25th September 1995
- 8.30 Opening Address
- 8.40 INVITED TALK
: D. Blackburn NIST, Gaithersburg, USA
ISSUES IN THE MEASUREMENT OF TEMPERATURE AND THERMAL CHARACTERIZATION OF
MICROELECTRONIC COMPONENTS
- 9.20-11.00 SESSION
1 Thermal and Temperature Sensors
Chair : C. Cahill NMRC, Cork, Ireland
- 9.20 M. Kimura,
J. Manaka, K. Nagai Tohoku-Gakuin Univ., Tagajo, Japan Ricoh Seiki Co.,
Develop. Center, Tokyo, Japan
ABSOLUTE-HUMIDITY SENSING INDEPENDENT OF THE AMBIENT TEMPERATURE
- 9.40 V. Székely,
Cs. Márta, M. Rencz, Zs. Benedek, B. Courtois TU Budapest, Hungary
TIMA Laboratory, Grenoble, France
DESIGN FOR THERMAL TESTABILITY (DfTT) AND A CMOS REALIZATION
- 10.00 W. Wójciak,
A. Napieralski TU Lódz, Poland
AN ANALOGUE TEMPERATURE SENSOR INTEGRATED IN THE CMOS TECHNOLOGY
- 10.20 T. Kudoh,
S. Ikebe, H. Sato, K. Komatsu, M. Kimura TERUMO Corp., Kanagawa, Japan
Tohoku-Gakuin Univ., Tagajo, Japan
HIGHLY SENSITIVE THERMISTOR BOLOMETER FOR A CLINICAL TYMPANIC THERMOMETER
- 10.40 U.A. Dauderstädt,
P.H.S. de Vries, R. Hiratsuka, P.M. Sarro Delft Univ. of Technology, The
Netherlands Nippon Steel Corporation, Japan DIMES-ICP, Delft, The Netherlands
SIMULATION OF A THERMAL ACCELEROMETER
- 11.00-11.20 Coffee
- 11.20-12.40 SESSION
2 Thermal Simulation
Chair : V. Székely TU Budapest, Hungary
- 11.20 A. Napieralski,
G. Jablonski TU Lódz, Poland
PYRTHERM FOR WINDOWS - USER FRIENDLY THERMAL CAD SOFTWARE
- 11.40 J.L. Blanchard,
S. Louage Zuken-Redac S.A., Les Ulis, France
AN INTERACTIVE AND INTEGRATED THERMAL CHARACTERIZATION OF COMPONENT PLACEMENT
- 12.00 A.J. Przekwas,
S.D. Habchi CFD Research Corp., Huntsville, USA
MULTI-SCALE SIMULATION OF ELECTRONICS THERMAL PACKAGING ETP AND SYSTEM
COOLING
- 12.20 K.O. Petrosjanc,
I.A. Kharitonov, N.I. Rjabov, A.V. Panjukhin Moscow Univ. of Electronics
and Mathematics, Russia
SOFTWARE FOR SEMICONDUCTOR DEVICES, MONOLITH AND HYBRID IC's DESIGN AND
SIMULATION
- 12.50 Lunch
- 14.20-16.00 SESSION
3 Packages Thermal Modelling and Investigation
Chair : A. Napieralski TU Lódz, Poland
- 14.20 L. Tielemans,
G. Gregoris, L. De Schepper DESTIN N. V., Diepenbeek, Belgium Alcatel
Espace, Toulouse, France Limburgs Univ. Centrum, Diepenbeek, Belgium
THERMAL DEGRADATION OF POWER MODULES
- 14.40 M. O'Flaherty,
C. Cahill, K. Rodgers, O. Slattery NMRC, Cork, Ireland
VALIDATION OF NUMERICAL MODELS OF CERAMIC PIN GRID ARRAY PACKAGES
- 15.00 H. I. Rosten
DELPHI - Flomerics Ltd., Surrey, United Kingdom
A EUROPEAN-FUNDED PROJECT FOR THE DEVELOPMENT OF LIBRARIES AND PHYSICAL
MODELS FOR AN INTEGRATED DESIGN ENVIRONMENT
- 15.20 V.A. Koval,
D.V. Fedasyuk State Univ. "Lviv Polytechnic", The Ukraine
THERMAL SIMULATION OF THE SEMICONDUCTOR IC's : GENERAL AND PRACTICAL APPROACH
- 15.40 L. Albo,
A. Coello-Vera, P. Pipard Alcatel Espace, Toulouse, France
THERMAL ANALYSIS OF MCM-V STACKS
- 16.00-16.20 Coffee
- 16.20-18.00 SESSION
4 Thermal Simulation
Chair : V. Koval TU Lviv, The Ukraine
- 16.20 B. Lanzendörfer
SICAN GmbH, Hannover, Germany
THERMAL ANALYSIS AND SIMULATION OF MCM-SI AND MICROMECHANIC COMPONENTS
- 16.40 M. Furmánczyk,
