L. LANTZ, S. HWANG, M. PECHT, "Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing", Microelectronics Reliability, Volume 42, Issues 7, pp. 1163-1170.
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Titre : L. LANTZ, S. HWANG, M. PECHT, Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing, Microelectronics Reliability, Volume 42, Issues 7, pp. 1163-1170.
Cité dans :[REVUE355] Elsevier Science, Microelectronics Reliability, Volume 42, Issue 8, Pages 1153-1248, August 2002.
Auteur : Leon Lantz
Auteur : Seongdeok Hwang
Auteur : Michael Pecht
Vers : Bibliographie
Adresse : CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742, USA
Tel. : +1-301-935-6469
Fax. : +1-301-935-6723
Lien : mailto:llantz@lps.umd.edu
Source : Microelectronics Reliability
Volume : 42
Issue : 7
Date :
Pages : 1163 - 1170
DOI : 10.1016/S0026-2714(02)00091-4
PII : S0026-2714(02)00091-4
Lien : private/LANTZ1.pdf - 144 Ko, 8 pages.
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Abstract :
This paper discusses the assessment of chemical and physical properties of nine
encapsulant materials and the tests which may be used to characterize the
encapsulants and to confirm that the encapsulants are of consistent quality. The
tests include glass transition temperature, coefficient of thermal expansion,
filler content, moisture absorption, and ionic content.
Article Outline
1. Introduction
2. Encapsulant materials
3. PEM material properties
3.1. Glass transition temperature (Tg)
3.2. Coefficient of thermal expansion
3.3. Filler content
3.4. Moisture uptake
3.5. Ionic content
4. Measurements
4.1. Tg and coefficient of thermal expansion
4.2. Filler content
4.3. Ion content
5. Results
5.1. Glass transition temperature (Tg)
5.2. Coefficient of thermal expansion
5.3. Filler content
5.4. Moisture absorption
5.5. Ion content
6. Conclusions
Acknowledgements
[Fig] : 1. Typical TMA plot of molding compound.
[Fig] : 2. Typical TGA plot of molding compound.
Table 1. Chemical composition of molding compounds (<1K)
Table 2. Typical molding compound procurement specification (<1K)
Table 3. CTE for some typical PEM materials (<1K)
Table 4. Glass transition temperature of molding compounds (sample size of 12) (<1K)
Table 5. CTE of molding compounds below Tg (sample size of 12) (<1K)
Table 6. CTE of molding compounds above Tg (sample size of 12) (<1K)
Table 7. Filler content of molding compounds (sample size of 10) (<1K)
Table 8. Moisture absorption of molding compounds (sample size of 5) (<1K)
Table 9. Ionic content of molding compounds (6K)
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