| The 4th THERMINIC Workshop | ||
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27-29 September 1998, Cannes, France |
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The 4th Therminic Workshop met in Cannes from September 27 to 29, 1998. The workshop was organized by TIMA Laboratory and the TU Budapest, sponsored by the IEEE Computer Society, Test Technology Technical Committee, the TIMA Laboratory in cooperation with the THERMINIC and DETERMIN projects supported by EC/ESPRIT, the European Test Technology Technical Committee and with SPIE (the Society of Photo-Optical Instrumentation Engineers). |
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This workshop gathered submissions from around the world, out of which the program committee accepted 23 contributions for oral presentation and 24 ones for poster presentation. |
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| Program overview |
Sunday 27 September 1998 |
Monday 28 September 1998 |
Tuesday 29 September 1998 | |||
| Arrival | 9:00 | Session 2: SENSORS AND ACTUATORS | 9:00 | Invited
Talk R. Mahajan Intel Corp., Hillsboro, USA | |
| 14:00 | Registration | 10:20 | Coffee | 9:40 | Coffee |
| 15:00 | Welcome address | 10:40 | Vendor presentations | 10:00 | Session
4: THERMAL SIMULATION |
| 15:10 | Opening adress | 12:00 | Lunch | 12:15 | Lunch |
| 15:20 | Invited
Talk B.Guenin AMKOR Electornics, Chandler, USA |
13:30 | Free Time | 14:00 | Session
5: THERMAL MEASUREMENT TECHNIQUES |
| 16:00 | Coffee | 16:00 | Session
3: ELECTRO-THERMAL SIMULATION |
15:40 | Special
Session: A FINAL STATUS REPORT ON THE SEED PROJECT: RESULTS AND FUTURE CHALLENGES |
| 16:20 | Session 1: DYNAMIC THERMAL MEASUREMENT AND EVALUATION | 17:20 | Coffee | 16:20 | Closing Remarks |
| 17:40 | Coffee | 17:40 | Poster Session 2 | ||
| 18:00 | Poster Session 1 | 18:45 | Banquet | ||
| 19:30 | Reception | 20:30 | Panel: INDUSTRY NEED FOR AN INTEGRATED THERMAL ANALYSIS/CAD ENVIRONMENT: FROM CHIP TO PACKAGE TO SYSTEM | ||
| Detailed program |
| Sunday 27 September | ||
|---|---|---|
| 14:00 | Registration | |
| 15:00 | Welcome
address
B. Courtois, General Chair TIMA Laboratory, Grenoble, France |
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| 15:10 | Opening
address
H. Rajbenbach European Commission - DGIII, Brussels, Belgium |
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| 15:20 |
Invited talk B. Guenin AMKOR Electronics, Chandler, USA Chair: TBD |
CHARACTERIZATION OF A DELAMINATED INTERFACE IN A PLASTIC SEMICONDUCTOR PACKAGE AND ITS EFFECT ON THERMAL PERFORMANCE |
| 16:00 | Coffee | |
| 16:20
17:40 |
Session 1
Chair: W. Claeys Univ. Bordeaux, France |
DYNAMIC THERMAL MEASUREMENT AND EVALUATION |
| 16:20 | V. Szekely, M.
Rencz, S. Török, G. Végh, Zs. Benedek, Cs. Marta, J.
Mizsei
Techn. Univ. of Budapest, Hungary |
ADVANCES IN THE THERMAL MEASUREMENT AND EVALUATION TECHNICS |
| 16:40 | M. Carmona, S.
