Article : [PAP475]

Info : REPONSE 2, le 08/12/2001.

Titre : J.-M. THEBAUD, E. WOIRGARD, C. ZARDINI, K.-H. SOMMER, Thermal Fatigue Resistance Evaluation of Solder Joints in IGBT Power Modules for Traction Applications, PESC'2000.

Cité dans : [CONF012] PESC, Power Electronics Specialists Conference, PELS Society, juin 2007.
Cité dans : [DIV289]  Recherche sur l'auteur Christian ZARDINI, juillet 2004.
Cité dans : [DIV441]  Recherche sur l'auteur Eric WOIRGARD, juillet 2004.

Source : PESC'20000
Lieu : Galway, Ireland
Site : http://PESC00.ucg.ie/
Date : June 18-23 2000
Lien : Pesc/pesc2000/advance.pdf
Meeting : 2000 IEEE 31st Annual Power Electronics Specialists Conference (PESC).
Source : PESC Record - IEEE Annual Power Electronics Specialists Conference v 3 2000.
Pages : 1285 - 1290
Info : IEEE, Piscataway, NJ, USA, 00CB37018
CODEN : PRICDT
ISSN : 0275-9306
Année : 2000
Meeting_Number : 45004
Document_Type : Conference Article
Treatment_Code : Theoretical; Experimental
Language : English
Stockage :

Abstract :
Several ageing test campaigns have been carried out to evaluate thermal fatigue resistance of solder alloys used in IGBT power modules.
The solder joint between the ceramic substrate and the copper baseplate of this stack packaging has been the focus of these experiments.
Indeed this interconnection layer is highly subject to shear strains and stresses due to the mismatched expansion on either side of the solder joint during operation.
The impact of the substrate metallization and of the cooling rate has been evaluated by measuring crack growth rate on cross sections of cycled solder joints.
Two solder alloy compositions have been selected: a lead-free one and a leadbearing one. Scanning Electronic Microscopy analyses have allowed to study cracking at microstructural level.
Moreover, additional analyses based on Scanning Acoustic Microscopy have led to a ranking of the batches under test. Best results in terms of thermal fatigue resistance have been obtained with the leadbearing solder alloy.
Furthermore, it has been shown that the use of bare copper substrates and above all fast cooling rate after the solder reflow delay solder joint failure.(Author abstract)

Références : 16 Refs.

Accession_Number : 2001(15):2352 COMPENDEX

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