Thursday, June 7, 15:10-16:20, 10F Room 1001-3

Chairperson: L. Lorenz, Infineon Technologies

                    T. Ogura, Toshiba

13.1   Advanced 60μm Thin 600V Punch-Through IGBT Concept for Extremely Low Forward Voltage and Low Turn-Off Loss

          T. Matsudai, H. Nozaki, S. Umekawa, M. Tanaka, M. Kobayashi, H. Hattori and A. Nakagawa

          H. Takahashi, S. Aono, E. Yoshida*, J. Moritani and S. Hine

          Mitsubishi Electric and *Ryoden Semiconductor System Engineering, Japan

13.3   A 600V 200A Low Loss High Current Density Trench IGBT for Hybrid Vehicle

          K. Hamada, T. Kushida, A. Kawahashi and M. Ishiko*