Article : [ART531]

Info : REPONSE 58, le 31/03/2004.

Titre : Characterization of advanced materials for high voltage/high temperature power electronics packaging.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.

Source : APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181)
Piscataway, NJ, USA: IEEE, 2001. p.1062-7 vol.2 of 2 vol. xxxii+1314 pp. 21 refs.
Conference: Anaheim, CA, USA, 4-8 March 2001
Sponsor(s): IEEE Power Electron. Soc.; IEEE Ind. Applications Soc.; Power Sources Manuf. Assoc
Price: CCCC 0 7803 6618 2/2001/$10.00
ISBN: 0-7803-6618-2
Document_Type : Conference Article
Treatment_Code : Practical
Info : Country of Publication : United States
Language : English
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Abstract :
To achieve high reliability in next generation dense, high voltage (>1 kV DC), high temperature (200 degrees C to 400 degrees C) power electronic circuits, packaging techniques from higher voltage systems (5 kV-50 kV) need to be introduced. This paper describes advanced materials, measurement and characterization techniques for this class of systems. These systems are being developed for commercial, industrial and military applications that include supplies, drives and actuators. The results are applicable to 1200 V+IGBT based module designs.

Accession_Number : 2001:6970889 INSPEC

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