G. Jablónski, A. Napieralski, J. Pacholik TU Lódz, Poland
THE 3D TRANSIENT THERMAL SIMULATION WITH ARBITRARY BORDER CONDITION
- 17.00 K. Hofmann,
J.M. Karam, V. Moleavin, T. Niculiun, B. Courtois, M. Glesner TH Darmstadt,
Germany TIMA/TIMC, Grenoble, France Univ. Bucharest "Politechnica", Romania
MODELLING AND SIMULATION OF THERMAL EFFECTS ON THE SYSTEM LEVEL
- 17.20 T. Niculiu,
K. Hofmann, M. Glesner Univ. Bucharest "Politechnica", Romania TH Darmstadt,
Germany
ANALOG HDL BASED THERMAL CIRCUIT SIMULATION FOR MICROSYSTEMS
- 17.40 D. Agonafer,
A. Free IBM, Poughkeepsie, NY, USA
AN INTEGRATED SOLID MODEL BASED CFD MODELING METHODOLOGY FOR COMPUTER
PACKAGING APPLICATIONS
- 19.00 Dinner
- 20.30 PANEL SESSION
Chair : G. De Mey Univ. of Ghent, Belgium
HOW BAD IS THERMAL EDUCATION OF ELECTRONICS ENGINEERS ?
Introductory talk : G. De Mey, Univ. Ghent, Belgium
MISUNDERSTANDINGS OF HEAT TRANSFER IN THE ELECTRONICS ENGINEERING COMMUNITY
Panelists : D. Blackburn, A. Napieralski, V. Székely, C. Zardini
NIST, Gaithersburg, USA, TU Lódz, Poland, TU Budapest, Hungary, IXL,
Talence, France
26th September 1995
- 8.30 INVITED TALK
: T. Tarter AMD, Sunnyvale, USA
FACING CHALLENGES IN MICROPROCESSOR COOLING ; PORTABLE POWER
- 9.10-10.10 SESSION
5 Evaluation of Thermal Measurements
Chair : D. Blackburn NIST, Gaithersburg, USA
- 9.10 B Bocquet,
D. Allal, Y. Leroy IEMN, Villeneuve d'Ascq, France
THERMOMETRY OF LOSSY COPLANAR LINES BY MICROWAVE CORRELATION RADIOMETRY
- 9.30 G. Oliveti,
A. Piccirillo, P.E. Bagnoli CSELT, Torino, Italy Univ. Pisa, Italy
ANALYSIS OF LASER DIODES THERMAL PROPERTIES WITH SPATIAL RESOLUTION BY
MEANS OF T.R.A.I.T. METHOD
- 9.50 V. Székely
TU Budapest, Hungary
A NEW EVALUATION METHOD OF THERMAL TRANSIENT MEASUREMENT RESULTS
- 10.10 Introduction
to the poster session Chair : M. Rencz TU Budapest, Hungary
- 10.40-11.40 POSTER
+ Coffee
- S. Rael, Y. Marechal,
C. Schaeffer LEG/ENSIEG, St. Martin d'Heres, France
A 3D ELECTROTHERMAL MODELLING FOR PARALLELED CHIPS
- M. Mullins, R.
Bayford, J. Butcher, A. van Putten MUMEC, London, United Kingdom
EFFECTIVE 3D THERMAL AND ELECTRICAL SIMULATION OF SILICON THERMAL FLOW
SENSORS WITH HSPICE BEHAVIOURAL MODELS
- A. Csendes, Zs.
Kohári TU Budapest, Hungary
THERMAL INVESTIGATION OF MICROSTRUCTURES BY DIFFERENT SIMULATION AND MEASUREMENT
TOOLS
- W. Wójciak,
A. Napieralski TU Lódz, Poland
THE DISTANCE DEPENDENT METHOD FOR TEMPERATURE MEASUREMENT OF SINGLE HEAT
SOURCE IN SEMICONDUCT - OR DEVICES - THE FIRST APPROACH
- M. Kaluza, S. Delmas,
E. Sicard, C. Garres TU Lódz, Poland INSA, Toulouse, France Matra
Marconi Space, Toulouse, France
DESIGN AND SIMULATION OF CMOS-COMPATIBLE INDUCTORS FOR THE POWER SUPPLY
OF IMPLANTED THERMAL SENSORS
- P. Godts, L. Camberlain,
C. Machut, D. Leclercq IEMN, Villeneuve d'Ascq, France
A NEW CONTACTLESS TEMPERATURE MICROSENSOR
- L. Méchin,
J.C. Villégier, P. Langlois, D. Robbes, D. Bloyet LETI-CEA, Grenoble,
France GREYC, Caen, France
THERMALLY ISOLATED YBaCuO AIR BRIDGES ON SILICON SUBSTRATES FOR HIGH PERFORMANCE
BOLOMETERS
- R.G.C. Artus Univ.
