The Equipment Demonstration program of the IRPS focuses on providing attendees with an opportunity to learn about reliability software and equipment in a confidential, "hands-on" fashion. Unlike typical trade events, sales pressures are minimized, and manufacturers are prepared to help attendees learn about, and test their latest equipment and software developments. Attendees are strongly encouraged to contact the demonstrators prior to the conference, and to make arrangements to bring their own samples, if desired. The following abstracts provide an overview of the nature of each company's demonstration, along with contact information. The www.irps.org web site will contain the latest information as more demonstrators are added to the program.
Demonstrators and other companies providing a variety of reliability physics products and services are also represented in the coffee break area. There, they will provide information on their products and sign-up sheets for demonstrations. You can sign-up for demonstrations at any time during the conference. This service is included in your registration and you can sign-up for as many demonstrations as you like, on a first-come, first-serve basis. So there is really no better way to evaluate so many state-of-the-art systems, and to collect so much information on services, latest equipment, and software developments …than to participate in the IRPS Demos!
Hours for equipment demonstrations are as follows:
There will be a hosted Equipment Demonstration Program Reception for all attendees in the demonstration area located in the exhibit hall from 5:30 p.m _ 7:00 p.m. on Monday, April 30.
Demo#1: COPPER AND ALUMINUM RELIABILITY TEST SYSTEMS FOR PACKAGE LEVEL AND CONVENTIONAL WAFER LEVEL TESTING—Aetruim, Inc., John Pollock, jpollock@aetrium.com; Tel: 651-704-1800; www.aetrium.com www.aetrium.com
Demo#2: COMPLETE PREDICTIVE WAFER LEVEL RELIABILITY SOLUTIONS—Agilent Technologies (A subsidiary of HP), Jay Thomas; jay-thomas@agilent.com, Tel: 408-553-2212; www.agilent.com
Demo#3: EMISSION MICROSCOPE SYSTEMS FOR BOTH FRONT AND BACKSIDE IMAGING—Alpha Innotech, Tracy Mettier; tmettier@aicemail.com Tel: 510-483-9620; www.alphainnotech.com
Demo#4: ESD TEST EQUIPMENT—Barth Electronics, Jon Barth; jonbarth@aol.com; Tel: 702-293-1576; www.barthelectronics.com
Demo#5: MATERIAL AND DEVICE CHARACTERIZATION ON THE NANOMETER SCALE—Digital Instruments, Veeco Metrology Group, Marlene Carlyle; marlene@di.com; Tel: 805-967-1400; www.di.com.
Demo#6: IR LASER BASED EMISSION AND CURRENT/VOLTAGE IMAGING MICROSCOPES—Hamamatsu Photonic Systems, Mary Boyle, Tel: 908-231-1116; www.hps-industrial.com
Demo#7: MERCAD TELLURIDE SENSOR WITH UP TO 100X GREATER DETECTION SENSITIVITY—Hypervision Inc., Dan Hurley; dhurley@hypervisioninc.com; Tel: 510-651-7768; www.hypervisioninc.com
Demo#8: PROBING SOLUTIONS FOR EMISSION MICROSCOPY AND LOW CURRENT/LOW NOISE TEMPERATURE TESTING—Karl Suss America, Inc., Veronica Miller; vmiller@suss.com; Tel: 802244-5181 x333; www.suss.com
Demo#9: MEASUREMENT TECHNIQUES FOR EXTRACTING LOW-LEVEL PARASITIC INTERCONNECT PARAMETERS—Keithley Instruments, Bill Merkel, bmerkel@keithley.com; Tel: 440-248-0400; www.keithley.com
Demo#10: FULL SCALE SCHEMATIC TOOLS PACKAGE FOR FA—Knights Technology, Scott Shen, sshen@knights.com; Tel: 4085283880; www.electroglas.com
Demo#11: BURN-IN TEST SOLUTIONS FOR HIGH-POWER DEVICES—Micro Control Company, Lisa Ott Ray, l.ottray@microcontrol.com; Tel: 612-277-9211; www.microcontrol.com