Marco, J. Palacin, J. Samitier
Univ. de Barcelona, Spain |
A TIME-DOMAIN METHOD FOR THE ANALYSIS OF THERMAL IMPEDANCE RESPONSE PRESERVING THE CONVOLUTION FORM |
| 17:00 | L. Pellegrino1,
P.E. Bagnoli2, M. Madella1, A. Piccirillo1
1CSELT, Torino, Italy 2Univ. di Pisa, Italy |
SPATIALLY RESOLVED THERMAL CHARACTERIZATION OF PACKAGED VERTICAL CAVITY SURFACE-EMITTING LASERS |
| 17:20 | Z. Suszynski
Techn. Univ. of Koszalin, Poland |
EXAMINATION OF
THE BIPOLAR TRANSISTORS SOLDERING QUALITY: THEORY AND EXPERIMENT |
| 17:40 | Coffee | |
| 18:00
19:00 |
Poster session
1
Chair: M. Rencz Techn. Univ. of Budapest, Hungary |
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| G. Hajas, L.
Liptak-Fego
Techn. Univ. of Budapest, Hungary |
CHARACTERIZATION OF SUBMICRON BULK AND SOI MOS TRANSISTORS FOR ELECTROTHERMAL AND LOGI-THERMAL SIMULATION | |
| U. Dillner, M.
Zieren, J.M. Köhler
IPHT, Jena, Germany |
THERMAL DESIGN OF MICROCALORIMETERS BASED ON FINITE ELEMENT SIMULATION | |
| P. Bratek, P.
Dziurdzia, A. Kos
Univ. of Mining and Metallurgy, Krakow, Poland |
OPTIMISATION OF COOLING PROCESS WITH ACTIVE HEAT SINKS | |
| S. Narasimhan,
B. Kusha
Fluent Inc., Santa Clara, USA |
CHARACTERIZATION AND VERIFICATION OF COMPACT HEAT SINK MODELS | |
| M. K. Berhe,
R. Nair
Fluent Inc., Lebanon, USA |
NUMERICAL SIMULATIONS OF HEAT SINKS AND THEIR REPRESENTATION BY COMPACT HEAT SINK MODELS | |
| S. Di Pascoli1,
P.E. Bagnoli1, C. Casarosa1, V. Ciuti2,
A. Lorelli1
1Univ. of Pisa, Italy 2Accademia Navale, Livorno, Italy |
THERMAL PROPERTIES OF INSULATED METAL SUBSTRATE TECHNOLOGY | |
| V. Lysenko1,2,3,Ph.
Roussel1, B. Remaki1, G. Delhomme1, A.
Dittmar1, D. Barbier1, C.Martelet2, V.
Strikha3
1INSA Lyon, France 2Ecole Centrale Lyon, France 3Kyiv. T. Shevchenko Univ., The Ukraine |
FORMATION OF THICK OXIDIZED MESO-POROUS SILICON LAYERS WITH LOW THERMAL CONDUCTIVITY FOR THERMAL ISOLATION APPLICATIONS | |
| A. Merticaru,
V. Moagar-Poladian
National Inst. of Microtechnology, Bucharest, Romania |
THERMO-MECHANICAL PROPERTIES OF HOLLOW INSULATOR THIN FILM | |
| L. Boarino1,
G. Lerondel1, E. Monticone1, R. Steni1,
G. Amato1, G. Benedetto1, V. Lacquaniti1,
R. Spagnolo1, P. Roussel2, V. Lysenko2,
B. Remaki2, G. Delhomme2, A. Dittmar2,
D. Barbier2
1IEN "Galileo Ferraris", Torino, Italy 2INSA Lyon, France |
DESIGN AND FABRICATION OF METAL BOLOMETERS ON HIGH POROSITY SILICON LAYERS | |
| K.S. Teh, L.
