| Tuesday 23 September | |
|---|---|
| 8:00 | Tutorial: Compact Modelling, Theory and Practice | Wednesday 24 September |
| 8:00 | Registration |
| 9:30 |
Welcome address: B. Courtois, TIMA Laboratory, Grenoble, France |
| 9:40 | Invited talk 1: ON CHIP SOLID STATE COOLING FOR INTEGRATED CIRCUITS A. Shakouri, University of California, Santa Cruz, USA Chair: V. Székely, BUTE, Budapest, Hungary |
| 10:20 | Session 1: ADVANCES IN SYSTEM LEVEL APPROACHES Chair: J. Parry, Flomerics Ltd, Hampton Court, UK |
| 10:20 | IDENTIFICATION OF CRITICAL SCOPE: COMPREHENSIVE REVIEW OF MICROSCALE CONVECTION S. Mahulikar, Indian Institute of Technology, Bombay, India H. Herwig, O. Hausner, Technical University Hamburg-Harburg, Germany |
| 10:40 | OPERATION CONDITION OF A CLOSED ADVANCED TWO-PHASE THERMOSYPHON LOOP FOR COOLING OF RADIO BASE STATIONS R. Khodabandeh, Royal Institute of Technology, Stockholm, Sweden |
| 11:00 | ENHANCED BOILING HEAT TRANSFER BY SUBMERGED, VIBRATION INDUCED JETS S. Heffington, S. Tillery, M. Smith, A. Glezer, Georgia Institute of Technology, Atlanta, USA |
| 11:20 | Break |
| 11:40 | Vendors' session: |
| 13:00 | Lunch |
| 14:30 | Session 2: RELIABILITY ISSUES AT PACKAGE AND SYSTEM LEVEL Chair: B.M. Guenin, Sun Microsystems, San Diego, USA |
| 14:30 | POWER CYCLING OF BGA ASSEMBLIES: EXPERIMENTS AND SIMULATIONS Y. Abdul Quadir, Z. Radivojevic, J. Rantala, Nokia Research Center, Helinki, Finland |
| 14.50 | A STUDY OF FAILURE MECHANISM ON THE ELECTROMIGRATION STRUCTURE FOR THE COPPER-CORAL BACKEND N. Kamat, J. Lim, Chartered Semiconductor Mfg., Singapore |
| 15.10 | THERMAL PERFORMANCE, MECHANICAL RELIABILITY AND TECHNOLOGICAL FEATURES OF DIFFERENT COOLING CONCEPTS FOR HIGH POWER CHIP MODULES B. Wunderle, R. Schacht, B. Michel, H. Reichl, Fraunhofer IZM, Berlin, Germany O. Wittler, TU Berlin, Germany |
| 15.30 | RELIABILITY ASSESMENT OF RF-POWER AMPLIFIERS AT ELEVATED JUNCTION TEMPERATURES Z. Radivojevic, K. Andersson, J. Rantala, Nokia, Helinki, Finland J. Bielen, P. Van der Wel, Philips Semiconductors, Nijmegen, The Netherlands |
| 15.50 | HIGH LEVEL SYNTHESIS WITH ADAPTIVE EVOLUTIONARY ALGORITHM FOR SOLVING RELIABILITY AND THERMAL PROBLEMS IN RECONFIGURABLE MICROELECTRONIC SYSTEMS S. Koziel, W. Szczesniak, Gdansk University of Technology, Poland |
| 16.10 | Break |
| 16.30 | Session 3: THERMAL MODELLING AND CHARACTERISATION OF COMPONENTS Chair: P. Rodgers, Electronics Thermal Management, Mayo, Ireland |
| 16.30 | THREE-DIMENSIONAL TLM THERMAL MODEL FOR HIGH POWER INSULATED GATE BIPOLAR TRANSISTORS R. Hocine, A. Stambouli Boudghene, University of Sciences and Technology of Oran, Algeria S. Pulko, University of Hull, UK |
| 16.50 | COUPLED THERMO-MECHANICAL MODELLING AND OPTIMIZATION OF POWER SEMICONDUCTOR DEVICES D. Fedasyuk, V. Makar, Lviv Polytechnic National University, Ukraine |
| 17.10 | COMPACT THERMAL MODELS FOR CONVECTIVE MEDIA M-N. Sabry, Université Française, Cairo, Egypt |