Demo#12: TEST SYSTEMS FOR ELECTROMIGRATION AND TDDB—Micro Instruments Co., Curt Haas: chaas@compuserve.com; Tel: 760-746-2010; www.microinstrument.com
Demo#13: ACCURATE AND RELIABLE DE-CAP RESULTS—NSC/SESA Inc., Suree Marley, skm@sesa.com; Tel: 408-988-5816; www.sesa.com
Demo#14: TURN-KEY SEMICONDUCTOR RELIABILITY TEST—QualiTau, Tom Bensing 408-522-9200 x102: Tom Bensing, tomb@mail.qualitau.com; www.qualitau.com
Demo#15: THERMAL EMISSION AND PHOTO EMISSION MICROSCOPE TECHNOLOGY—Quantum Focus Instruments Corporation, Sarah Rogalewski, sarah@quantumfocus.com; Tel: 508-896-0049; www.quantumfocus.com
Demo#16: WAVEFORM MEASUREMENT RESULTS OBTAINED ON AN OPTICAL PROBING SYSTEM—Schlumberger, Eryn Neidle, eneidle@san-jose.tt.slb.com; Tel: 408-586-6872; www.slb.com
Demo#17: ADVANCED SEM SAMPLE PREPARATION SYSTEM—SELA USA, Inc., Elizabeth Kieu, elizabeth@sela.com; Tel: 4087363700; www.sela.com
Demo#18: PHOTON EMISSION MICROSCOPY, DIGITAL IMAGING AND CATHODOLUMINESCENCE—Semicaps, Inc., Harkiran San Dhu, harkiran@semicaps.com; Tel: 408-986-0121; www.semicaps.com
Demo#19: NEW SCANNING MICROSCOPY FEATURES IMPROVE SYSTEM THROUGHPUT AND EASE OF USE—Sonix, Inc., Jamie Breneman, info@sonix.com; Tel: 703-440-0222; www.sonix.com
Demo#20: NEW VISUAL ACOUSTICS™ OPERATING SOFTWARE BASED ON TRUE WINDOWS NT OPERATING SYSTEM; Sonoscan, Inc., Brandi Apostolos; bapostolos@sonoscan.com; Tel: 8474376400 x237; www.sonoscan.com
Demo#21: CONTACT PROBING SOLUTION FOR IMAGING AND PROBING SUB-0.2 µm GEOMETRIES ON FULL WAFERS—The Micromanipulator Co., Karen Schanhals; kschanhals@micromanipulator.com; Tel: 775-882-2400; www.micromanipulator.com
Demo#22: AUTOMATIC ESD AND LATCHUP TESTERS—Thermo KeyTek, Kim Baltier; kbaltier@keytek.com; Tel: 978-275-0800; www.keytek.com
Demo#23: TRANSMISSION LINE PULSE (TLP) SYSTEMS—Oryx Instruments Corp. Michelle Coleman; mcoleman@oryxinstruments.com; Tel: 510-249-6320; www.oryxinstruments.com
DEMONSTRATORS ABSTRACTS(as of January 24)
Demo #1: COPPER AND ALUMINUM RELIABILITY TEST SYSTEMS FOR PACKAGE LEVEL AND CONVENTIONAL WAFER LEVEL TESTING;Aetruim, Inc., John Pollock, jpollock@aetrium.com; Tel: 651-704-1800; www.aetrium.com
Aetrium is a leading supplier with the broadest offering of test handlers, burn-in board loaders, automation modules and other proprietary wafer or package level reliability test equipment used by
the global microelectronics industry to assemble, inspect and test integrated circuits, discrete components and other electronic components.
For a complete listing of offices and description of products visit our website www.aetrium.com.
Demo #2:
COMPLETE PREDICTIVE WAFER LEVEL RELIABILITY SOLUTIONS—Agilent Technologies (A subsidiary of HP),
Jay Thomas; jay-thomas@agilent.com, Tel: 408-553-2212;
www.agilent.com
Agilent's fast and predictive PDG-WLR is available on the full line of Agilent parametric testers including the NEW ultra-low noise Agilent 4073A Test System. Its 1fA current resolution and as much as 30 times decreased low-current measurement time enable
critical reliability measurements for DRAM, low-power, FLASH and other technologies. The complete PDQ-WLR solution is NOW the choice of major foundries and their customers for developing, qualifying and monitoring their process reliability, and includes a NEW
PC-based analysis tool and NEW production-based test software. To ensure ultra-thin oxide thickness and other critical parameters, Agilent introduces NEW 4156C Precision Semiconductor Parameter Analyzer, with revolutionary C-V capabilities.
