Contents:
  • Defect and Failure Verification, Characterization and Localization
  • De-Processing
  • Testing, Inspection, and Sample Preparation
  • ESD Damage
  • Failure-Analysis Techniques
  • Backside Analysis
  • Focused Ion-Beam Systems
  • Discrete Electronic Devices
  • Packaging
  • Military Applications Case Histories
ISTFA '98: 24th International Symposium for Testing and Failure Analysis
ASM Publication, 413 pp., 1998, ISBN: 0871706695
Proceedings, ISTFA '98 Dallas, TX, 15-19 November 1998
     This volume presents the latest information from international specialists in the testing and failure analysis of microelectronic devices. The papers included discuss new aspects of the procedures used to assure the quality of these devices that form the heart of modern control and communication equipment as well as the established practices used in this important field.
$124.00

 ISTFA '98: 24th International Symposium for Testing and Failure Analysis - $124.00 each
Add to Cart View Cart

 
© Copyright 2001 TWI Press, Inc.
Phone: 812.232.0753  -  Fax: 812.232.3978  -  E-Mail: info@engineeringbookstore.com
Address: 120 South 7th Street  -  Terre Haute, IN 47807