Organization Committees of EuroSimE 2005

General chair: G.Q. Zhang (Philips CFT & Eindhoven University of Technology,
The Netherlands)

Co-chair: R. Dudek (Fraunhofer Institute IZM)

Technical Committee:

• Chair: L.J. Ernst (Technical University of Delft, The Netherlands)
• Co-chair: P. Rodgers (CALCE Electronic Products and Systems Center, University of Maryland, USA)
• Co-chair: S. Marco (Universitat de Barcelona Spain)
• Co-chair: M. Meuwissen (TNO, the Netherlands)

Exhibition Committee:

• Chair: W. Van Driel (Philips Semiconductors, The Netherlands)
• Co-chair: A. Wymyslowski (Wroclaw University of Technology, Poland)

Short Course Committee:

• Chair: M. Meuwissen (TNO, The Netherlands)

Publicity Committee:

• Chair: B. Vandevelde (IMEC, Belgium)
• Co-chair: D. Andersson (IVF, Sweden)

Industry Liaison Committee :

• Chair: T. Reinikainen (Nokia, Finland)
• Co-chair: W. Nüchter (Robert Bosch, Germany)
• Co-chair: B. Schwarz (Siemens, Germany)
• Co-chair: H. Pape (Infineon, Germany)

International advisory committee:

• B. Michel IZM Germanys
• D. H. van Campen Eindhoven University of Technology, The Netherlands
• P. Wesling IEEE/CPMT, USA
• C.P. Wang Georgia institute of technology, USA
• A.J. van Roosmalen Philips, The Netherlands
• S. Pienimaa Nokia, Finland
• M. Meerten IMEC, Belgium

Technical Committee :

• Chair: Ernst, L.J. Delft University of Technology Netherlands
• Co-Chair for Thermal Issues: Rogers, P. CALCE Electronic Products and Systems Center, University of Maryland USA
• Co-Chair for multi-physics issues: Marco, S. Universitat de Barcelona Spain
• Co-Chair for poster: Meuwissen, M. TNO The Netherlands

Members:

Andersson, D. R. IVF Sweden
Bailey, C. University of Greenwich UK
Baelmans, M. K.U. Leuven Belgium
Beyne, E. IMEC Belgium
Chiang, K. National Tsing Hua University/ITRI Taiwan
Cordero, N. NMRC Ireland
Corigliano, A. Polimi. Politecnico di Milano Itatly
Dudek, R. Fraunhofer IZM Germany
Eveloy, V. Electronics Thermal Management, Ltd. Ireland.
Fan, X.J. Intel Corporation USA
Gonzalez, M. IMEC Belgium
Geers, M. G.D. Eindhoven University of Technology Netherlands
Hanreich, G. Vienna University of Technology Austria
Iwamoto, N. Honeywell USA
Kyyhkynen, V. Nokia Finland
Lee, R. Hong Kong Univ. of Science & Technology China
Liu, Y. Fairchild USA
Leisner, P. Acreo Sweden
Marco, S. Universitat de Barcelona Spain
Madenci, E. University of Arizona USA
Nuechter, W. Robert Bosch GmbH Germany
Pape, H. Infineon Germany
Rantala, J. Nokia Finland
Reinikainen, T. Nokia USA
Schwarz, B. Siemens Germany
Sabry, M.N. Université Française d'Egypte Egypt
Sitaraman, S. K. Georgia Tech USA
Tay, A.O. NUS Singapore
Tong, Y.T. STMicroelectronics Singapore
Toonder, J.M.J. den Philips Netherlands
Vandevelde, B. IMEC Belgium
Wang, Z.P.Philips China
Wiese, S. Technical University of Dresden Germany
Wolf, I. de IMEC Belgium
Wymyslowski, A. Wroclaw University of Technology Poland
Zahlan, N. ICI UK
Zhang, G.Q. Philips CFT
Zhou, J. Lamar University USA