ISTFA 2002 - Welcome Address

Chris Boit General Chairman of ISTFA 2002

As the general chairman, I welcome your participation in the 28th Annual International Symposium for Testing and Failure Analysis (ISTFA) conference. ISTFA has become established as the Premier Event for the worldwide Failure Analysis (FA) community. The conference, presented by the Electronic Device Failure Analysis Society (EDFAS), a society within ASM (American Society on Materials) covers a wide range of failure analysis topics in a stimulating format. For instance, the novice can leverage the expertise of lecturers through participation in a focused 2-day seminar program whereas the industry veteran prefers exposure to the latest technology innovations through the 3-day technical symposium. Furthermore, the attendee can tap the knowledge of industry experts through panel discussions, gain insight through involvement in user group meetings, or attend the largest FA equipment exposition. This year, take advantage of these opportunities by attending ISTFA 2002, November 3-7 at the Civic Plaza Convention Center in Phoenix, AZ (USA). We start the week with two days of an extensive educational seminar. The lectures offer tutorials on relevant failure analysis topics in 3 tracks: Basic techniques which provides detailed information on the core methodologies of FA, A selection of advanced techniques which are designed to prepare the attendee for additional learnings in the subsequent technical symposium, and A track with a focus on devices that bridges the gap between fundamental test results and complex analysis flows (e.g. on memory cell fails). In short, the seminar has something for everyone: technician, engineer, scientist, or manager. The symposium will feature technical presentations on a wide variety of advanced techniques and methods providing the attendee with an important venue for real-life solution based analysis and technology developments where failure analysis is key to resolving problems in product development, manufacturing and reliability applications. Our Technical Program Committee has the difficult job of selecting the most compelling and valuable papers from many submissions – another indicator that ISTFA is the leading-edge communication forum for the FA community. The symposium program is built upon three fundamental tracks: The full range of technical topics, from fault isolation of the electrical fail over sample preparation to imaging and material analysis, A focus on FA process flows on individual component to system level performance as well as on manufacturing yield enhancements to packaging issues. And special sessions covering hot topics such as optical probing, tester-driven FA or those more classical in nature: discretes, passives etc. The exposition at ISTFA is the largest trade show event of related equipment and services for the failure analysis community. This is the opportunity, in one location, to examine the very latest equipment and meet with vendors to discuss technical details and advancements. At the same time, vendors can use this communication venue to better understand the future equipment needs of the FA community. Furthermore, there are a number of additional events scheduled in conjunction with the symposium:a panel discussion, user group meetings and much more. Come and join this unique FA event – submit an abstract (by March 25th, 2002) and gain an opportunity to have your work recognized by industry peers. See you at ISTFA in November!