Article : [ART582]

Info : REPONSE 18, le 31/03/2004.

Titre : Materials selection issues for high operating temperature (HOT) electronic packaging, 1998.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.

Source : 1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)
Editor(s): Golecki, I.; Kolawa, E.; Gollomp, B.
New York, NY, USA: IEEE, 1998. p.180-9 of xvi+221 pp. 13 refs.
Conference: San Diego, CA, USA, 22-27 Feb 1998
Sponsor(s): IEEE Electron Devices Soc.; IEEE Instrum. & Meas. Soc
Price: CCCC 0 7803 4437 5/98/$10.00
ISBN: 0-7803-4437-5
Document_Type : Conference Article
Treatment_Code : Application; Practical
Info : Country of Publication : United States
Language : English
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Abstract :
Currently, there are two major drivers for high operating temperature (HOT) electronics in the 135-200 degrees C range. Products with significant heat generation such as power electronics or small portable electronics without space for cooling mechanisms provide a large market segment in the low end of this temperature range. The upper end of the temperature regime is represented by products that are placed into a HOT environment such as distributed sensors and control systems. Use of polymers for packaging in these applications is typically hampered by the low thermal conductivity and thermal degradation resistance of polymeric materials used in low-cost laminate PWB technology. Also, HOT applications generally require exposure to rigorous thermal cycling for power up and down and environmental exposure. Classes of polymeric materials appropriate for the various aspects of electronic packaging at high operating temperatures and -55 degrees C-225 degrees C cycling are discussed. Also, a new electronic packaging technology which uses some elements of laminate, except that circuits are directly deposited on insulated metal substrates, is presented. This packaging has several-fold better thermal conductivity than conventional ceramic or polyimide glued-to-heat-sink HOT packaging, is more mechanically robust than ceramic, is lightweight and compact and can be deposited on 3D surfaces to minimize space requirements. Multilayer circuits with dimensions as small as 50 mu m lines and spaces and 75 mu m vias are possible, as well as large dimension circuits for power applications. This approach is also more cost effective than conventional HOT packaging.

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