Revue : [REVUE418]

Titre : Elsevier Science, Microelectronics Reliability, Volume 43, Issue 5, Pages 685-819, May 2003.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 43
Issue : 5
Pages : 685 - 819
Date : May 2003

[1] : Integrating testability with design space exploration, Pages 685-693
M. Zwolinski and M. S. Gaur
Lien : vide.pdf - | Full Text + Links | PDF (132 K)

[2] : Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA, Pages 695-706
Reza Ghaffarian
Lien : vide.pdf - | Full Text + Links | PDF (817 K)

[3] : Hot carrier degradation behavior in SOI dynamic-threshold-voltage nMOSFET's (n-DTMOSFET) measured by gated-diode configuration, Pages 707-711
Ru Huang, Jinyan Wang, Jin He, Min Yu, Xing Zhang and Yangyuan Wang
Lien : vide.pdf - | Full Text + Links | PDF (153 K)

[4] : Improvement of poly-silicon hole induced gate oxide failure by silicon rich oxidation, Pages 713-724
Summer F. C. Tseng, Wei-Ting Kary Chien and Bing-Chu Cai
Lien : vide.pdf - | Full Text + Links | PDF (583 K)

[5] : Optimization of on-chip ESD protection structures for minimal parasitic capacitance, Pages 725-733
Xiaofang Gao, Juin J. Liou, Joe Bernier, Gregg Croft, Waisum Wong and Satya Vishwanathan
Lien : vide.pdf - | Full Text + Links | PDF (350 K)

[6] : Electrical reliability of highly reliable 256M-bit mobile DRAM with top-edge round STI and dual gate oxide, Pages 735-739
Chihoon Lee, Donggun Park, Hyeong Joon Kim and Wonshik Lee
Lien : vide.pdf - | Full Text + Links | PDF (312 K)

[7] : Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill, Pages 741-749
Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton and Zhaowei Zhong
Lien : vide.pdf - | Full Text + Links | PDF (423 K)

[8] : Reliability of Au bump––Cu direct interconnections fabricated by means of surface activated bonding method, Pages 751-756
Qian Wang, Naoe Hosoda, Toshihiro Itoh and Tadatomo Suga
Lien : vide.pdf - | Full Text + Links | PDF (488 K)

[9] : Isothermal aging characteristics of Sn–Pb micro solder bumps, Pages 757-763
K. S. Kim, C. H. Yu, N. H. Kim, N. K. Kim, H. J. Chang and E. G. Chang
Lien : vide.pdf - | Full Text + Links | PDF (527 K)

[10] : Prediction and verification of process induced warpage of electronic packages, Pages 765-774
W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, K. S. Chian and S. Yi
Lien : vide.pdf - | Full Text + Links | PDF (620 K)

[11] : Field failure due to creep corrosion on components with palladium pre-plated leadframes, Pages 775-783
Ping Zhao and Michael Pecht
Lien : vide.pdf - | Full Text + Links | PDF (528 K)

[12] : Thermal design of a broadband communication system with detailed modeling of TBGA packages, Pages 785-793
Z. Zhao
Lien : vide.pdf - | Full Text + Links | PDF (619 K)

[13] : Accurate natural convection modelling for magnetic components, Pages 795-802
Vencislav Valchev and Alex Van den Bossche
Lien : vide.pdf - | Full Text + Links | PDF (201 K)

[14] : Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages, Pages 803-809
T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh and W. C. Tjiu
Lien : vide.pdf - | Full Text + Links | PDF (325 K)

[15] : Development of the green plastic encapsulation for high density wirebonded leaded packages, Pages 811-817
T. Y. Lin, C. M. Fang, Y. F. Yao and K. H. Chua
Lien : vide.pdf - | Full Text + Links | PDF (474 K)

[16] : High Performance Memory Testing: Design Principles, Fault Modeling and Self-Test; R. Dean Adams, Kluwer Academic Publishers, Boston, 2003, Hardcover, pp. 247, plus XIII, €142, ISBN 1-4020-7255-4, Page 819
Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (38 K)

[17] : Calendar of forthcoming events, Pages I-IX
PDF (41 K)

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