Session 10: Super Junction
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Thursday, June 7, 8:30-10:35, 10F Room 1001-3
Chairperson: G. Amaratunga, Cambridge Univ.
R.K. Malhan, DENSO
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10.1 Breaking the Silicon Limit Using Semi-Insulating Resurf Layers
R. van Dalen, C. Rochefort and G.A.M. Hurkx
Philips Res. Labs., The Netherlands
10.2 Lateral Unbalanced Super Junction (USJ) for High Breakdown Voltages in SOI Technology
R. Ng, F. Udrea, K. Sheng, K. Ueno*, G.A.J. Amaratunga and M. Nishiura*
Univ. of Cambridge, U.K. and *Fuji Electric R&D, Japan
10.3 A New 800V Lateral MOSFET with Dual Conduction Paths
D.R. Disney, A.K. Paul, M. Darwish, R. Basecki and V. Rumennik
Power Integrations, U.S.A.
10.4 Implementation of High-Side, High Voltage RESURF LDMOS in a Sub-Half Micro Smart Power Technology
R. Zhu, V. Parthasarathy, V. Khemka, A. Bose and T. Roggenbauer
Motorola, U.S.A.
10.5 Lateral Smart-Discrete Process and Devices Based on Thin-Layer Silicon-on-Insulator
T. Letavic, J. Petruzzello, M. Simpson, J. Curcio, S. Mukherjee, J. Davidson*, S. Peake*, C. Rogers*, P. Rutter*, M. Warwick* and R. Grover*
Philips Research USA, U.S.A. and *Philips Semiconductors, U.K.