Revue : [REVUE303]
Titre : Elsevier Science, Microelectronics Reliability, Volume 38, Issue 4, Pages 497-708 (April 1998.
Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.Auteur : Elsevier Science
Volume : 38, Issue 4,
Pages : 497-708 (April 1998)
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[1] : Failure mechanisms due to metallurgical interactions in commercially
available AlGaAs/GaAs and AlGaAs/InGaAs HEMTs, Pages 497-506
Gaudenzio MeneghessoFabrizio Magistrali, Danila Sala and Massimo
VanziClaudio Canali and Enrico Zanoni
Lien : vide.pdf - | Journal Format-PDF (849 K)
[2] : Correlation between light emission and currents in pseudomorphic HEMTs,
Pages : 507-510
P. Cova, F. Fantini and M. Manfredi
Lien : vide.pdf - | Journal Format-PDF (252 K)
[3] : Persistent photoconductivity as a tool for monitoring oxide cluster
concentration in silicon wafers, Pages 511-514
Y. Haddab, D. Manic and R. S. Popovic
Lien : vide.pdf - | Journal Format-PDF (187 K)
[4] : A biased percolation model for the analysis of electronic-device
degradation, Pages 515-521
Z. GinglC. PennettaL. B. KissL. Reggiani
Lien : vide.pdf - | Journal Format-PDF (502 K)
[5] : Thermomechanical failures in microelectronic interconnects, Pages 523-529
J. W. EvansJ. Y. EvansP. LallS. L. Cornford
Lien : vide.pdf - | Journal Format-PDF (435 K)
[6] : Methodology for creating "rejuvenating" devices, Pages 531-537
E. M. Baskin
Lien : vide.pdf - | Journal Format-PDF (360 K)
[7] : Hot-carrier reliability in N-MOSFETs used as pass-transistors, Pages
539-544
D. Goguenheim and A. BravaixD. VuillaumeM. Varrot, N. Revil and P. Mortini
Lien : vide.pdf - | Journal Format-PDF (348 K)
[8] : Design of random inspection rate for a flexible assembly system: a
heuristic genetic algorithm approach, Pages 545-551
Lin Chinho, Jong-Mau Yeh and Jieh-Rern Ding
Lien : vide.pdf - | Journal Format-PDF (371 K)
[9] : Three-dimensional modeling of the heat flow into a GaAs substrate.
Influence of thermal phenomena on the RF behavior of power HBTs and
technological optimization, Pages 553-557
P. Souverain, T. Camps, M. S. Faleh, A. Cazarré, J. Tasselli, A. Marty and
J. P. Bailbé
Lien : vide.pdf - | Journal Format-PDF (300 K)
[10] : Thermal microscopy and heat generation in electronic devices, Pages
559-565
A. Majumdar
Lien : vide.pdf - | Journal Format-PDF (419 K)
[11] : Impact of latch phenomenon on low-frequency noise in SOI MOSFETs, Pages
567-570
J. Jomaah and F. Balestra
Lien : vide.pdf - | Journal Format-PDF (226 K)
[12] : A modular neural network approach to microelectronic circuit yield
optimization, Pages 571-580
A. A. Ilumoka
Lien : vide.pdf - | Journal Format-PDF (643 K)
[13] : Impact of pre-conditioning, voltage bias and temperature on reliability of
plastic encapsulated microcircuits, Pages 581-584
P. Sharma, K. Upadhyayula, L. Lantz and M. Pecht
Lien : vide.pdf - | Journal Format-PDF (248 K)
[14] : Stochastic analysis of a repairable system with three units and two repair
facilities, Pages 585-595
Wei Li, Attahiru Sule Alfa and Yiqiang Q. Zhao
Lien : vide.pdf - | Journal Format-PDF (491 K)
[15] : Functionality fault model: a basis for technology-specific test
generation, Pages 597-604
Andrej emva and Baldomir Zajc
Lien : vide.pdf - | Journal Format-PDF (543 K)
[16] : Design and analysis of a self-testing-and-repairing random access memory
"star-ram" with error correction, Pages 605-617
Kamal A. Mehdi and J. M. Kontoleon
Lien : vide.pdf - | Journal Format-PDF (742 K)
[17] : Electrostatic discharge (ESD) protection for CMOS output buffers in
scaled-down VLSI technology, Pages 619-639
Ming-Dou Ker
Lien : vide.pdf - | Journal Format-PDF (1170 K)
[18] : Localized monitoring of electromigration with early resistance change
measurements, Pages 641-650
J. V. Manca, K. Croes, W. De Ceuninck, V. D'haeger, J. D'haen, P. Depauw,
L. Tielemans and L. De Schepper
Lien : vide.pdf - | Journal Format-PDF (706 K)
[19] : Damage to n-MOSFETs from electrical stress relationship to processing
damage and impact on device reliability, Pages 651-657
L. Trabzon and O. O. Awadelkarim
Lien : vide.pdf - | Journal Format-PDF (529 K)
[20] : Fault tree analysis in case of multiple faults, especially covered and
uncovered ones, Pages 659-663
Winfrid G. Schneeweiss
Lien : vide.pdf - | Journal Format-PDF (226 K)
[21] : Accelerated popcorn testing of high solder-reflow crack resistant molding
compounds, Pages 665-669
T. R. Tubbs and A. A. Gallo
Lien : vide.pdf - | Journal Format-PDF (326 K)
[22] : Discussion on physical models for burst noise in a forward biased P-N
junction and their experimental validation, Pages 671-675
Dai Yisong, Li Yaqin and Xu Jiansheng
Lien : vide.pdf - | Journal Format-PDF (330 K)
[23] : A study on failure probability of a system including a protecting device,
Pages : 677-679
Keiji TakagiTadashi Yamoto
Lien : vide.pdf - | Journal Format-PDF (135 K)
[24] : Plastic encapsulated microcircuit reliability predicition: Why?, Pages
681-683
Edward B. Hakim
Lien : vide.pdf - | Journal Format-PDF (249 K)
[25] : A hybrid model for weekday replacements with infant mortality failures,
Pages : 685-688
Mark Smotherman, William Todd Stinson and Madhu Chetuparambil
Lien : vide.pdf - | Journal Format-PDF (240 K)
[26] : Reliability and qualification methodology of 60 W QCW linear bar arrays,
Pages : 689-696
M. P. StoltzP. Burgaud and F. MurgadellaJ. P. Hirtz, P. Petit and A.
Vervoitte
Lien : vide.pdf - | Journal Format-PDF (499 K)
[27] : Book Review, Page 697
Lien : vide.pdf - Format-PDF (62 K)
[28] : Book Review, Page 698
Lien : vide.pdf - Format-PDF (62 K)
[29] : Book Review, Page 699
Lien : vide.pdf - Format-PDF (57 K)
[30] : Book Review, Page 700
Lien : vide.pdf - Format-PDF (66 K)
[31] : Book Review, Page 701
Lien : vide.pdf - Format-PDF (50 K)
[32] : Book Review, Page 702
Lien : vide.pdf - Format-PDF (47 K)
[33] : Book Review, Pages 703-704
Lien : vide.pdf - Format-PDF (184 K)
[34] : Book Review, Pages 705-706
Lien : vide.pdf - Format-PDF (91 K)
[35] : Book Review, Page 707
Lien : vide.pdf - Format-PDF (89 K)
[36] : Book Review, Page 708
Lien : vide.pdf - Format-PDF (59 K)
[37] : Editorial, Page iii
Lien : vide.pdf - Format-PDF (49 K)
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