March 22 - 25 1999 Town and Country Hotel San Diego, California
CALL FOR PAPERS
The International Reliability Physics Symposium deals with physical mechanisms that reduce the reliability or performance of integrated circuits and microelectronic devices in their use environment. The conference is a forum for presenting original work that:
(a) Identifies new microelectronic failure or degradation mechanisms,
(b) Improves understanding of existing failure mechanisms,
(c)
Demonstrates new or innovative analytical techniques, or
(d)
Demonstrates ways to build in reliability.
The conference aims to stimulate progress in the following broad areas:
FAILURE ANALYSIS
YIELD ENHANCEMENT EFFECTS ON RELIABILITY
INTERCONNECT
DEVICE DIELECTRICS
PROCESS INDUCED DAMAGE
CHANNEL HOT CARRIERS
ESD AND LATCH-UP
ASSEMBLY AND PACKAGING
NON-SILICON DEVICE RELIABILITY
DEVICE AND PROCESS
MICRO-ELECTRO MECHANICAL SYSTEMS (MEMS)
SUBMISSION DEADLINE: September 11, 1998
Abstract Preparation: Paper acceptance is based entirely on abstract submissions. Your work must be original and unpublished. Abstracts are a maximum of two pages long, and should clearly and concisely state the specific results of your work, why it is important, and how it relates to prior work. The abstract may include line drawings, key references and photographs as necessary, within the two page limit. Additionally, we require a 50-word summary of your work and a cover page indicating the category of submission from the above listing, as well as each authors affiliation, address, phone and FAX numbers and e-mail address.
Abstract Submission: Submissions may be made either by post, express mail, or electronically. All submissions will be acknowledged within three weeks of receipt. If you do not receive acknowledgment of your submission, please contact the Technical Program Chair.
Post or Express Mail: We need 20 copies of both your 50-word summary and 2-page abstract.
Mail to:
ELECTRONIC SUBMISSION: Abstracts will be accepted in electronic format. There are some restrictions on the file formats we accept. Please consult the following Web page for details of our electronic submission process, http://www.irps.org
PAPER SELECTION: Papers received by the September 11 deadline are reviewed by subcommittees representing the major sessions of the conference. The members of these groups are chosen from industry, government, and university organizations who have a broad spectrum of reliability experience and specific expertise in the areas of review. Papers are selected on their technical merits and relevance to the field of Reliability Physics. Some common causes of rejection are incomplete data, prior publication, or lack of novelty.
LATE PAPERS: A limited number of excellent late papers reflecting important breakthrough developments can be considered on a space-available basis. Abstract and summary must be received no later than November 22, 1998 to be considered. Late papers must still meet the publication deadline stated below.
PROCEEDINGS MANUSCRIPT: Final, camera-ready manuscripts must be received by January 25, 1999 so that the proceedings can be available at the Symposium.
SPONSORS: The Electron Devices Society and the Reliability Society of The Institute of Electrical and Electronic Engineers, Inc. are the sponsors of the 1999 Symposium.
For general conference information, http://www.irps.org/ or contact:
USA
Alan G. Street
General Chair, 1998 IRPS
Integrated
Reliability
10225 Barnes Canyon Road
Suite A-100
San Diego, CA
92121
USA
Tel. (619)-658-9770
FAX (619)-550-9445
e-mail: mialto:alan@irsi.com
For Registration and Mailings
IRPS Publishing Services
P.O. Box 308
Westmoreland, NY
13490
USA
Tel. (315) 339-3971
FAX (315) 336-9134
e-mail: mialto:103227.207@compuserve.com
Asia
Prof. Daniel S.H. Chan
IRPS Publicity Committee
Dept. of Electrical
Engineering
National University of Singapore
10 Kent Ridge
Crest
Singapore 119260
Tel (65) 772-6509
FAX (65)
779-1103
e-mail: elecshd@nus.edu.sg
Europe
Mauro Ciappa
IRPS Publicity Committee
Swiss Federal Institute of
Technology
Integrated Systems Laboratory
ETH-Zentrum
CH-8092
Zurich, Switzerland
Tel. (41) 1-632-2436
FAX (41) 1-632-1194
e-mail: Ciappa@iis.ee.ethz.ch
Dr. Wolfgang Gerling
IRPS Publicity Committee
Siemens AG
P.O.
Box 801709
D-81617 Munich
Germany
Tel. (49) 89 636 22825
FAX
(49) 89 636 22828
e-mail:
WOLFGANG.GERLING@hl.siemens.de