Revue : [REVUE341]

Titre : Elsevier Science, Microelectronics Reliability, Volume 42, Issue 6, Pages 805-993, June 2002.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 42
Issue : 6
Pages : 805 - 993
Date : June 2002

[1] : Special Section on Reliability of Passive Components, Page 805
Wolfgang Wondrak
Lien : private/Revue341b.pdf - | Article | Journal Format-PDF (24 K)

[2] : Reliability of thin-film resistors: impact of third harmonic screenings, Pages 807-813
Reiner W. Kuehl
Lien : vide.pdf - | Article | Journal Format-PDF (395 K)

[3] : Highly accelerated lifetesting of base-metal-electrode ceramic chip capacitors, Pages 815-820
Jonathan L. Paulsen and Erik K. Reed
Lien : vide.pdf - | Article | Journal Format-PDF (507 K)

[4] : Impact of circuit resistance on the breakdown voltage of tantalum chip capacitors, Pages 821-827
Erik K. Reed and Jonathan L. Paulsen
Lien : vide.pdf - | Article | Journal Format-PDF (357 K)

[5] : ESR concerns in tantalum chip capacitors exposed to non-oxygen-containing environments, Pages 829-834
Jocelyn Siplon, Gary J. Ewell and Thomas Gibson
Lien : vide.pdf - | Article | Journal Format-PDF (280 K)

[6] : High temperature reliability testing of aluminum and tantalum electrolytic capacitors, Pages 835-840
A. Dehbi, W. Wondrak, Y. Ousten and Y. Danto
Lien : vide.pdf - | Article | Journal Format-PDF (225 K)

[7] : Noise and transport characterisation of tantalum capacitors, Pages 841-847
Jan Pavelka, Josef Sikula, Petr Vasina, Vlasta Sedlakova, Munecazu Tacano and Sumihisa Hashiguchi
Lien : vide.pdf - | Article | Journal Format-PDF (294 K)

[8] : Failure modes of tantalum capacitors made by different technologies, Pages 849-854
P. Vasina, T. Zednicek, J. Sikula and J. Pavelka
Lien : vide.pdf - | Article | Journal Format-PDF (898 K)

[9] : Minimizing equivalent series resistance measurement errors, Pages 855-860
Gregory L. Amorese
Lien : vide.pdf - | Article | Journal Format-PDF (550 K)

[10] : On-Chip ESD, Page 861
Markus P. J. Mergens
Lien : vide.pdf - | Article | Journal Format-PDF (30 K)

[11] : ESD protection design for CMOS RF integrated circuits using polysilicon diodes, Pages 863-872
Ming-Dou Ker and Chyh-Yih Chang
Lien : vide.pdf - | Article | Journal Format-PDF (399 K)

[12] : Modular, portable, and easily simulated ESD protection networks for advanced CMOS technologies, Pages 873-885
Cynthia A. Torres, James W. Miller, Michael Stockinger, Matthew D. Akers, Michael G. Khazhinsky and James C. Weldon
Lien : vide.pdf - | Article | Journal Format-PDF (735 K)

[13] : Development of substrate-pumped nMOS protection for a 0.13 m technology, Pages 887-899
Craig Salling, Jerry Hu, Jeff Wu, Charvaka Duvvury, Roger Cline and Rith Pok
Lien : vide.pdf - | Article | Journal Format-PDF (446 K)

[14] : Significance of the failure criterion on transmission line pulse testing, Pages 901-907
B. Keppens, V. De Heyn, M. Natarajan Iyer, V. Vassilev and G. Groeseneken
Lien : vide.pdf - | Article | Journal Format-PDF (512 K)

[15] : Correlation considerations: Real HBM to TLP and HBM testers, Pages 909-917
Jon Barth and John Richner
Lien : vide.pdf - | Article | Journal Format-PDF (291 K)

[16] : Charged device model metrology: limitations and problems, Pages 919-927
Leo G. Henry, Jon Barth, Hugh Hyatt, Tom Diep and Michael Stevens
Lien : vide.pdf - | Article | Journal Format-PDF (214 K)

[17] : A novel approach for fabricating light-emitting porous polysilicon films, Pages 929-933
P. G. Han, Hei Wong, Andy H. P. Chan and M. C. Poon
Lien : vide.pdf - | Article | Journal Format-PDF (268 K)

[18] : Modeling of the I¯V characteristics of high-field stressed MOS structures using a Fowler¯Nordheim-type tunneling expression, Pages 935-941
E. Miranda, G. Redin and A. Faigón
Lien : vide.pdf - | Article | Journal Format-PDF (310 K)

[19] : The effects of in-plane orthotropic properties in a multi-chip ball grid array assembly, Pages 943-949
Thomas D. Moore and John L. Jarvis
Lien : vide.pdf - | Article | Journal Format-PDF (201 K)

[20] : Mechanical characterization of Sn¯Ag-based lead-free solders, Pages 951-966
Masazumi Amagai, Masako Watanabe, Masaki Omiya, Kikuo Kishimoto and Toshikazu Shibuya
Lien : vide.pdf - | Article | Journal Format-PDF (1031 K)

[21] : Investigation of a constant behavior of aliasing errors in signature analysis due to the use of different ordered test-patterns in LFSR based testing techniques, Pages 967-974
Afaq Ahmad
Lien : vide.pdf - | Article | Journal Format-PDF (190 K)

[22] : Efficient test pattern generators based on specific cellular automata structures, Pages 975-983
T. Garbolino and A. Hawiczka
Lien : vide.pdf - | Article | Journal Format-PDF (307 K)

[23] : Weibull characteristics of n-MOSFET's with ultrathin gate oxides under FN stress and lifetime prediction, Pages 985-989
Fuchen Mu, Mingzhen Xu, Changhua Tan and Xiaorong Duan
Lien : vide.pdf - | Article | Journal Format-PDF (114 K)

[24] : Erratum to "The effect of image potential on electron transmission and electric current in the direct tunneling regime of ultra-thin MOS structures" [Microelectronics Reliability 2001;41:927¯931], Page 991
Lingfeng Mao, Changhua Tan and Mingzhen Xu
Lien : vide.pdf - | Article | Journal Format-PDF (30 K)

[25] : Dependability of Engineering Systems; J.M. Nahman, Springer-Verlag, Berlin, Heidelberg, New York, 2002, 192 pages, Page 993
Ninoslav Stojadinovic
Lien : vide.pdf - | Article | Journal Format-PDF (31 K)

[26] : Calendar of forthcoming events, Pages I-VI
Lien : private/Revue341.pdf - Format-PDF (33 K)

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