Article : [SHEET435]

Info : COMPENDEX ANSWER 2, le 07/10/2000.

Titre : N.C. COULTHARD, R. PEZZANI, POWER SEMICONDUCTOR COOLING; EVACUATING THE HEAT WHERE IT IS GENERATED, International Conference on Power Electronics and Variable-Speed Drives, may 1984, pp. 62-65.

Cité dans :[99DIV109] Recherche sur l'auteur Robert PEZZANI, octobre 2000.

Meeting : International Conference on Power Electronics and Variable-Speed Drives.
Location : London, Engl
Date : 01 May 1984-04 May 1984
Organization :
IEE, Power Div, London, Engl;
IEEE, United Kingdom & Republic of Ireland Section, UK;
Inst of Electrical Engineers of Japan, Tokyo, Jpn;
Inst of Mathematics & Its Applications, Southend-on-Sea, Engl;
Inst of Physics, London, Engl; et al
Location : London, Engl
Date : 01 May 1984-04 May 1984

Source : IEE Conference Publication n 234.Publ by IEE, London, Engl and New York, NY, USA p62-65
CODEN : IECPB4
ISBN : 0-85296291-6
Meeting_Number : 05488
Document_Type : Conference Article
Language : English
Stockage :

Abstract :
Although considerable improvements in the physical limits of power SCR and diode
characteristics (Voltage, switching speed, losses, etc) have been achieved in recent years, the
main operating limit of these devices remains the junction temperature, and therefore the
capability of evacuating heat from the pellet.The authors present a novel system using the
boiling of a liquid coolant in direct contact with the semiconductor pellet.The basic thermal
mechanisms are analysed and a simple model developed.Experimental results are presented
and the essential system parameters are discussed.The optimisation of the heat evacuation and
the consequent improvement in the current carrying capability of the semiconductor pellet is
emphasised.The relative advantages compared with traditional air-cooled systems are
illustrated with particular reference to practical high power traction systems.

Référneces : 8 refs.

Accession_Number : 1985(9):129914

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