Lin
The Univ. of Michigan, Ann Arbor, USA |
TIME-DEPENDENT BUCKLING PHENOMENON OF POLYSILICON MICRO BEAMS | |
| F. Jablonski,
M. Napieralska
Techn. Univ. of Lodz, Poland |
MICROMACHINED
ELECTRO-THERMAL CONVERTER: MEASUREMENTS AND PARAMETER EXTRACTION |
|
| D. Veychard1,
Ph. Hazard2, J-M. Karam1
1TIMA Lab., Grenoble, France 2Schneider Electric SA, Nanterre, France |
ELECTRO-THERMAL CONVERTER WITH HIGH TIME CONSTANT | |
| 19:30 | Reception | Monday 28 September |
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9:00
10:20 |
Session
2
Chair: G. De Mey Univ. of Gent, Belgium |
SENSORS AND ACTUATORS |
| 9:00 | C. Shafai1,
M.I. Brett2
1Univ. of Manitoba, Winnipeg, Canada 2Univ. of Alberta, Edmonton, Canada |
ON-CHIP THIN FILM PELTIER HEAT PUMPS |
| 9:20 | L. Langley1,
G. Matijasevic2, P. Gandhi2
1Vatell Corp., Blacksburg, USA 2Ormet Corp., Carlsbad, USA |
HIGH SENSISTIVITY, LARGE AREA HEAT FLUX SENSORS FABRICATED USING A NOVEL MATERIALS AND PATTERNING TECHNOLOGY |
| 9:40 | M. Kimura, J.I.
Hayasaka, C. Sawai, T. Aizawa
Tohoku-Gakuin Univ., Miyagi, Japan |
CHARACTERIZATION OF THE MICRO-THERMAL ANALYSIS SENSOR AND PROPOSAL OF TRANSISTOR-THERMISTOR FOR TEMPERATURE MEASUREMENT OF ITS SI-SUBSTRATE |
| 10:00 | A.V. Korlyakov1,
V.V. Luchinin1, I.V. Nikitin1, V. Busch2,
H.D. Liess2, J. Lademann3
1St Petersburg State Electr. Univ., Russia 2Univ. of German Armed Forces, Muenchen, Germany 3Humboldt Univ. Berlin, Germany |
STABLE INTEGRATED
SiC-BASED MICROSYSTEMS: HEATER/TEMPERATURE SENSOR |
| 10:20 | Coffee | |
| 10:40 | Vendor presentations | |
| 12:00 | Lunch | |
| 13:30 | Free time | |
| 16:00
17:20 |
Session 3
Chair: U. Dillner IPHT, Jena, Germany |
ELECTRO-THERMAL SIMULATION |
| 16:00 | M.N. Sabry
Mansoura Univ., Egypt |
STATIC AND DYNAMIC THERMAL MODELLING OF IC'S |
| 16:20 | G. Digele1,2,
S. Lindenkreuz1, E. Kasper
1Robert Bosch GmbH, Reutlingen, Germany 2Univ. of Stuttgart, Germany |
FAST ELECTRO-THERMAL CIRCUIT SIMULATION USING REDUCED ORDER MODELS |
| 16:40 | V. Szekely, A.
Poppe, M. Rencz, A. Pahi, Sz. Hajder, G. Hajas
Techn. Univ. of Budapest, Hungary |
STRUCTURAL AND ALGORITHMIC QUESTIONS OF A PLATFORM INDEPENDENT ELECTRO-THERMAL SIMULATOR |
| 17:00 | H. Laiz1,
M. Klonz2
1INTI,San Martin, Argentina 2PTB, Braunschweig, Germany |
DYNAMIC NONLINEAR ELECTRO-THERMAL SIMULATION OF A THIN-FILM THERMAL CONVERTER |
| 17:20 | Coffee | |
| 17:40
18:40 |
Poster session
2
Chair: M. Rencz Techn. Univ. of Budapest, Hungary |
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| T. Dalton, J.
