Session 3: Packaging and Reliability I
Monday, June 4, 15:30-16:45, 5F Main Hall
Chairperson: R. Sittig, Technical Univ., Braunschweig Inst. of Electrophysics
M. Hoshi, Nissan Motor
3.1 Noble High Thermal Conductivity, Low Thermal Expansion Cu-Cu2O Composite Base Plate Technology for Power Module Application
R. Saito, Y. Kondo, Y. Koike, K. Okamoto, T. Suzumura* and T. Abe
Hitachi and *Hitachi Cable, Japan
3.2 Flip-Chip Flex-Circuit Packaging for Power Electronics
Y. Xiao, R. Natarajan, P. Jain, J. Barrett, E.J. Rymaszewski, R.J. Gutmann and T.P. Chow
Rensselaer Polytechnic Institute, U.S.A.
3.3 Innovative Press Pack Modules for High Power IGBTs
S. Kaufmann, T. Lang and R. Chokhawala
ABB Semiconductors, Switzerland