Demo #3:
EMISSION MICROSCOPE SYSTEMS FOR BOTH
FRONT AND BACKSIDE IMAGING—Alpha Innotech, Tracy
Mettier; tmettier@aicemail.com Tel: 510-483-9620;
www.alphainnotech.com
Alpha Innotech provides the world's first true Emission Microscope systems for both front and backside imaging. With a 1.3 million pixel binning camera option and patented vibration coupling technology for high magnification imaging on a test head, analytical probestation or benchtop.
Demo #4: ESD TEST EQUIPMENT—Barth Electronics, Jon Barth; jonbarth@aol.com; Tel: 702-293-1576;
www.barthelectronics.com
The new TLP pulse curve tracer test system is an electrical analysis tool to clearly pinpoint the onset of ESD failure. Demonstrations on your IC will clearly demonstrate the I-V characteristics and where damage occurs. Significantly smaller IC transistors next year
will require the analysis equipment to identify previously unmeasured electrical characteristics. Measuring and displaying the I-V characteristics and damage levels is the only method to assist designers in
rapid improvement of ESD immunity levels.
Demo #5:
MATERIAL AND DEVICE CHARACTERIZATION
ON THE NANOMETER SCALE—Digital Instruments, Veeco Metrology Group, Marlene Carlyle; marlene@di.com; Tel: 805-967-1400;
www.di.com.
Digital Instruments will demonstrate the Dimension™ 3100 scanning probe microscope (SPM) system. DI's SPM's offer a range of applications for investigators of reliability physics. These include electrical modules for: Scanning Capacitance Microscopy
(SCM), enabling unprecedented imaging resolution of electron and optical device structure & operation through 2 & 3D dopant metrology. Scanning Spreading Resistance Microscopy (SSRM) enables high sensitivity nanometer resolution mapping of resistivity in semiconductors; Tunneling AFM (TUNA) gives 2D maps of gate oxide thickness & integrity for dielectric characterization. Each of these and other techniques such as Scanning Thermal Microscopy (SThM) & Electric Force Microscopy (EFM) provide unique material and device property characterization and failure analysis on the nanometer scale, without requiring vacuum.
Demo #6:
IR LASER BASED EMISSION AND
CURRENT/VOLTAGE IMAGING MICROSCOPES—Hamatsu Photonic Systems, Mary Boyle, Tel: 908-231-1116;
www.hps-industrial.com
Hamamatsu will demonstrate our line of IR laser based emission and current/voltage imaging microscopes along with our line of customized IR optics. The µAmos IR-OBIRCH (Infrared Optical Beam Induced Resistance Change) system allows for localization of leakage current paths, line voids, high resistive vias and other defects at wavelengths of 1310 nm and/or 1064 nm. The Phemos-1000 is an IR Scanning Optical Microscope based emission microscope offering
superior resolution and sensitivity with OBIRCH, MCT and other imaging abilities.
Demo #7:
MERCAD TELLURIDE SENSOR WITH UP TO
100X GREATER DETECTION SENSITIVITY—Hypervision Inc., Dan Hurley; dhurley@hypervisioninc.com;
Tel:
510-651-7768;
www.hypervisioninc.com
Hypervision will be demonstrating the Picnic Combo
Platform (PCP). This system ties a high resolution BEAMS CCD Imager to the Picnic Mercad Telluride array offering sensitivity up to 100X over CCD systems. A virtual Imaging software package projects the design layout onto optical/emission images providing resolution <0.2 µm.
