THERMAL ENGINEERING ASSOCIATES

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TEA offers a series of uniquely-designed thermal test die for package characterization and design comparison. The die family, referred to as the TTD-1000 series, consists of three different sizes designed to cover a wide range of applications. Each die is easily arrayed to produce combinations that range from 0.075" (1.9 mm) to over 0.600" (15.2 mm) on a side, without having to use internal bond wires. Each die has four separate diodes strategically placed for temperature sensing at key areas of the die. All the diodes have row and column addressing, making connection to any specific diode very easy. Further, access to all individual diodes is maintained when the die are array scribed, providing the ability to sense temperature almost anywhere in the array. The dual 20 ohm heating resistors on each die can be operated in series or parallel to match the capabilities of available power supplies or thermal test instruments. The dual resistor layout also facilitates package characterization with non-uniform power dissipation. All die are sold only in wafer form.

If you would like a full data sheet on the TTD-1000 series of Thermal Test Die, please contact us by e-mail using the address shown on the main page. You can also use the TEA message response form.

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