Revue : [REVUE520]

Titre : Elsevier Science, Microelectronics Reliability, Volume 44, Issue 6, Pages 889-1029, June 2004.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 44
Issue : 6
Pages : 889 - 1029
Date : June 2004

[1] : Rigorous modeling of high-speed semiconductor devices
Pages : 889-897
Vassil Palankovski and Siegfried Selberherr
Lien : vide.pdf - | Full Text + Links | PDF (634 K)

[2] : Smart MEMS concept for high secure RF and millimeterwave communications
Pages : 899-907
D. Dubuc, M. Saddaoui, S. Melle, F. Flourens, L. Rabbia, B. Ducarouge, K. Grenier, P. Pons, A Boukabache, L. Bary et al.
Lien : vide.pdf - | Full Text + Links | PDF (554 K)

[3] : Voltage acceleration and t63.2 of 1.6–10 nm gate oxides
Pages : 909-916
R. -P. Vollertsen and E. Y. Wu
Lien : vide.pdf - | Full Text + Links | PDF (415 K)

[4] : Analysis of the reservoir effect on electromigration reliability
Pages : 917-928
Insu Jeon and Young-Bae Park
Lien : vide.pdf - | Full Text + Links | PDF (902 K)

[5] : Boundary element analysis of thermal fatigue effects on high power IGBT modules
Pages : 929-938
Z. Khatir and S. Lefebvre
Lien : private/KHATIR1.pdf - | Full Text + Links | PDF (677 K)

  [1] :  [ART545]  Z. KHATIR, S. LEFEBVRE, Boundary element analysis of thermal fatigue effects on high power IGBT modules, Microelectronics Reliability, Vol. 44, No. 6, pp. 889-1029, June 2004.

[6] : Reliability of 70 nm metamorphic HEMTs
Pages : 939-943
M. Dammann, A. Leuther, R. Quay, M. Meng, H. Konstanzer, W. Jantz and M. Mikulla
Lien : vide.pdf - | Full Text + Links | PDF (307 K)

[7] : Representation of the SiGe HBT's thermal impedance by linear and recursive networks
Pages : 945-950
Hassène Mnif, Thomas Zimmer, Jean Luc Battaglia and Sébastien Fregonese
Lien : vide.pdf - | Full Text + Links | PDF (360 K)

[8] : Deformation measurement of RF MEMS switches by optical interference
Pages : 951-955
Yu Ying and Peter Grant
Lien : vide.pdf - | Full Text + Links | PDF (524 K)

[9] : Effects of annealing on the electric noise in semiconductor lasers
Pages : 957-961
Yingxue Shi, Jing Li, Guijun Hu, Sumei Zhang, Xuedan Wang and Jiawei Shi
Lien : vide.pdf - | Full Text + Links | PDF (414 K)

[10] : Operating limits for RF power amplifiers at high junction temperatures
Pages : 963-972
Z. Radivojevic, K. Andersson, J. A. Bielen, P. J. van der Wel and J. Rantala
Lien : vide.pdf - | Full Text + Links | PDF (770 K)

[11] : New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al
Pages : 973-981
C. D. Breach and F. Wulff
Lien : vide.pdf - | Full Text + Links | PDF (596 K)

[12] : Dynamic modeling for resin self-alignment mechanism
Pages : 983-992
J. M. Kim, Y. E. Shin and K. Fujimoto
Lien : vide.pdf - | Full Text + Links | PDF (494 K)

[13] : Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface
Pages : 993-1007
Markus P. K. Turunen, Pekka Marjamäki, Matti Paajanen, Jouko Lahtinen and Jorma K. Kivilahti
Lien : vide.pdf - | Abstract + References | PDF (604 K)

[14] : Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures
Pages : 1009-1015
Frøydis Oldervoll and Frode Strisland
Lien : vide.pdf - | Full Text + Links | PDF (445 K)

[15] : FPGA-based Monte Carlo simulation for fault tree analysis
Pages : 1017-1028
Alireza Ejlali and Seyed Ghassem Miremadi
Lien : vide.pdf - | Full Text + Links | PDF (310 K)

[16] : Oversampled delta-sigma modulators: analysis applications and novel topologies; Mücahit Kozak, Izzet Kale. Kluwer Academic Publishers, Boston.

[2003] : REVIEW
Page 1029
Mile Stojcev

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