Demo #8:
PROBING SOLUTIONS FOR EMISSION
MICROSCOPY AND LOW CURRENT/LOW NOISE TEMPERATURE
TESTING—Karl Suss America, Inc., Veronica Miller, vmiller@suss.com;
Tel: 802244-5181 x333;
www.suss.com
Karl Suss is recognized around the world as a precision manufacturer of innovative probing solutions relating to emission microscopy, 300mm wafers and low current/low noise temperature testing. On display will be a SUSS PA200 Semi-Automatic Probe System and a
SUSS PM8 Manual Probe System with the SUSS MFI Atomic Force Microscope Probe - the world's first AFM that can see, contact and electrically test devices smaller than 0.15 µm. The AFM probe head supports a number of active and passive tip cartridges for
both precision DC and high speed applications.
Demo #9:
MEASUREMENT TECHNIQUES FOR
EXTRACTING LOW-LEVEL PARASITIC INTERCONNECT
PARAMETERS—Keithley Instruments, Bill Merkel,bmerkel@keithley.com; Tel: 440-248-0400;
www.keithley.com
As the industry continues to shift towards smaller dimensions, the critical speed limiting parameters in a semiconductor product shift from transistors to parasitic interconnect parameters. Extraction
of these parasitic parameters requires very low level measurements. Keithley Instruments will demonstrate the measurement techniques for extracting these low-level parameters using a Keithley 4200 desktop Semiconductor Parametric Analyzer and microprobes.
Demo #10:
FULL SCALE SCHEMATIC TOOLS PACKAGE FOR
FA—Knights Technology, Scott Shen, sshen@knights.com; Tel: 4085283880;
www.electroglas.com
Merlin's Framework, the industry standard CAD Nav
software product, will be shown with its new features, branches, and versions. Among them, a package of full-scale schematic tools is ready for
failure analysis. KEDIT and Image Overlay options are helping FA engineers. A PC version of Merlin software is available now. FA Wizard is the on-line documentation for all level of FA people, and its' Web version is available now. LogicMap is the new Fault Localization tool for the logic designs.
Demo #11:
BURN-IN TEST SOLUTIONS FOR
HIGH-POWER DEVICES—Micro Control Company, Lisa Ott
Ray, l.ottray@microcontrol.com;
Tel: 612-277-9211;
www.microcontrol.com
Micro Control Company will be demonstrating its burn-in test solutions for high-power (150-200W) VLSI devices. Our equipment provides active thermal control to each device under test, allowing heating or cooling to individual devices throughout the burn cycle.
Micro Control Company's burn-in equipment can be used for performing accelerated life testing on high-power VLSI devices. Having equipment capable of performing life testing on these high power devices will enable attendees to be more effective working with these devices.
Demo #12:
TEST SYSTEMS FOR ELECTROMIGRATION AND TDDB—Micro Instruments Co., Curt Haas: chaas@compuserve.com; Tel: 760-746-2010;
www.microinstrument.com
Micro Instrument Company will provide a hands-on
demonstration of new testing capabilities in our (NEW) SPC4000 test system for electromigration and TDDB. Our (NEW) CH4000 chamber has capability for both aluminum and copper testing with temperatures in the 70°C to 350°C Range. Coupled with our new high
resolution Instrumentation for Electromigration and TDDB, the system provides an ideal test platform. New test software allows our existing and new instrumentation to operate within the same environment. The flexibility of the DM610 software allows the user to program the voltage for Constant Voltage, SILC, I-V Sweep and Interim measurements. The DM610 instrumentation can also perform TDDB, and some Hot Carrier tests. See our upgraded PE9010A for Hot
Carrier testing, and our PE9020A for small-lot, multiple-temperature testing to 250°C.
Demo #13:
ACCURATE AND RELIABLE DE-CAP RESULTS—NSC/SESA Inc., Suree Marley,skm@sesa.com;
Tel: 408-988-5816;
www.sesa.com
The Nippon Scientific Corporation PS101 systems are distributed by SESA, Inc. These systems use nitric acid, sulfuric acid or a combination of both to ensure accurate and reliable de-cap results. Acid mix ratios are user-definable, and the temperature control is ±1°C to ensure consistent de-cap for plastic IC's. The facility requirements are 110/120V power, 60PSI nitrogen source and a fume hood. The
system weighs 77 lbs. and has dimensions of 35" W ´ 14" H ´ 15" D.
