U. SCHEUERMANN, U. HECHT, "Power Cycling Lifetime of Advanced Power Modulesfor Different Temperature Swings", Proc. PCIM, PE4.5, 59-64, Nürnberg 2002.
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Article : [ART280]

Titre : U. SCHEUERMANN, U. HECHT, Power Cycling Lifetime of Advanced Power Modulesfor Different Temperature Swings, Proc. PCIM, PE4.5, 59-64, Nürnberg 2002.

Cité dans : [CONF010] PCIM, POWER CONVERSION CONFERENCE & INTELLIGENT MOTION, ZM Communications Gmbh, septembre 2009.
Cité dans : [ART281]  U. SCHEUERMANN, Reliability of Pressure Contacted Intelligent Integrated Power Modules, Proc. ISPSD'02, 7.2, 249-252, Santa Fe, NM, 2002.
Auteur : U. Scheuermann
Auteur : U. Hecht - SEMIKRON International

Adresse : SEMIKRON Elektronik GmbH, Sigmundstraße 200, 90431 Nuremberg, Germany
Tel. : ++49-911-6559-381
Fax. : ++49-911-6559-414
Lien : mailto:uwe.scheuermann@semikron.com
Site : http://www.semikron.com/
Site : http://www.semikron.com/seminew/entwicke.html
Source : Proc. PCIM, PE4.5
Pages : 59 - 64
Lieu : Nürnberg
Date : 2002
Lien : private/Scheuermann2.pdf - 06/2002 (PDF: 1,5MB)

Abstract:
Exact module lifetime prediction requires a statistical approach for the qualification of modules in end-of-
life tests. This demand can be met by a Weibull analysis of a group of samples. The results for
active power cycling tests, presented here for advanced power modules without base plate, prove the
quality of the design and process capability by a narrow distribution of end-of-life failures. The test
results for junction temperature swings of 80K and 110K can be used as a basis to investigate the
superposition of the both conditions. The validity of the linear superposition of accumulated stress is of
great importance for the transfer of lifetime test results to application-conform complex load profiles.
temperature [° C]

Bibliographie

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