Article : [ART535]

Info : REPONSE 106, le 31/03/2004.

Titre : Reliability concerns in high temperature electronic systems.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.

Source : 1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)
Editor(s): Golecki, I.; Kolawa, E.; Gollomp, B.
New York, NY, USA: IEEE, 1998. p.199-206 of xvi+221 pp. 14 refs.
Conference: San Diego, CA, USA, 22-27 Feb 1998
Sponsor(s): IEEE Electron Devices Soc.; IEEE Instrum. & Meas. Soc
Price: CCCC 0 7803 4437 5/98/$10.00
ISBN: 0-7803-4437-5
Document_Type : Conference Article
Treatment_Code : Application; Practical; Experimental
Info : Country of Publication : United States
Language : English
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Abstract :
Small signal commercial electronics have traditionally been designed to operate at temperatures below 125 degrees C. This has become a severe constraint in the development of next generation smart power electronic systems, such as remote actuators, point-of-use power supplies, and distributed high power control systems. These systems dissipate considerable heat and can operate in environments where the local ambient temperatures reach 200 degrees C. The ability to operate these systems without the need for active cooling is seen as a critical technology for the 21st century. The issues involved in designing silicon-based electronic systems for use at temperatures as high as 200 degrees C are presented in this work. The critical limiting components and packaging materials have been identified through design analyses conducted on commercially available aeronautic and automotive control modules. It is found that most standard components and packaging elements can be used up to 200 degrees C. However, capacitors, wire bonds, eutectic tin-lead solder joints, and FR-4 boards seriously degrade at temperatures around 200 degrees C. For these elements, alternative choices are recommended.

Accession_Number : 1999:6189541 INSPEC

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