Demo #14:
TURN-KEY SEMICONDUCTOR RELIABILITY
TEST—QualiTau, Tom Bensing, 408-522-9200 x102:
Tom Bensing, tomb@mail.qualitau.com;
www.qualitau.com
QualiTau will exhibit various turn-key semiconductor reliability test solutions for performing electromigration, dielectric breakdown and hot carrier degradation testing for package and wafer level,
featuring various plug-in modules and complete analysis software. Featured systems are the MIRA, INFINITY, ACE and Multi-Probe system: In addition to the various test applications available on the MIRA, also featured will be the latest design of our High temperature DUT
boards and our new 450°C oven system. The ACE is a pulsed Electromigration system with a dedicated temperature control and a current source for every DUT. The state-of-the-art INFINITY system features
capability for package level and wafer level TDDB testing with an independent SMU for each DUT. Massively parallel wafer level testing will
be demonstrated on QualiTau's Multi-Probe system.
Demo #15:
THERMAL EMISSION AND PHOTO EMISSION
MICROSCOPE TECHNOLOGY—Quantum Focus Instruments
Corporation, Sarah Rogalewski, sarah@quantumfocus.com;
Tel: 508-896-0049;
www.quantumfocus.com
QFI will demonstrate the latest in thermal emission and photo emission microscope technology. QFI's new InfraScope III thermal imaging microscope system, capable of .05 deg. C temperature resolution, true temperature thermal mapping and 50 kHz transient capture will be demonstrated. QFI will also demonstrate the new emmi 2000, backside photo emission microscope, using near infrared HgCdTe (mercury cadmium telluride) focal plane array technology.
Demo #16:
WAVEFORM MEASUREMENT RESULTS OBTAINED ON AN OPTICAL PROBING SYSTEM—Schlumberger, Eryn Neidle, eneidle@san-jose.tt.slb.com; Tel: 408-586-6872;
www.slb.com
Schlumberger Probe Systems Group introduces the IDS PICA, the first image based timing analysis tool displaying (X, Y, Z) photo-emission movie-type of data for Flip Chips. It is the first tool in the industry that does not require any layout expertise to
perform precision timing meaasurements for design, debug and failure analysis.
The patented PICA technology captures photon emissions from switching transistors with high timing accuracy.
Demo #17:
ADVANCED SEM SAMPLE PREPARATION
SYSTEM—SELA USA, Inc., Elizabeth Kieu, elizabeth@sela.com; Tel: 4087363700;
www.sela.com
The MC500 is the only SEM sample preparation technique that does not expose your wafer to artifacts, water, chemicals or contamination, and presents no physical contact to the surface or cross sections.
The main advantages include: Cryo Cooling mechanism for ductile or organic top layers (Cu, low-k, polyamide); produces two mirror image sections that provide two chances for analysis so that you never loose or destroy a target; high accuracy (better than 0.5 µm);
automation; and speedy process (from 3 min/sample). Over 150 systems have been installed worldwide.
Demo #18:
PHOTON EMISSION MICROSCOPY, DIGITAL IMAGING AND CATHODOLUMINESCENCE—Semicaps, Inc.,
Harkiran San Dhu, harkiran@semicaps.com; Tel:
408-986-0121;
www.semicaps.com
Semicaps offers Photon Emission Microscopy for localizing defects in semiconductor devices, digital imaging systems for digitizing images from SEMs & Optical Microscopes into PC compatible file
formats, Cathodoluminescence imaging for semiconductor micro-characterization, and SEM peripherals for enhancing and expanding the capabilities of any make of SEM.
Demo #19:
NEW SCANNING MICROSCOPY FEATURES
IMPROVE SYSTEM THROUGHPUT AND EASE OF USE—Sonix, Inc., Jamie Breneman, info@sonix.com; Tel: 703-440-0222;
www.sonix.com
Sonix will demonstrate the new software and hardware features of the UHR2000 _ the Ultra High Resolution Scanning Acoustic Microscope. Sonix' patented Simultaneous Pulse-Echo and Through Transmission (PETT™) minimizes down time and provides for quick
defect detection and verification in one scan. The new DPR-500 pulser-receiver offers improved bandwidth, as well as modular architecture providing advanced user control and allowing for easy PETT scans.