of Reading, Berkshire, United Kingdom
THE DESIGN AND THERMAL MANAGEMENT OF A VIRTUAL WAFER-SCALE MULTI-CHIP
MODULE SYSTEM
- B. Wiecek TU Lódz,
Poland
THERMAL MANAGEMENT IN SURFACE MOUNTED ICs
- T. Ochi, T. Ogushi,
R. Aoki Osaka Univ., Japan Mitsubishi Electric Corp., Hyogo, Japan
DEVELOPMENT OF A HEAT PIPE THERMAL DIODE AND ITS HEAT TRANSPORT PERFORMANCE
- M.J. Marongiu MJM
Consulting Services, Naperville, IL,
SOME COMPRESSIBLE FLOW ISSUES IN THE DESIGN OF USA MICRO CHANNEL COOLING
SYSTEMS
- M. Mermet-Guyennet,
J.M. Paladel, P. Galliard, R. Billoud, T. Fromont, Y. Stricot CSTI, Lyon,
France BULL, Les Clayes, France
THERMAL MANAGEMENT OF TAB AND TBGA COMPONENTS IN AN AIR COOLED SUPERCOMPUTER
- J. Bedmar, J.A.
Puente, J.Pérez Oria UPM, Madrid, Spain Univ. Cantabria, Santander,
Spain
A TECHNIQUE FOR SOLVING THE THERMAL DISSIPATION PROBLEM IN FAST VLSI ELECTRONIC
SYSTEMS
- 11.40-13.00 SESSION
6 Thermography
Chair : M. Glesner TH Darmstadt, Germany
- 11.40 A. Csendes,
V. Székely, M. Rencz TU Budapest, Hungary
RESOLUTION, ACCURACY AND OTHER FEATURES OF LIQUID CRYSTAL THERMAL MAPPING
- 12.00 M. Ashauer,
J. Ende, H. Glosch, H. Haffner, K. Hiltmann Inst. für Mikro- und
Informationstechnik, Villingen-Schwenningen, Germany
THERMAL CHARACTERIZATION OF MICROSYSTEMS BY MEANS OF HIGH-RESOLUTION THERMOGRAPHY
- 12.20 M. Grecki,
J. Pacholik, B. Wiecek, A. Napieralski TU Lódz, Poland
APPLICATION OF COMPUTER -BASED THERMOGRAPHY TO THERMAL MEASUREMENTS OF
INTEGRATED CIRCUITS AND POWER DEVICES
- 12.40 P. Dondon,
J. Lauriou, C. Zardini IXL, Talence, France
THERMAL TRANSIENT CHARACTERIZATION OF ELECTRONIC ASSEMBLIES BY INFRARED
THERMOGRAPHY IN FAST LINE SCAN MODE
- 13.00 Lunch
- 14.30-16.10 SESSION
7 Electro-thermal Simulation
Chair : M. Kimura Tohoku-Gakuin Univ., Tagajo, Japan
- 14.30 V. Székely,
A. Poppe, M. Rencz, A. Csendes, T. Kocsis TU Budapest, Hungary
SELF-CONSISTENT ELECTRO- THERMAL SIMULATION : FUNDAMENTALS AND PRACTICE
- 14.50 J. Litsios,
B. Schmithüsen, W. Fichtner ETH-Zentrum, Zürich, Switzerland
THERMAL MIXED MODE DEVICE AND CIRCUIT SIMULATION
- 15.10 W. K. Chu,
W. H. Kao Cadence Design Systems Inc., San Jose, CA, USA
A THREE-DIMENSIONAL TRANSIENT ELECTRO- THERMAL SIMULATION SYSTEM FOR IC's
- 15.30 M. Wilklund,
S. Mattisson Lund Inst. of Technology, Sweden
SIMULATION OF THERMAL EFFECTS IN INTEGRATED CIRCUITS USING STANDARD CIRCUIT
SIMULATORS
- 15.50 J. Ecrabey,
L. Hebrard, J. Berger-Toussan, M. Le Helley LEAME, Ecole Cent. de Lyon,
France
A 3D MODEL FOR PACKAGES IN ELECTROTHERMAL SIMULATIONS OF INTEGRATED CIRCUITS
- 16.10 End of session
7
- 16.30 Buses leave
(option A)
- 16.30 Free discussion
on Thermal Simulation (option B)
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