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JAMES R LLOYD -
Interconnect Reliability |
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James R. "Jim" Lloyd specializes in
electromigration and metallization reliability for chip and
packaging applications, reliability testing and analysis,
qualification plans, and electromigration failure modeling. His
industrial experience includes reliability engineering and R&D
positions at IBM and Digital Equipment Corporation. In addition, he
was visiting scientist at Max-Planck-Institut in Stuttgart, Germany.
He has published more than 60 papers on semiconductor materials
science and reliability engineering, has been invited to speak to
audiences throughout the world, and has taught courses and workshops
at Stevens Institute of Technology, New York Polytechnic, MRS, ASM,
IBM, Digital Equipment, IRPS and ESREF (Europe). He holds the Ph.D.,
M.S., and B.S. degrees in materials science and engineering from
Stevens Institute of Technology. | |