| 17.30 | COMPUTER ASSISTED THERMAL DESIGN OF AN INTEGRATED STARTER GENERATOR (EXTENDED SUMMARY) K. Oila, ETH, M. Ciappa, W. Fichtner, ETH, Integrated Systems Laboratory, Zurich Switzerland N. Seliger, Siemens Corporate Technology, Munich, Germany |
| 17.50 | Break |
| 18.10 | Poster introduction and viewing session Chair: M. Rencz, BUTE, Budapest, Hungary CHAOTIC BEHAVIOUR OF SELF-HEATING PARALLED BIPOLAR TRANSISTORS L. Codecasa, D. D'amore, P. Maffezoni, Politecnico di Milano, Italy TEMPERATURE AFFECTS THE UC3842 CURRENT MODE PWM CONTROLLER J. Zarêbski, K. Górecki, Gdynia Maritime University, Gdynia, Poland A MULTI TECHNOLOGIES COMPONENT E. Levy, Computerized Analysis & Simulation Ltd., Haïfa, Israel AN AC MICROCALORIMETER FOR MEASURING SPECIFIC HEAT OF THIN FILM Q. Song, S. Xia, S. Chen, Chinese Academy of Sciences, Beijing, China Z. Cui, Rutherford Appleton Lab., Didcot, UK EXPERIMENTAL AND DETAIL CFD MODELLING OF PERFORATED PLATES INSIDE TELECOMMUNICATION SUBTRACKS R. Anton, H. Jonsson, Royal Institute of Technology, Stockholm, Sweden B. Moshfegh, University of Gävle, Sweden THERMAL MANAGEMENT IN STACKS OF MATCH-X MOEMS F. Schindler-Saefkow, O. Wittler, R. Schacht, V. Großer, B. Michel, Fraunhofer IZM, Berlin, Germany A LINEAR HEAT GENERATION THERMAL MODEL FOR LDMOS BASIC CELL SELF-HEATING ANALYSIS IN TRANSIENT STATE J. Roig, D. Flores, S. Hidalgo, M. Vellvehi, I. Cortés, J. Rebollo, Centre Nacional de Microelectrònica, Bellaterra, Spain GRAPHITE HEAT SINK WITH EMBEDDED HEAT PIPES FOR HIGH THERMAL PERFORMANCE S. Lin, J. Broadbent, R. McGlen, Thermacore Europe, Ashington, UK THERMAL INVESTIGATION OF LOCAL TEMPERATURE INCREASE OF GAAS SUBTRATES UNDER INCIDENT LASER BEAM E. Driessens, B. Vandevelde, G. Borghs, IMEC, Heverlee, Belgium J. Stiens, C. De Tandt, W. Ranson, R. Vounckx, Vrije University, Brussel, Belgium G. Shkerdin, V. Kotov, the Russian Academy of Science, Fryazino, Russia THERMAL SIMULATION OF COLLECTOR-UP HBTS FOR SMALL HIGH-POWER AMPLIFIERS WITH NOVEL THERMAL VIA STRUCTURE UNDERNEATH HBT FINGERS Y. Osone, K. Mochizuki, K. Tanaka, Hitachi, Ibraki, Japan 3D THERMAL-ADI -- AN EFFICIENT CHIP-LEVEL TRANSIENT THERMAL SIMULATOR T-Y. Wang, Y-M. Lee, University of Wisconsin-Madison, Middleton, USA C. Chen, National Taiwan University, Taipei, Taiwan STANDARD-CELL BASED TEMPERATURE SENSOR FOR DEEP SUBMICRON CMOS TECHNOLOGIES S.A. Bota, J.L. Rossello, J.A. Segura, University Illes Balears, Palma de Mallorca, Spain AN EXPERIMENTAL-NUMERICAL APPROACH TO THERMAL CONTACT RESISTANCE A. Wymyslowski, K. Friedel, J. Felba, T. Falat, Wroclaw University of Technology, Poland THERMAL ANALYSIS AND REDUCED-ORDER 3D MODELING OF STACKED ELECTRONICS STRUCTURES V. Gatto, V Feuillet, Y. Scudeller, Ecole Polytechnique de l'Université de Nantes, France TEMPERATURE IMPACT ON GLOBAL INTERCONNECTS IN FUTURE TECHNOLOGY NODES M. Casu, M. Graziano, G. Masera, G. Piccinini, M. Zamboni, Politecnico