Proceedings of the 27th International Symposium for Testing and Failure Analysis, 11-15 November, Santa Clara, California

This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis.

The CD-ROM provides the complete content of the book in searchable Adobe Acrobat® PDF format.

Contents:
Advanced techniques * Packaging * Backside analysis * Scanning probe microscopy * Focused ion beam (FIB) techniques * Failure analysis of micro-electromechanical systems (MEMS) * Yield improvement * Discretes * Defect-based testing * Case histories

Published: 2001
Pages: Approx. 550