M. Kimura
J. Rantala
Y. Joshi
N. Sabry
J.B. Saulnier
H. Pape
A. Napieralski
D. De Cogan
H. Jaouen
K. Chakrabarty
J. Samitier
D. Copeland
P. Tadayon
K. Shenai
M. Iyer
F. Christiaens
J. Janssen
G. Digele
E. Driessens
B. Guenin
P. Raad
T. Tarter
O. Slattery
D. Agonafer
S. Ramminger
P. Rodgers |
THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system.
The Workshop is sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the IEEE Solid-State Circuits Society French Chapter.
The areas of interest range from thermal investigations in microstructures to thermal management of electronic systems.
The programme will include oral talks, poster presentation, a panel discussion and invited talks given by prominent speakers.
The THERMINIC Workshop invites vendors offering products in the scope of the Workshop to exhibit. Editors are invited to exhibit books.
Three prominent speakers have accepted to give an invited talk:
In the information age, reliability of power systems used in the information processing equipment is of paramount importance. Demands for 99.9999999% reliable operation in the field is not uncommon. This talk will address some fundamental issues on silicon-level and package related thermal management of power modules used in computer/telecommunication power supplies. We will develop a new understanding of the thermal management and highlight the importance of advanced thermal models to accurately predict the long-term reliability of power systems.
The concept of h-adiabatic was first defined experimentally, in research at Stanford University. The concept was quickly adopted by some cooling system designers in the US and Europe to guide their thinking, but it remained difficult to use quantitatively until it was incorporated into practical computational methods. The most recent developments have linked h-adiabatic to conjugate Green's functions in a commercial code, yielding fast solutions to realistic problems. Present research at Stanford is focused on extending the concept by measuring (and calculating) all of the terms in the fluid-mechanic Green's Function. Example problems in gas turbine blade cooling will be described, as well as electronics cooling results.
In a proposed scheme the CFD simulation is performed on a set of template designs in the product planning phase. From the solution body a fast-to-use design code is developed. The objective is to improve the productivity of thermal design analysis.
Special Issues and special sections of leading periodicals have been organised regarding the previous Workshops (Journal of Sensors and Actuators, Microelectronics Journal, IEEE Transactions on VLSI Systems, IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging). It is again expected to have special issues and special sections of leading periodicals as follow up of the Workshop 2001.
Two Tutorials (A and B) will be offered on Monday 24 September, prior to the Workshop. They will run in parallel.
From the inception of electronics, cooling by air has been the most desired and broadly implemented method in the industry. As materials, function, configuration and power dissipation of electronic systems have gone through, and will continue to experience broad changes, the question of effectiveness/practicality of air-cooling continues to surface. This is further amplified by data from different industry sectors claiming to have reached the limits of air-cooling. Hence, uttering heat flux data that beyond which higher mode of cooling is necessary! Such product-specific data has caused a concern in the industry as to whether air-cooling is a limiting option thus, higher modes of cooling are required. In this course a methodical procedure is presented for the designers to quickly calculate system performance with a given cooling option and determine the most suitable technique for the system at hand. The course is presented in two parts, the first part is designed to provide the basic calculation methodologies, and the second part address the issue of air-cooling as an option. The first part of the course will deal with basic calculations for thermal design. The second part will deal with the limits of air cooling.
About Kaveh Azar:
Shrinking system dimensions and higher packaging density are the norm in the evolution of electronic equipment. From portable computers to massively parallel processors, the internal space of the system box becomes a precious commodity to be shared by the electronic components and the cooling media. The space availed for cooling media, the power input to the electronic devices, and the allowable temperature potential are mutually affecting design parameters, and they can be regarded as tradable resources in an effort to maximize the system performance and reliability. While such concept helps to capture the technical aspects of product design from a strategic viewpoint, the management of time, human, and capital resources is also needed to streamline the design jobs. A particularly important step in the job stream is quick assessment of the impacts of new cooling devices and techniques on the product design on hand. The following topics will be covered: evolution of hardware morphologies, resource allocation in the system design, effectiveness of various cooling methods in tight space, possible impacts of micro-fabrication based cooling technologies, development of an infrastructure to support product innovation.
About Wataru Nakayama:
The Workshop will be held at the Sofitel Paris Forum Rive Gauche Hotel, located on the left bank of the Seine, only a few minutes from Montparnasse, the Latin Quarter, Place Denfert-Rochereau, Porte d'Orléans and Porte d'Italie. The Sofitel Paris Forum Rive Gauche Hotel is very easy to get to, by private and public transport. More information is available on the hotel and on Paris.
Authors are invited to submit electronic papers describing recent work. Panel proposals are also invited. Papers may be extended summaries (minimum 500 words) or full papers although preference will be given to full paper submissions. In either case, clearly describe the nature of the work, explain its significance, highlight novel features, and describe its current status.
Accepted contributions will be included in Workshop Proceedings.
TIMA / THERMINIC Workshop 46 Avenue Félix Viallet 38031 Grenoble cedex France
E-mail :
Therm2001@imag.fr
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Thermal and Temperature Sensors
Copyright © 2001 Laboratoire TIMA.
Tous droits réservés.