di Torino, Italy NUMERICAL AND EXPERIMENTAL CHARACTERIZATION OF COPPER TRACES G. Lacassin, Flomerics, Orsay, France M. Iliozer, Valeo Electronics & Connective Systems, Montigny le Bretonneux, France REDUCED THERMAL MODEL OF A POWER IC WITH VARIABLE COOLING FLUID FLOW C. Rouaud, Renault, Guyancourt, France P. Lagonotte, A. Alexandre, Laboratoire d'Etudes Thermiques, Futuroscope, France EXPERIMENTS FOR NON-CONTACT THERMOMETRY USING LASER INTERFEROMETER G. Bognár, V. Székely, BUTE, Budapest, Hungary DEVELOPMENTS OF THE SUNRED ALGORITHM G. Pohl, V. Székely, BUTE, Budapest, Hungary |
| 19:00 | Cocktail | Thursday 25 September |
| 8:30 | Invited talk 2: CHIP- AND PACKAGE-LEVEL THERMAL MANAGEMENT OF POWER MODULES FOR FIELD RELIABILITY OF POWER SYSTEMS K. Shenai, The University of Illinois at Chicago, USA Chair: C.J.M. Lasance, Philips Research Laboratories, Eindhoven, The Netherlands |
| 9:10 | Session 4: DYNAMIC ANALYSIS OF ELECTRONIC PARTS AND SYSTEMS Chair: P.E. Raad, Southern Methodist University, Dallas, USA |
| 9:10 | EFFICIENT THERMAL MODELS OF MULTICELLULAR POWER DEVICES V. d'Alessandro, N. Rinaldi, P. Spirito, University of Naples, Italy |
| 9:30 | THERMAL INVESTIGATION OF HIGH POWER OPTICAL DEVICES BY TRANSIENT TESTING G. Farkas, MicReD, Budapest, Hungary Q. Van Voorst Vader, Lumileds Lighting B.V., Best, The Netherlands |
| 9:50 | EVALUATION ISSUES OF THERMAL MEASUREMENTS BASED ON THE STRUCTURE FUNCTION M. Rencz, MicReD, Budapest, Hungary A. Poppe, MicReD/BUTE, Budapest, Hungary E. Kollár, S. Ress, BUTE, Budapest, Hungary |
| 10:10 | BOUNDARY CONDITION INDEPENDENT DYNAMIC THERMAL COMPACT MODELS OF IC-PACKAGES D. Schweitzer, P. Heinz, Infineon Technolgies AG, Munich, Germany |
| 10:30 | Break |
| 10.50 | Panel |
| NANOTECHNOLOGY AND ITS POTENTIAL IMPACT ON THERMAL ISSUES IN ICS
Moderator: Ali Shakouri, University of California, Santa Cruz, USA |
|
| 12.20 | Lunch |
| 13.50 | Session 5: ELECTRO-THERMAL SIMULATION Chair: M-N. Sabry, Université Française d'Egypte, Cairo, Egypt |
| 13.50 | VERIFICATION OF AN ELECTRO-THERMAL SIMULATION ALGORITHM V. Székely, S. Török, BUTE, Budapest, Hungary |
| 14.10 | NANOSCALE ELECTROTHERMAL CO-SIMULATION: COMPACT DYNAMIC MODELS OF HYPERBOLIC HEAT ... N. Pilgrim, W. Batty, R. Kelsall, C. Snowden, University of Leeds, UK |
| 14.30 | SELFHEATING EXPERIMENTAL STUDY OF 600V PT-IGBTS UNDER LOW DISSIPATION ENERGIES X. Perpiñà, X. Jordà, M. Vellvehí, P. Godignon, J. Millán, CNM-IMB, Bellaterra, Spain N. Mestres, ICMAB, Bellaterra, Spain |
| 14.50 | A NEW SIMULATION MODEL OF ELECTRO-THERMAL DEGRADATION FOR MOSFET DEVICES SUBJECTED TO HOT CARRIER INJECTION STRESS G. Kaytaz, P. Komarov, P. Raad, Southern Methodist University, Dallas, USA |
| 15.10 | Break |
| 15.30 | Session 6: MEASUREMENT METHODS Chair: K. Azar, Advanced Thermal Solutions, Norwood, USA |
