J. BOUSSEY, "Microsystem Technology: Fabrication, Test and Reliability MIGAS'02 (Nano et Micro Technologies", Vol. 2, N° 1, February 2002.

J. BOUSSEY, "Microsystem Technology: Fabrication, Test and Reliability MIGAS'02 (Nano et Micro Technologies", Vol. 2, N° 1, February 2002. Copyright - [Précédente] [Première page] [Suivante] - Home

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Titre : J. BOUSSEY, Microsystem Technology: Fabrication, Test and Reliability MIGAS'02 (Nano et Micro Technologies, Vol. 2, N° 1, February 2002.

Auteur : BOUSSEY Jumana

Date : 01-2003
Langue : ANGLAIS
Pages : 1 - 298
Format : 16x24
Thèmes : Structure et microstructure, Cristallographie, Circuits électriques électroniques, Circuits hyper-fréquences, Micro-électronique

Vers : Sommaire

Résumé :
Since the late nineties, MicroSystems Technologies (MST) have evolved from research subjects into relatively mature industrial applications.
The high added value provided by the embedded microsensors and/or microactuators in industrial products, e.g. airbags and inkjet printer heads, is undoubtedly a very challenging motivation for R&D actors.
Additionally, the use of integrated Microsystems reduces their unit cost, improves their reliability and multiplies their fonctionnalities.
To some extent, the use of Microsystems is believed to have become the only solution for some of today's problems (a solution that we can not yet imagine, at a scale we can not see).
But MST industry is unique, in that it encompasses various microfabrication techniques and requests multiple types of expertise, from specific design to custom packaging via a large number of collective fabrication procedures.
To address this booming topic, the 5th session of the International Summer School on Advanced Microelectronics - Grenoble (MIGAS) was held in September 2002 in Autrans (Vercors mountains, France) and was dedicated to Microsystems and Microtechnologies issues.
Its main objective was to give a state of the art course in this domain and to highlight the promising issues in this multidisciplinary topic, but also on important research subjects such as packaging, testing and reliability aspects.

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Sommaire

From Microelectronics to Microtechnologies -Robert Aigner.
Surface Micro-Machining, an Overview -Dominique Collard, Hiroyuki Fujita, Hiroshi Toshiyoshi, Bernard Legrand, Lionel Buchaillot.
Bulk Micro-Machining and MEMS Packaging -Masayoshi Esashi.
Electrostatic Micro-Actuators -Dominique Collard, Hiroyuki Fujita, Hiroshi Toshiyoshi, Bernard Legrand, Lionel Buchaillot.
The LIGA Microfabrication Technique -Wolfgang Menz, Jürgen Mohr.
A Review of Wafer Bonding -Stefan Bengtsson.
Single-Crystal Silicon Micro-Opto-Electro-Mechanical Devices -Tarik Bourouina, Philippe Hélin, Olivier Français.
Permanent Magnets for MAGMAS -Orphée Cugat.
RF MEMS for Mobile Communications Era. Present and Future -Adrian M. Ionescu.
From Microelectronics to Integrated Microsystems Testing -Salvador Mir, Benoît Charlot.
Reliability and Failure Analysis issues in MEMS -Ingrid De Wolf.
CoventorWare™ MEMS design methodology -Christian Dupiller.

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