Announcement and Call for Papers
Abstracts due: July 13, 2001

Conference Co-Chairs

Dr. Bernard Courtois TIMA-CMP 46 Avenue Felix Viallet 38031 Grenoble cedex FRANCE Tel: 33-4-76-57-46-15 Fax: 33-4-76-47-38-14 E-mail: Bernard.Courtois@imag.fr

Professor Masaru Ishizuka Department of Mechanical Systems Engineering Toyama Prefectural University 5180 Kurokawa, Kosugi, Toyama 939-0398 JAPAN Tel: 81-766-56-7500, ext. 387 Fax: 81-766-56-6131 E-mail: ishizuka@pu-toyama.ac.jp

Conference Objectives
As electronic products become faster and incorporate greater functionality, they are also shrinking in size and weight, with continuing pressures for cost reduction. Thermal issues are key in electronic product development at all levels of the electronic product hierarchy, from the chip to the ultimate system. Shrinking system sizes are resulting in increasing volumetric heat generation rates and surface heat fluxes in many products. This has resulted in a significant interest in ultra-compact high heat removal thermal management devices. Additional thermal management challenges arise as more and more electronic systems are employed in harsh environments, subject to large variations in ambient temperatures and external thermal loads. A synergistic activity is thermal characterization through computations. High-fidelity modeling schemes are being sought, as product development cycles shrink to a period of months in many portable products.

This conference will focus on the recent advances in thermal management and characterization schemes, as well as forecasts and analyses of future trends. In addition to the U.S. participants, a significant international participation from Europe and Asia is expected. Invited talks in selected emerging areas will be complemented with contributed papers. Panel discussions focusing on technology and market trends and identification of research challenges will be included.

Scope of the Conference
The United Engineering Foundation has recognized the importance of providing a forum for the exchange of ideas, results, industrial needs in thermal phenomena related to microstructures and microsystems. This is the first Conference dedicated on this emerging field organized by the United Engineering Foundation. Papers, lectures, research presentations, and discussions on the following topics are solicited particularly from industry.

• Advances in thermal management of:
  • High-performance computing equipment
  • Portable products
  • Power electronics
  • Telecommunications infrastructure equipment
  • Avionics and space systems
• Thermal issues in electronics manufacturing and assembly
• Micro thermal systems
• Solid state cooling concepts
• Chip-integrated fluidic cooling devices
• Cryogenic cooling of electronics
• Advances in thermal modeling of electronic systems
• Compact modeling methodologies
• Multi-scale modeling of electronic systems
• Electro-thermal simulations of electronic devices

Outline of the program
Technical sessions are expected in the topics mentioned above, with emphases on the following (each session will be headlined by an invited speaker):

• very high heat fluxes
• compact spaces low profile, low weight, low power, low voltage
• miniaturized refrigeration and cryogenic systems
• sensing
• fabrication issues
• high reliability (e.g., mobile radio)
• power electronics
• harsh and extreme environments - cold, altitude, vibration, shock and chemical resistance
• space and Mars exploration (low temp, CO₂, dirty, compact, light-weight)
• low and high gravity levels
• microscale, application of MEMS and commercialization
  

Conference Format
The Conference will be held for 3 days, beginning on Sunday afternoon. Sessions may be scheduled in the mornings, afternoons, and/or evenings, with breaks in the formal program to allow small group interactions. Each session will have 1 or 2 invited lectures and 4 to 5 short presentations. Several panel discussion sessions will also be included. There will be no parallel sessions. All participants will stay at the Conference site. The Conference registration fee will include complete room and board, Conference proceedings and other related Conference material, and two coffee/tea breaks per day. This format employed in United Engineering Foundation Conferences allows maximum interaction, discussion and networking among the Conference participants.

All those who will participate in the Conference should understand that they are expected to make contributions throughout the Conference. These contributions may be oral or written, formal or informal, with the goal that every participant contributes positively to the discussions and the success of the Conference.

Submission, Selection, Publication and Presentation of Contributed Papers
Researchers, users, manufacturers, designers and contractors are invited to submit the abstracts and eventually papers for this unique Conference. Authors should submit an extended abstract of up to 1000 words (3 pages maximum), with supporting figures and tables as appropriate, to the Conference Chairs or Co-chairs geographically closest to the authors. Use of e-mail is encouraged (pdf or postscript format). The cover letter should include the name, address, phone and fax numbers, and e-mail address of the author to whom correspondence should be directed. The abstract should clearly state the objectives, results and conclusions. All those submitting an abstract MUST send a conference application (form to be faxed or mailed, on-line form to be e-mailed) to the United Engineering Foundation.

Notification of abstract acceptance will be sent within four weeks after receipt of the abstract. The accepted papers will be required as full-length manuscripts in English only. Proceedings will be provided to all the registered participants at the Conference.