| 15.30 | MINIMIZING THE UNCERTAINTIES ASSOCIATED WITH THE MEASUREMENT OF THERMAL PROPERTIES BY THE TRANSIENT THERMO-REFLECTANCE METHOD M.G. Burzo, P.L. Komarov, P.E. Raad, Southern Methodist University, Dallas, USA |
| 15.50 | EXTRACTION OF MATERIAL PARAMETERS BASED ON INVERSE MODELING OF THREE DIMENSIONAL INTERCONNECT STRUCTURES S. Holzer, C. Heitzinger, T. Grasser, S. Selberherr, TU Vienna, Austria R. Minixhofer, J. Fellner, austriamicrosystems AG, Uterpremstätten, Austria |
| 16.10 | THERMAL MEASUREMENTS OF ACTIVE SEMICONDUCTOR MICRO-STRUCTURES ACQUIRED THROUGH THE SUBSTRATE USING NEAR IR THERMOREFLECTANCE J. Christofferson, A. Shakouri, UC Santa Cruz, USA |
| 16.30 | CHARACTERIZATION OF THE THERMAL BEHAVIOR OF PN THERMOELECTRIC COUPLES BY SCANNING THERMAL MICROSCOPE L.D. Patiño-Lopez, M.A. Salhi, S. Dilhaire, S. Grauby, W. Claeys, CPMOH, Université de Bordeaux, France S. Lefèvre, LET-ENSMA, Futuroscope Poitiers, France |
| 19.00 | Social event: Banquet | Friday 26 September |
| 9.00 | Embedded tutorial on JEDEC ACTIVITIES B.M. Guenin, Sun Microsystems, San Diego, USA Chair: M. Rencz, BUTE, Budapest, Hungary |
| 9.40 | FINAL REPORT ON THE EC-FUNDED THERMAL PROJECT PROFIT C.J.M. Lasance, Philips Research Laboratories, Eindhoven, The Netherlands Chair: B. Courtois, TIMA Laboratory, Grenoble, France |
| 10.10 | Break |
| 10:30 | Session 7: CALCULATION OF TEMPERATURE FIELDS Chair: W. Batty, University of Leeds, UK |
| 10:30 | FULLY ANALYTICAL TREATMENT OF INHOMOGENEITY, POSITION VARYING SURFACE HEAT FLUX ... W. Batty, C. Snowden, University of Leeds, UK |
| 10.50 | CANONICAL FORMS OF THERMAL IMPEDANCES L. Codecasa, D. D'Amore, P. Maffezzoni, Politecnico di Milano, Italy |
| 11.10 | HEAT CONDUCTION WITH NON-LINEAR RADIATIVE AND CONVECTIVE BOUNDARY CONDITIONS TREATED WITH GREEN'S FUNCTION METHOD Y.C. Gerstenmaier, Siemens AG, Corporate Technology, Germany G. Wachutka, Munich University of Technology, Germany |
| 11.30 | THERMAL NETWORKS FOR HEAT WAVE EQUATION L. Codecasa, D. D'Amore, P. Maffezzoni, Politecnico di Milano, Italy |
| 12:00 | Lunch |
| 13:30 | Session 8: MEMS & THERMALLY OPERATED STRUCTURES Chair: G. Wachutka, Munich University of Technology, Germany |
| 13:30 | AN SOI CMOS COMPATIBLE THERMAL TRANSDUCER FOR LOW POWER SYSTEMS-ON-A-CHIP DATA ISOLATION T. McNutt, A. Lostetter, A. Mantooth, University of Arkansas, USA M. Mojarradi, Jet Propulsion Laboratory, USA |
| 13.50 | NEW OPERATION OF DIODE TEMPERATURE SENSOR AND ITS APPLICATION TO GAS SENSING COMBINED WITH A MICRO-AIR-BRIDGE HEATER M. Kimura, K. Kikuchi, Tohoku-Gakuin University, Japan |
| 14.10 | ON-CHIP TEMPERATURE DISTRIBUTION MONITORING VIA CMOS THERMOCOUPLES S. Baglio, S. Castorina, N. Savalli, DIEES - University of Catania, Italy |
| 14.30 | MODELLING OF TEMPERATURE PHENOMENA IN ION SENSITIVE TRANSISTORS M. Janicki, M. Daniel, A. Napieralski, Technical University of Lódz, Poland |
| 14:50 | Closing remarks: B. Courtois, TIMA Laboratory, Grenoble, France |
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