Punch, M. Davies
Univ. of Limerick, Ireland |
AN EXPERIMENTAL METHODOLOGY FOR THE DETERMINATION OF COMPACT THERMAL MODELS OF ELECTRONIC DEVICES | |
| M. Furmanczyk1,
A. Napieralski1, E. Yu, A. Przekwas2, M. Turowski1,2
1Techn. Univ. of Lodz, Poland 2CFD Research Corp., Huntsville, USA |
THERMAL MODEL REDUCTION FOR INTEGRATED CIRCUITS | |
| K.O. Petrosjanc1,
P.P. Maltcev1, N.I. Rjabov1, V.N. Gridin2,
L.N. Kravtchenko3
1Moscow Univ. of Electr. & Maths, Russia 2Russian Acad. of Sciences, Odintsovo, Russia 3SRIM, Moscow, Russia |
THERMAL INVESTIGATIONS OF HIGH-SPEED DIGITAL GaAs ICs | |
| A. Kaminski,
J. Jouglar, C. Volle, S. Natalizio, P.L. Vuillermoz, A. Laugier
INSA Lyon, France |
NON DESTRUCTIVE CHARACTERIZATION OF DEFECTS IN DEVICES USING INFRARED THERMOGRAPHY | |
| M. Malinski1,
L. Bychto1, R. Kisiel2
1Techn. Univ. of Koszalin, Poland 2Techn. Univ. of Warsaw, Poland |
PHOTOACOUSTIC MEASUREMENTS OF THE THERMAL PROPERTIES OF THE ELECTRICALLY CONDUCTING ADHESIVES USED IN THE ASSEMBLY OF ELECTRONIC COMPONENTS | |
| Z. Suszynski
Techn. Univ. of Koszalin |
PHOTOACOUSTIC DIAGNOSTIC OF THE POWER TRANSISTORS ENCAPSULATION | |
| C. A. dos Reis
Filho
State Univ. of Campinas, Brasil |
CURRENT-FEEDBACK LINEARIZATION TECHNIQUE FOR Pt100 RTD’s | |
| J.E. Duarte1,
F.H Fernandez Morales1, J. Sieiro2, S. Leseduarte2,
M. Moreno2
1Univ. Pedag. Y Tecno., Boyaca, Colombia 2Univ. de Barcelona, Spain |
THERMO-MECHANICAL MODELING OF A THERMO-OPTICALLY ACTUATED SILICON MEMBRANE | |
| S. Tuli, A. Gupta,
A. Moghe
Indian Inst. of Techno., New Delhi, India |
MIRAGE BASED PROFILING OF CURRENT CARRYING MICROCONDUCTORS | |
| Ch. S. Roumenin,
A. Ivanov, P. Nikolova
Inst. of Control and System Research, Sofia, Bulgaria |
TEMPERATURE INDUCED ANISOTROPY EFFECT IN DIODE MICROSTRUCTURES BASED MAGNETIC SENSORS | |
| S.Q. Ling, B.Q.
Le, R.F. Conde
Johns Hopkins Univ., Laurel, USA |
THERMAL ASSESSMENT OF A MINIATURIZED SPACEBORNE COMMAND & DATA HANDLING IN YOUR PALM (C&DHIYP) | |
| A. Morrissey1,
J.Alderman1, G. Kelly1, Zs.Kohari2, A.
Pahi2, M. Rencz2
1NMRC, Cork, Ireland 2Techn. Univ. of Budapest, Hungary |
3D PACKAGING OF A MICROSYSTEM WITH SPECIAL THERMAL CONSTRAINTS | |
| 18:45 | Banquet | |
| 20:30 | Panel
Moderator: B. Guenin AMKOR Electronics, Chandler, USA |
INDUSTRY NEED
FOR AN INTEGRATED THERMAL ANALYSIS/CAD ENVIRONMENT: FROM CHIP TO PACKAGE TO SYSTEM |
Tuesday 29 September |
| 9:00
9:40 |
Invited talk
R. Mahajan Intel Corp., Hillsboro, USA Chair: V. Székely Techn. Univ. of Budapest, Hungary |
THERMAL INTEGRATION
CHALLENGES IN COMPUTING: THE NEED FOR PREDICTIVE CAPABILITIES |
| 9:40 | Coffee | |
| 10:00
11:40 |
Session 4
Chair: Y. Zorian LogicVision, Princeton, USA |
THERMAL SIMULATION |
| 10:00 | L. Ciampolini,
P. Regli, W. Fichtner
ETH Zurich, Switzerland |
SIMULATING THERMAL EFECTS OF SOLDER VOIDS IN LARGE AREA JOINTS |
| 10:20 | V. Szekely, A.
