Prepare for EuroSimE 2005

The 6th IEEE EuroSimE conference will be held in Berlin, Germany, on April 17 (courses) and 18-19-20, 2005 (conference and exhibition). · Short courses (April 17) will be offered for professional training. Subjects to be announced later. · Three days of technical sessions (April 18-20) for oral and poster presentation. · A parallel exhibition from industrial contributors and simulation and optimization software companies.

Background

One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development.

Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. The 6th in the series, EuroSimE 2005 aims to:

• promote further development and application of simulation methodologies and tools for the electronics industry,
• improve communication and exchange information between methodology & tool-developers and industry users,
• strengthen co-operation between industry, universities, and research institutes.

Scope of EuroSimE

• mechanical simulation (both static and dynamic),
• thermo-mechanical simulation,
• thermal simulation,
• material characterisation experiments and modelling,
• thin-film mechanics,
• failure criteria and damage-modelling (fatigue, creep, delamination, cracks, buckling, large deformation, moisture-induced failures, yield),
• fracture, continuum, and micro-mechanics in (micro)-electronics,
• interface strengths,
• experiments for model verification,
• simulation in reliability engineering,
• (micro)-electronic product and/or process optimisation,
• simulation-based optimisation,
• simulation for reliability improvement/failure prediction,
• virtual and accelerated reliability qualification,
• design rule development via simulation,
• virtual prototyping in product and/or process design,
• from micro to macro simulation,
• multi-physics simulation,
• advanced numerical and analytical simulation methodologies and tools.

Applications

The applications will cover all fields of (micro)-electronics and microsystems, but not limited to:

• Wafer processing and chip design,
• PWB design and application,
• Components and packaging (traditional packages, flip-chip, BGA, CSP, Wafer-Level packages, MCM, Opto-electronic packages, MEMS),
• Microsystems,
• Interconnections,
• Systems,
• Materials of (micro)-electronics,
• Processes in (micro)-electronics