New software features, based on Windows platforms, offer robust image analysis features including the ability to rotate data, produce JEDEC reports, perform auto analysis and execute advanced adhesive thickness measurements and advanced filtering techniques for
removal of periodic noise. Attendees (up to 4 per hour) are invited to bring their IC packages and see them in a different light.
Demo #20:
NEW VISUAL ACOUSTICS™ OPERATING
SOFTWARE BASED ON TRUE WINDOWS NT OPERATING
SYSTEM—Sonoscan, Inc., Brandi Apostolos; bapostolos@sonoscan.com;
Tel: 8474376400 x237;
www.sonoscan.com
Sonoscan is introducing its new series of digital C-SAM ® Acoustic Microscopes designated D24 and D9000. These systems feature faster and more accurate scanning up to the theoretical limit of the speed
of sound. Sonoscan offers a complete family of 230 MHz
transducers (currently 6 different designs) that are optimized for applications such as the inspection of CSPs, etc. For production speed analysis, take
a look at our FACTS2™, Fast Automated C-SAM Tray Scanner System. Services also include testing laboratories and an array of educational courses on improving device reliability using Acoustic Micro
Imaging technologies.
Demo #21:
CONTACT PROBING SOLUTION FOR IMAGING
AND PROBING SUB-0.2 µm GEOMETRIES ON FULL
WAFERS—The Micromanipulator Co., Karen
Schanhals; kschanhals@micromanipulator.com; Tel: 775-882-2400;
www.micromanipulator.com
An integrated system solution will be presented
featuring Micromanipulator's 300 mm 9920 semi-automatic analytical test station with NetProbe™ (the next generation in navigation control software). Workshop attendees may select their preferred semiconductor test equipment or combine it with Micromanipulator's
9920 station and probe at resolutions up to 0.05 microns. Then see how easy it is to transfer the position data to tabular and graphical analysis programs for future review. Learn how to probe at very low femtoamp levels (less than 10 fA range) and at elevated temperatures using triaxial probes, triaxial chucks, integrated shielding and unique high-stability probes. New and experienced users will appreciate
the practical solutions presented at Micromanipulator's workshop resolving incorrect test setups and common errors which can introduce unwanted leakage and electrical and/or physical noise. Additionally, work with UV laser light for high resolution passivation removal and visible light for conductor separation on ICs for failure analysis and fault isolation. See the only available contact probing solution for imaging and probing sub-0.2 µm geometries on full wafers.
Demo #22:
AUTOMATIC ESD AND LATCHUP TESTERS—Thermo KeyTek, Kim Baltier; kbaltier@keytek.com; Tel:
978-275-0800;
www.keytek.com
Thermo KeyTek will demonstrate two testers: (1) The NEW ZapMaster Mk.2, an advanced ESD and latchup system for testing devices up to 768 pins; and (2) RCDM, a Robotic CDM ESD test system. Attendees may also operate the equipment themselves, and time permitting, perform ESD tests on one or two of their own devices. (Prior arrangements should be made to ensure appropriate DUT
boards are available.)
Demo #23:
TRANSMISSION LINE PULSE (TLP) SYSTEMS#151;Oryx Instruments Corp.
Michelle Coleman;
mcoleman@oryxinstruments.com; Tel:
510-249-6320;
www.oryxinstruments.com
Oryx Instruments will be demonstrating it's new line of Transmission Line Pulse (TLP) Systems, incorporating integrated leakage and bias capabilities for complete characterization. Oryx is a leading manufacturer of semiconductor reliability test equipment, offering solutions from low pin count manual to 2016 pin fully automatic systems supporting both package and wafer level testing. Based in the heart of Silicon Valley, Oryx has worldwide sales and service support through a network of manufacturer's representatives and distributors.
• Accurel Systems
• B&G International
• BTA Technology
• Electronic Device Failure • Insight Analytical
• NEOCERA, Inc.
• Reedholm
• Sagitta
• Sandia National Labs
• ULTRA TEC
• Viko Test Lab _ ADEC
ADDITIONAL COFFEE BREAK SPONSORS
Analysis Society (ASM)