Fiche : [LIVRE205]

Titre : S.P. MURARKA, I.V. VERNER, R.J. GUTMANN, Copper - Fundamental Mechanisms for Microelectronic Applications, Wiley Inter-science, March 2000.

Auteur : Shyam P. Murarka
Auteur : Igor V. Verner
Auteur : Ronald J. Gutmann

Stockage : Bibliothèque LMP
Fiche : LMP00-23a
Référence : 2000 - xx / LMP
Date_d'achat : 1 août 2000
Prix_HT : 1141.55 F

Lien : murarka.jpg
ISBN : 0-471-25256-5
Pages : 1 - 337
Published : Mar 2000
Copyright : 2000
Imprint : Wiley-Interscience

Informations :
A complete guide to the state of the art and future direction of copper interconnect technology

Owing to its performance advantages, copper metallization for IC interconnect is attracting tremendous interest in the
semiconductor community worldwide. This timely book provides scientists and engineers with a much-needed, comprehensive
reference on the fundamentals and applications of this emerging technology. The authors draw on more than a decade of
intimate involvement with copper interconnect research, integrating the vast amounts of available knowledge and making
clear the connection between mechanistic principles and relevant technologies. In-depth, cutting-edge discussions include :
- The effects of copper in semiconductor materials, especially silicon
- The fundamental chemistry and electro-chemistry of copper
- The effects of copper on insulating materials such as glass and polymers
- Intermetallic and interfacial reactions of copper in layered structures
- Current and projected applications of copper in integrated circuits

Copper - Fundamental Mechanisms for Microelectronic Applications also features extensive references, tables, and over 100
illustrations, including dual Damascene patterning necessary for copper interconnects. It is an excellent resource for
anyone seeking to explore the current literature and gain insight into opportunities opening in the field.

Subject : Materials Science / Electronic Materials
ISBN : 0-471-25256-5

Table_of_contents :
Overview of IC Interconnects.
Behavior of Copper Impurity Atoms.
Copper-Related Defects in Silicon.
Chemistry and Electrochemistry.
Copper in Inorganic Dielectrics.
Copper in Organic Dielectrics (Polymers).
Diffusion and Compound Formation.
Layered Structures Containing Copper.
Copper for IC Metallization.
Future Directions in Copper Technology.
Appendix.
Index.

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