Article : [ART518]

Info : REPONSE 104, le 31/03/2004.

Titre : Influence of component solderability on reliability of solder joints.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.

Meeting : Proceedings of the 1997 TMS Annual Meeting.

Info : organization : TMS
Location : Orlando, FL, USA
Date : 10 Feb 1997-13 Feb 1997

Source : Design Reliability of Solders and Soder Interconnections TMS Annual Meeting 1997.Minerals, Metals & Materials Soc (TMS), Warrendale, PA, USA.p 273-278
CODEN : 85MVAI
Année : 1997
Meeting_Number : 47830
Document_Type : Conference Article
Treatment_Code : Experimental
Language : English
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Abstract :
The commonest mode of service failure of solder joints on circuit board electronics assemblies is low-cycle thermal fatigue cracking from differential expansion during power-up and powder-down of the equipment.The resistance of a solder interconnection to fatigue cracking is governed by both its microstructure and its geometry. In turn, these are both governed by the soldering process and the manner in which the molten solder wets and flows on the component metallization; ie the component's solderability.Data will be presented, for surface mount electronics assemblies, that relate component/circuit board solderability to solder fillet shape, and in turn to solder joint reliability.The best fillet geometry varies markedly between the many different styles and compositions of metallization found on surface mounting components.Furthermore, the pass/fail criteria of solderability measurements are not necessarily related to the required solder fillet geometry for best reliability.Both infra-red reflow and wave soldering have been used, since the influence of solderability on solder fillet shape may be quite different for the different manufacturing routes. (Author abstract) 2 Refs.

Accession_Number : 1998(15):5736 COMPENDEX

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