XVII      Evening Workshop

                                            Location:             DoubleTree Hotel, San Jose, CA
 
 

Tuesday, March 20, 2001

Panel Session: Optoelectronic Packaging:Thermal Aspects and Challenges
PANEL CHAIR: JeffMontgomery, Electronicast
PANEL MEMBERS: TBA

Optical telecommunications components are the future of high-bandwidth communications. As internet traffic increases, traditional electrical signals are limited by the medium in which they travel. Using light to move information has incredible benefits in terms of speed and density, but there are drawbacks especially in packaging and thermal management of optical devices. Optical packaging is a specialty which is drawing from many other industries such as microelectronics, aerospace and medical, but new territories are emerging that require fresh thinking and new ideas.

A group of experts on optical components will discuss thermal issues and challenges associated with this vital segment of the telecom industry. The main theme is packaging with emphasis on thermal management.Panelists include participants from suppliers as well as end-users. The session is being moderated by Jeff Montgomery of Electronicast, a well known expert on the optics industry. 
 


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