Please note that at least one author must be registered for the conference, otherwise the paper will not be included in the final proceedings. One of the authors must present the paper in person. In case of a no-show, an oral presentation by someone else will not be allowed. The objective of the UEFC is to have informal dialogue between workers in the area and the UEFC policy is that if the author is not present at the meeting there is no possibility for this dialogue to take place and the paper has to be removed from the program.

Deadlines
July 13, 2001
Abstract (no longer than 1000 words) due to the nearest Conference Chair or Co-Chair. Use of e-mail is encouraged (pdf or postscript format).
August 13, 2001
Notification of Abstract Acceptance.
October 15, 2001
Full-length manuscript due to one of the Conference Chairs.

United Engineering Foundation Conferences
United Engineering Foundation Conferences were established in 1962 to provide an opportunity for the exploration of problems and issues of concern to engineers from many disciplines. The format of the Conference provides morning and evening sessions in which major presentations are made. Time is available during the afternoons for ad hoc meetings and informal discussions and is designed to enhance rapport among participants and prompt dialogue on the developments of the meeting. We believe the Conferences have been instrumental in generating ideas and disseminating information to a greater extent than is possible through more conventional forums. All participants are expected to contribute actively to the discussions.

United Engineering Foundation Fellowships for New Professionals
The United Engineering Foundation sponsors a Conference Fellowship program. Applicants are limited to those currently active in engineering or related professions with a direct interest in the conference topic. They must be within ten years of their B.Sc. degree at the time their applications are submitted. The stipend is sufficient to cover the conference registration fee and on-site room and board. Transportation expenses are not included. Application information may be obtained from the WWW or by fax from the Foundation (1-212-591-7441) and must be submitted by October 12, 2001.

Conference Scientific Committee
M. Baelmans (K.U. Leuven, Belgium)
A. Bar-Cohen (University of Minnesota, USA)
V.P. Carey (Univ. of California, Berkeley, USA)
J. Lohan (University of Limerick, Ireland)
R. Mahajan (University of Colorado,USA)
R. Mahajan (Intel,Chandler, Arizona, USA)
W. Nakayama (Therm Tech.. Japan)
C. Patel (Hewlett-Packard Laboratories, USA)
J. Rantala (Nokia Research Center, Finland)
M. Rencz (T.U. Budapest, Hungary)
B. Sammakia (SUNY Binghamton, USA)
K.C. Toh (NTU, Singapore)

Theater, dance, and music all play a significant role in Santa Fe's past and present and the importance of art here had made the city one of the country's largest art markets. Surrounded as it is by literally millions of acres of National Forest and public lands, the city is a jumping off point for a number of different outdoor recreational activities. For the sightseer, the beauty of the surrounding area offers an amazing diversity of scenery and places to discover.

Hotel Santa Fe
It is the only hotel partially owned and managed by a Native American group. The Picuris Pueblo tribal members not only participated during the construction but also make up 31% of the workforce at the Hotel Santa Fe that opened its doors in March 1991. The influence of the Picuris is captured throughout the hotel. You can enjoy the sculptures in the gardens, take part in their ceremonial dances, taste their traditional picuris bread, enjoy local musicians and storytelling as you gather around the kiva fireplace.

The rooms feature amenities and furnishing in the authentic flavor of Santa Fe. There is free coffee offered in the foyer area every morning, an outdoor swimming pool and hot tub and plenty of free parking and a convenient guest shuttle. Hotel Santa Fe is conveniently located close to the Plaza in the historic Guadalupe District on the corner of Paseo de Peralta and Cerrillos Road.

Transportation from the Airport
Typically, air travelers to Santa Fe arrive in Albuquerque and either rent a car there or take a shuttle bus. There are two shuttle companies: Santa Fe Shuttle (1-888-833-2300 or 1-505-243-2300) which has departures in front of the Southwest Airlines Baggage claim area and leaves at 7:20am, 8:45am, 11:15am, 12:15pm, 1:50pm, 3:40 pm, 5:30 pm, 8:30 pm and 11:45 pm. The price is $21 one way and the trip usually takes one hour and ten minutes. Gray Line Shuttle Express USA (1-800-256-8991) which has departures in front of the baggage claim area at Commercial Lanes at 8:00am, 10:00am, 11:30 am, 1:00pm, 2:30pm, 5:00pm, 6:00pm, 7:30 pm, and 11pm. Their price is $25 one way. Reservations are highly recommended (particularly if you have a late flight) but not required.

Via Auto
The hotel is 60 miles north of I-25 from Albuquerque International Airport. Take I-25 to St. Francis Drive (Exit 282). Heading north on St. Francis turn right on Paseo de Peralta. Heading East on Paseo de Peralta, cross Guadalupe Street and Hotel Santa Fe will be on your left. The hotel is located at the corner of Paseo de Peralta and Cerrillos Road.

• Participant (single occupancy or sharing room with a guest) US $1140.00
• Participant (sharing a room with another participant) US $ 990.00
• bona fide graduate student (sharing room with another participant) US $ 745.00
• Guest (room and meals -eaten with conferees) US $ 210.00