Pahi, M. Rosenthal, M. Rencz
Techn. Univ. of Budapest, Hungary |
3D EXTENSION OF THE SUNRED THERMAL FIELD SOLVER |
| 10:40 | M. Janicki, M.
Zubert, A. Napieralski
Techn. Univ. of Lodz, Poland |
APPLICATION OF FUNCTION SPECIFICATION METHOD FOR INTEGRATED CIRCUIT TEMPERATURE ESTIMATION |
| 11:00 | D. de Cogan
Univ. of East Anglia, United Kingdom |
THE RELATIONSHIP BETWEEN PARABOLIC AND HYPERBOLIC TLM MODELS FOR HEAT-FLOW |
| 11:20 | S. Tzanova, P.
Philippov
Techn. Univ. of Sofia, Bulgaria |
MCM ELEMENT PLACEMENT SATISFYING THE CRITERION FOR OPTIMAL THERMAL CONDITIONS |
| 12:15 | Lunch | |
| 14:00
15:40 |
Session 5
Chair: D. de Cogan Univ. of East Anglia, United Kingdom |
THERMAL MEASUREMENT TECHNIQUES |
| 14:00 | G.B.M. Fiege,
L.J. Balk
BUGH, Wuppertal, Germany |
SCANNING THERMAL
MICROSCOPE (SThM): A TOOL FOR THE INVESTIGATION OF THERMAL PROPERTIES AND TEMPERATURE DISTRIBUTIONS IN THE NANOMETER RANGE |
| 14:20 | J. Altet1,
A. Rubio1, S. Dilhaire2, E. Schaub2,
W. Claeys2
1Univ. Polit. De Catalunya, Barcelona, Spain 2Univ. Bordeaux, France |
THERMAL CHARACTERIZATION
OF DEFECTS IN AN IC: THERMAL TESTING |
| 14:40 | Y. Assouad1,
T. Gautier1, J.P. Landesman2, E. Martin2,
P. Braun3
1Thomson-CSF, Elancourt, France 2LCR, Orsay, France 3United Monolithic Semiconductors GmbH, Ulm, Germany |
TEMPERATURE DISTRIBUTION IN POWER GaAs TRANSISTORS USING SPATIALLY RESOLVED PHOTOLUMINESCENCE MAPPING COMPARED WITH FULL THERMAL MODELLING |
| 15:00 | K. Nassim1,
L. Joannes1, A. Cornet1, S. Dilhaire2,
E. Schaub2, W. Claeys2
1Univ. Louvain-La-Neuve, Belgium 2Univ. Bordeaux, France |
HIGH RESOLUTION INTERFEROMETRY (HRI) AND ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI) APPLIED TO THE THERMOMECHANICAL SYUDY OF MOS POWER TRANSISTOR |
| 15:20 | J. Lohan, R.
Lehtiniemi, P. Rodgers, C.M. Fager, P. Tiilikka, J. Rantala
Nokia Research Center, Finland |
COMPARISON AND VALIDATION OF DIFFERENT EXPERIMENTAL TECHNIQUES TO MEASURE ELECTRONIC COMPONENT OPERATING JUNCTION TEMPERATURE |
| 15:40
16:20 |
Special session
Chair: V. Székely Techn. Univ. of Budapest, Hungary J. Parry Flomerics Ltd, Surrey, United Kingdom |
A FINAL STATUS
REPORT ON THE SEED PROJECT: RESULTS AND FUTURE CHALLENGES |
| 16:20
16:30 |
Closing remarks | |
| Proceedings, special issues of journals | ||
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The informal proceedings of the workshop is formed by the Collection of papers presented at the 4th Therminic Workshop (241 pages), which was distributed among the workshop participants. Limited number of copies is available for FF200 from TIMA. As follow up to the Workshop special issue of the Microelectronics Journal (Vol. 30, No. 11, 1999) and a special issue of the IEEE Transactions on Components, Packaging and Manufacturing Technology, (Vol. 22, No. 2, 1999) were prepared based on contributions presented at the 4th Workshop. These issues form the formal proceedings of the workshop. |
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